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Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 7432592 | Integrated micro-channels for 3D through silicon architectures Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. ... | 10/07/2008 |
| 7411290 | Integrated circuit chip and method for cooling an integrated circuit chip An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the su... | 08/12/2008 |
| 7388285 | Hermetically sealed package for optical, electronic, opto-electronic and other devices Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate... | 06/17/2008 |
| 7355277 | Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package A die package and a method and apparatus for integrating an electro-osmotic pump and a microchannel cooling assembly into a die package. ... | 04/08/2008 |
| 7348665 | Liquid metal thermal interface for an integrated circuit device A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in ... | 03/25/2008 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are s... | 03/11/2008 |
| 7335983 | Carbon nanotube micro-chimney and thermo siphon die-level cooling A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die. ... | 02/26/2008 |
| 7335984 | Microfluidics chips and methods of using same Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the in... | 02/26/2008 |
| 7336487 | Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant Embodiments of a cold plate and a manifold plate are disclosed. The cold plate may be coupled with an integrated circuit die, and the cold plate may also include a flow path to receive a liquid coolant. Coolant moving through the flow path can remove heat generated ... | 02/26/2008 |
| 7309453 | Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same A coolant capable of enhancing corrosion inhibition includes a potassium formate solution having a first concentration of a polyphosphate salt and a second concentration of dicyandiamide. In one embodiment, such a coolant may provide corrosion inhibition that is esp... | 12/18/2007 |
| 7304380 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 12/04/2007 |
| 7295436 | Cooling system for computer components A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it lea... | 11/13/2007 |
| 7274106 | Packaged electroosmotic pumps using porous frits for cooling integrated circuits An integrated electroosmotic pump may be incorporated in the same integrated circuit package with a re-combiner, and an integrated circuit chip to be cooled by fluid pumped by the electroosmotic pump. ... | 09/25/2007 |
| 7230315 | Integrated chemical microreactor with large area channels and manufacturing process thereof The microreactor has a body of semiconductor material; a large area buried channel extending in the body and having walls; a coating layer of insulating material coating the walls of the channel; a diaphragm extending on top of the body and upwardly closing the chan... | 06/12/2007 |
| 7218000 | Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also ... | 05/15/2007 |
| 7205653 | Fluid cooled encapsulated microelectronic package An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor ch... | 04/17/2007 |
| 7105382 | Self-aligned electrodes contained within the trenches of an electroosmotic pump A device where the electrodes of an electroosmotic pump are located directly in the flow-producing region of the electroosmotic pump is described as well as methods of forming such a device. Placing the electrodes of an electroosmotic pump directly in the flow-produ... | 09/12/2006 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 7078803 | Integrated circuit heat dissipation system An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attac... | 07/18/2006 |
| 7071553 | Package structure compatible with cooling system The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electri... | 07/04/2006 |
| 7026191 | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same A stereolithographically fabricated heat sink includes a heat transfer element cofigured to be disposed proximate a semiconductor device so as to absorb heat from the semiconductor device during use thereof. The heat sink also has a heat dissipation element that is ... | 04/11/2006 |
| 6702002 | Hydronic pump type heat radiator The present invention provides a hydronic pump type heat radiator, which comprises an outer ring heat spreader, a plurality of outer heat-radiating fins, a plurality of inner heat-radiating fins, a cavity, and a pump. The outer ring heat spreader has an a... | 03/09/2004 |
| 6688381 | Multiscale transport apparatus and methods Thermal management devices and methods include branching networks comprising flow channels of varying cross-sectional area. The branching networks can be fractal-like in nature with an increase in the total flow area following a flow channel bifurcation. ... | 02/10/2004 |
| 6679315 | Small scale chip cooler assembly A microscale chip cooling system for a heat dissipating item, such as Intel's Pentium brand microprocessor. The system includes a 40 millimeter by 40 millimeter thermally insulated housing including a base and a cover. The system also includes a thermally... | 01/20/2004 |
| 6679081 | Pumped liquid cooling system using a phase change refrigerant An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evapo... | 01/20/2004 |
| 6677673 | Clamping assembly for high-voltage solid state devices A clamping assembly for use in conjunction with high voltage solid state devices. The clamping assembly includes a clamp frame having upper and lower clamping plates substantially composed of aluminum and joined together by four dielectric rods composed o... | 01/13/2004 |
| 6675875 | Multi-layered micro-channel heat sink, devices and systems incorporating same The present invention includes multi-layer micro-channeled heat sinks, multi-layer micro-channeled heat sink devices, and multi-layer micro-channeled heat sink systems. The invention also includes machines or electronic devices using these aspects of the ... | 01/13/2004 |
| 6674164 | System for uniformly interconnecting and cooling A means is discussed for electrically interconnecting, cooling and mechanically supporting a multiplicity of heat producing electronic and/or electrical components which is amenable to automated assembly. A structure is identified which consists of one or... | 01/06/2004 |
| 6668911 | Pump system for use in a heat exchange application In general, the invention relates to a pump system for use in a heat exchange application having a pump chamber with a fluid inlet and a fluid outlet. A rotating device is contained within the pump chamber, for causing a fluid to move across a surface to ... | 12/30/2003 |
| 6668912 | Heat exchanger cast in metal matrix composite and method of making the same The specification and drawings describe and show an embodiment of and method of forming a liquid flow through heat exchanger structure cast in a metal matrix composite. The composite comprises a preform reinforcement material infiltrated with molten metal... | 12/30/2003 |
| 6670699 | Semiconductor device packaging structure A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed with... | 12/30/2003 |
| 6670687 | Semiconductor device having silicon carbide layer of predetermined conductivity type and module device having the same A semiconductor device having a silicon carbide layer of a singular conductivity type. The silicon carbide layer includes a surface having a first region, a second region, and a third region sandwiched between the first region and the second region. An an... | 12/30/2003 |
| 6665186 | Liquid metal thermal interface for an electronic module A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a ... | 12/16/2003 |
| 6665180 | System for cooling a component in a computer system A system for cooling a component in a computer system is disclosed. The cooling system of the present invention comprises a heat collection chamber including an inlet opening and an outlet opening, wherein the inlet opening is located in a position vertic... | 12/16/2003 |
| 6665184 | Tapered cold plate Cold plates, permanently plumbed into card cage, cool circuit boards that are equipped with personality plates to improve thermal transfer. The personality plates have a contoured surface that is the complement of the circuit board's landscape. The person... | 12/16/2003 |
| 6664627 | Water cooling type cooling block for semiconductor chip Provided is a water cooling type cooling block for a, semiconductor chip which can increase heat transfer efficiency by inducing turbulent flow even if a coolant flows at low speed. The cooling block includes a heat transfer plate contacting the semicondu... | 12/16/2003 |
| 6658861 | Cooling of high power density devices by electrically conducting fluids A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device... | 12/09/2003 |
| 6661658 | Fluid-cooled heat sink for electronic components A fluid-cooled heat sink for electronic components includes a first metal plate designed to be positioned in contact with at least one electronic component and a second plate having a first face and a second face. The first face of the second plate is joi... | 12/09/2003 |
| 6658736 | Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent A heat exchanger, for regulating the temperature of multiple integrated circuit modules, is fabricated by constructing a face on a hollow jacket such that the face consists essentially of a malleable metal with a coating of a release agent. In one embodim... | 12/09/2003 |
| 6655449 | Heat dissipation device by liquid cooling A heat dissipation device by liquid cooling includes a casing, which has a spacing wall to form a channel therein. The casing has sidewalls and the inner surfaces of the sidewalls and the surface of the spacing wall are provided with a plurality of first ... | 12/02/2003 |
