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| Number | Title | Issue Date |
| 7443017 | Package having bond-sealed underbump A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a stand... | 10/28/2008 |
| 7419887 | Laser assisted nano deposition An apparatus and method is disclosed for forming a nano structure on a substrate with nano particles. The nano particles are deposited through a nano size pore onto the substrate. A laser beam is directed through a concentrator to focus a nano size laser beam onto t... | 09/02/2008 |
| 7285851 | Liquid immersion cooled multichip module In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with ... | 10/23/2007 |
| 7276398 | System and method for hermetically sealing a package A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic s... | 10/02/2007 |
| 7192890 | Depositing an oxide A dielectric deposited on a substrate may be exposed to a salt solution. While exposed to the salt solution, an oxide is deposited on the dielectric. ... | 03/20/2007 |
| 6524524 | Method for making a heat dissipating tube A method for making a heat dissipating tube includes the steps of preparing a copper plate, forming a cylindrical tube with a flat bottom and an open end, inserting a copper bar and copper powder into the cylindrical tube, sintering the copper powder to f... | 02/25/2003 |
| 6073683 | Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same A cooling apparatus using boiling and condensing refrigerant for cooling a heat generating unit, includes a refrigerant tank having a wall surface, for containing the refrigerant therein, a heat generating unit boiling the refrigerant in the refrigerant t... | 06/13/2000 |
| 6019167 | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments The invention relates to a passive liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments. The apparatus comprises an external shell, defining a chamber with a plurality of heat dissipating components di... | 02/01/2000 |
| 5305184 | Method and apparatus for immersion cooling or an electronic board A liquid heat sink is provided that employs natural convection of a liquid coolant (18') to cool a printed circuit board (14) on which are mounted a plurality of heat-generating components (12). In particular, the spacing d between the heat-generating com... | 04/19/1994 |
| 5270571 | Three-dimensional package for semiconductor devices A three-dimensional microelectronic package for semiconductor chips includes alternating layers of wafer interconnect stacks and chip carrier modules. The wafer interconnect stacks provide electrical interconnections in the x, y, and z directions. The waf... | 12/14/1993 |
| 5262675 | Laser diode package A semiconductor mounting package is provided which permits the active p-n junction of a light emitting semiconductor to be operated in a liquid heat transfer fluid. The package provides optical coupling for extracting light energy.... | 11/16/1993 |
| 5180001 | Heat transfer member A heat transfer member has a heat transfer unit mounted on a mounting sheet. The heat transfer unit comprises a plurality of layers of wire mesh laminated and bonded together and to the mounting sheet. The spaces between the wires of the mesh layers of th... | 01/19/1993 |
| 4741385 | Gas jet impingement means and method A means and method for cooling enhancement of microelectric devices tested at high power levels in a liquid bath by gas jet impingement, the means including a substrate means for positioning a microelectric device within a liquid cooling bath and means fo... | 05/03/1988 |
| 4668037 | Hermetic passage for an enclosure, especially a housing for semiconductors An electrical passage for an hermetic enclosure including electronic elements comprises a conducting piece (2) traversing an insulating sleeve (3) bearing on the inner surface (1) of the enclosure. A ring (7) surrounds the conducting piece (2) and a porti... | 05/26/1987 |
| 4449580 | Vertical wall elevated pressure heat dissipation system A heat dissipating system for cooling circuit chips or modules is described. The disclosed system includes circuit chips or modules which are vertically mounted, a gas at an elevated pressure being contained within an encased module for providing an enhan... | 05/22/1984 |
| 4399501 | Set of power semiconductors equipped with firing transformers and with protection circuits A set of power semiconductors equipped with firing transformers and with protection circuits. Circuitry is disposed in such a way that the connections between the thyristor (2,3), the transformers (11) and the protection circuits (9,10) are shortened. To ... | 08/16/1983 |
| 4301465 | Cover mounted multi-columnar semiconductor assembly A circuit allowing the bulk to be reduced and the maintenance of the device to be improved. It includes two end plates connected together by a welded shaft and a plurality of columns of semiconductors which can be clamped independently, one of the plates ... | 11/17/1981 |
| 4138692 | Gas encapsulated cooling module A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be c... | 02/06/1979 |
| 4080645 | Converter valve comprised of a plurality of modular elements A converter valve which is constructed from modular elements is disclosed. Each of these modular elements comprises a group of thyristors arranged in side-by-side relationship and the drive means and circuit component group associated with such thyristor ... | 03/21/1978 |
| 4077057 | Gas-insulated thyristor arrangement comprising a pressure encapsulation formed in the manner of a tank A gas-insulated thyristor arrangement with at least one thyristor column which is constructed of disk-type thyristors and is arranged, together with its associated drive and external-circuit modules, in a rotationally-symmetric shield which is fastened vi... | 02/28/1978 |
| 4075682 | Gas-insulated thyristor assembly A gas-insulated thyristor assembly is disclosed. The assembly comprises at least one thyristor column which includes disk-type thyristors which are arranged in side by side relationship. The assembly further includes drive and circuit component modules as... | 02/21/1978 |
| 3993123 | Gas encapsulated cooling module A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains e... | 11/23/1976 |
