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| Number | Title | Issue Date |
| 6698224 | Electronic apparatus having at least two electronic parts operating at different temperatures An electronic apparatus includes a thermally insulated vessel having a cooling part therein. Disposed inside the thermally insulated vessel are a first electronic part and a second electronic part. The second electronic part is spaced apart from the cooli... | 03/02/2004 |
| 6675600 | Thermal mismatch compensation technique for integrated circuit assemblies Techniques for minimizing stress induced by temperature changes in an integrated circuit (e.g., focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. ... | 01/13/2004 |
| 6621071 | Microelectronic system with integral cryocooler, and its fabrication and use A microelectronic system includes a substrate that is preferably silicon and a microelectronic device supported on the substrate. The microelectronic device may be a light sensor that include a readout integrated circuit formed in the silicon substrate, a... | 09/16/2003 |
| 6584332 | Electronic equipment An electronic equipment includes one or more electronic devices, a cold stage, and a cold insulation member. The one or more electronic devices perform a predetermined operation within a predetermined temperature range. The cold stage cools down the one o... | 06/24/2003 |
| 6233959 | Dehumidified cooling assembly for IC chip modules A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.... | 05/22/2001 |
| 6233960 | Spot cooling evaporator cooling system for integrated circuit chip modules A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.... | 05/22/2001 |
| 6184757 | Cryogenic electronic assembly A number of electronic modules 82, 82', 83, 83' are mounted on a cold finger 100 disposed within a sealed housing 104, 110, the interior 210 of which is evacuated. To minimize heat transfer by conduction, gaps are provided in the dielectric substrates car... | 02/06/2001 |
| 6166317 | Cryogenic thermoelectric generator A cryogenic thermoelectric generator preferably includes a thermoelectric transducer and a cold source (i.e., anything having a below-ambient temperature) thermally coupled to the "cold side" of the transducer. The cold source preferably includes a vessel... | 12/26/2000 |
| 6023934 | Methods and apparatus for cooling systems for cryogenic power conversion electronics Methods and apparatus for cooling systems for cryogenic power conversion electronics are provided. The invention includes systems having electronic power conversion apparatus comprising at least one cryogenically operated semiconductor switch and at least... | 02/15/2000 |
| 5977479 | Structure for coupling between low temperature circuitry and room temperature circuitry There is disclosed a structure for coupling between a low temperature circuitry cooled by a cooling system and a room temperature circuitry wherein the structure contains a device for electric connection and a second cooling system specifically for coolin... | 11/02/1999 |
| 5950444 | Electronic apparatus Since, due to heat flowing from the outside through central conductors of cables or connectors into an electronic circuit that is operated in a state of being cooled to a low temperature, a temperature distribution or local temperature rising occurs in th... | 09/14/1999 |
| 5806318 | Cooling using a cryogenic liquid and a contacting gas A cooling apparatus includes a dewar and a quantity of liquid nitrogen within the container. Gaseous helium is contacted to the liquid nitrogen, either by contacting its top surface or by being bubbled through the liquid nitrogen. The temperature of the c... | 09/15/1998 |
| 5780314 | Method of forming a high performance low thermal loss bi-temperature superconductive device A superconductive electrical device is operable simultaneously at relatively higher temperatures, i.e., 60-90K, and at relatively lower temperatures, i.e., less than 12K. The device comprises a non-superconductive substrate with two regions, a first relat... | 07/14/1998 |
| 5773875 | High performance, low thermal loss, bi-temperature superconductive device A superconductive electrical device is operable simultaneously at relatively higher temperatures, i.e., 60-90K, and at relatively lower temperatures, i.e., less than 12K. The device comprises a non-superconductive substrate with two regions, a first relat... | 06/30/1998 |
| 5697434 | Device having a reduced parasitic thermal load for terminating thermal conduit A device for receiving thermal conduit comprising a thermally conductive material for coupling between an end of a conducting element of the thermal conduit and an end of an outer shell of the thermal conduit. The thermally conductive material is arranged... | 12/16/1997 |
| 5598711 | Fluid deflection method using a skirt A method for deflecting a fluid supply using a skirt. The skirt comprising a remote and a close portion (with respect to distance from a fluid impinged surface). The skirt is located in close proximity to a surface to be impinged by the fluid. The deflect... | 02/04/1997 |
| 5561984 | Application of micromechanical machining to cooling of integrated circuits A thermodynamic engine comprises first and second heat exchange members and a solid state thermodynamic member therebetween. At least one of the heat exchange members is formed by use of micromechanical machining.... | 10/08/1996 |
| 5543662 | Low heat loss and secure chip carrier for cryogenic cooling An integrated circuit package is disclosed. The integrated circuit package includes a substrate having a cavity formed therein for enclosing an integrated circuit. The integrated circuit package also includes a carrier for holding the integrated circuit. ... | 08/06/1996 |
| 5536685 | Low heat loss and secure chip carrier for cryogenic cooling An integrated circuit package is disclosed. The integrated circuit package includes a substrate having a cavity formed therein for enclosing an integrated circuit. The integrated circuit package also includes a carrier for holding the integrated circuit. ... | 07/16/1996 |
| 5471844 | High dissipation packaging for cryogenic integrated circuits A packaging apparatus used to store semiconductor devices with a coolant without contaminating the semiconductor devices. The apparatus has an enclosure which is evacuated at room temperature and then cooled in an atmosphere of coolant gas until the gas c... | 12/05/1995 |
| 5463872 | High performance thermal interface for low temperature electronic modules A device and method for cryogenic cooling of electronic components. A mixture of a first non-condensible gas and a second condensible gas is provided within an insulative housing. The non-condensible gas mixture has a partial pressure equal to the desired... | 11/07/1995 |
| 5349823 | Integrated refrigerated computer module The present invention is an integrated computer module that has a chip carrier assembly attached to a cryogenic cooler. The carrier assembly includes a multichip that has a CPU comprising a plurality of high speed chips. The carrier also has a plurality o... | 09/27/1994 |
| 5310440 | Convection transfer system A system provides for convective transferring of material between a workpiece and a flowing fluid which chemically reacts with the workpiece. A gap is formed between the workpiece and a facesheet. The fluid is fed to supply nozzles, travels a short distan... | 05/10/1994 |
| 5296710 | Infrared radiation detector An infrared radiation detector so adapted as to prevent the image signals from deteriorating due to the short length of leads extending within the cryogenic container with the infrared radiation sensing element accommodated within and to correspond to the... | 03/22/1994 |
| 5265670 | Convection transfer system A system provides convective transfer from a workpiece to a flowing fluid. A gap is formed between the workpiece and a facesheet containing fluid supply nozzles and fluid return nozzles. The fluid is fed to the supply nozzles, travels a short distance wit... | 11/30/1993 |
| 5212626 | Electronic packaging and cooling system using superconductors for power distribution A board containing plural superconducting power planes, one for each required potential level, is used to distribute power to one or more semiconductor logic chips which, together with the board, are immersed in liquid nitrogen. Each chip is coupled therm... | 05/18/1993 |
| 5142443 | Cryogenic cooling of circuit boards A mounting arrangement for electronic circuit chips in which at least one chip is mounted upon an appropriately electrically insulating chip plate. A connector board is mounted on top of the chip plate to electrically connect the chip with a cable allowin... | 08/25/1992 |
| 5126830 | Cryogenic semiconductor power devices A cryogenic solid-state semiconductor power device, has the actual device chip mounted on a substrate of a material of very high thermal conductivity, which is positioned in a a bath of cryogenic fluid. The substrate may be formed of beryllia, beryllium, ... | 06/30/1992 |
| 5119175 | High power density solid-state, insulating coolant module A high power density semiconductor module of reduced size and weight wherein a fusion element assembly for meeting electrical power processing requirements is nested in a hollow casing for both electrically insulating and operatively cooling by a single f... | 06/02/1992 |
| 5099311 | Microchannel heat sink assembly The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated ... | 03/24/1992 |
| 5097385 | Super-position cooling A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip.... | 03/17/1992 |
| 5061686 | Superconducting power distribution structure for integrated circuits A superconducting power distribution structure for integrated circuits characterized by a support member and a relatively thin superconducting capacitor member. Vias extending through the support member and the capacitor member couple power and ground pla... | 10/29/1991 |
| 5040053 | Cryogenically cooled integrated circuit apparatus A cryogenically cooled integrated circuit apparatus is disclosed. The apparatus includes a cryogenic vessel with an integrated circuit package positioned in an opening at one end. One face of the integrated circuit is in direct contact with cryogenic flui... | 08/13/1991 |
| 5038571 | Production and use of coolant in cryogenic devices A coolant for use in cryogenic devices of closed cycle system which comprises a mixture of a liquid nitrogen and a fluorocarbon of the formula: Cn F2n+2, wherein n is an integer of 2 to 4. The coolant, when used to cool heat generati... | 08/13/1991 |
| 5028988 | Method and apparatus for low temperature integrated circuit chip testing and operation Methods and apparatus for lowering integrated circuit (IC) chip ambient temperatures allow a slow IC chip to simulate a faster, functionally equivalent one for design testing purposes when the faster chip is not yet available. The cooling devices employed... | 07/02/1991 |
| 4995236 | Cryostatic device for a radiation detector A cryostatic device is divulged for radiation detectors, disposed at the end of a cooled finger. A case, transparent to the radiation to be detected, at least in the vicinity of the detector, forms about the finger and the detector a heat insulating enclo... | 02/26/1991 |
| 4980754 | Package for superconducting devices A package for superconducting devices, enabling signal transmission at a small propagation delay between superconducting devices provided within a heat insulating vacuum vessel, and semiconductor devices provided outside the heat insulating vacuum vessel.... | 12/25/1990 |
| 4977748 | Vacuum container for cryogenically cooled electron device packaging A vacuum package for electron devices operating at cryogenic temperatures provides a silicon-metal multilayer heatpath with lowest thermal impedance between electron device and cryogen, has a solid body for heat transfer to the external heat sink and a si... | 12/18/1990 |
| 4970868 | Apparatus for temperature control of electronic devices The superior thermal conductivity of immersion cooling combined with the service convenience of conduction cooling is provided through the use of unitary thermal transfer replaceable units positioned beneath a refrigeration source. Each unit contains elec... | 11/20/1990 |
| 4950181 | Refrigerated plug-in module A module for insulatively housing and refrigerating a semiconductor device which is designed to be plugged into a printed circuit board within a conventional air-cooled electronic system. The plug-in module is designed such that the semiconductor device w... | 08/21/1990 |
