Did You Know...
...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Number | Title | Issue Date |
| 7391100 | Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die... | 06/24/2008 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler i... | 04/01/2008 |
| 7348665 | Liquid metal thermal interface for an integrated circuit device A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in ... | 03/25/2008 |
| 7335983 | Carbon nanotube micro-chimney and thermo siphon die-level cooling A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die. ... | 02/26/2008 |
| 7285851 | Liquid immersion cooled multichip module In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with ... | 10/23/2007 |
| 7250674 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 07/31/2007 |
| 7218000 | Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also ... | 05/15/2007 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 6213195 | Modular coolant manifold for use with power electronics devices having integrated coolers A modular coolant manifold for use with a power electronics device having a heat sink is disclosed. The modular coolant manifold comprises a base unit having an inlet side, an outlet side, and a pair of interconnecting sidewalls. A portion of the base uni... | 04/10/2001 |
