Did You Know...
...that the Band-Aid Bandage was invented by a Johnson & Johnson employee whose wife had cut herself? Earl Dickson's wife was rather accident prone, so he set out to develop a bandage that she could apply without help. He placed a small piece of gauze in the center of a small piece of surgical tape, and what we know today as the Band Aid bandage was born!
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7339266 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads... | 03/04/2008 |
| 6695042 | Adjustable pedestal thermal interface A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-u... | 02/24/2004 |
| 6665188 | Snapping device for CPU cooler The present invention is to provide a snapping device comprising a fastening resilient strip including a main body; at least one bolt parallel to the fastening resilient strip; a contact section moveable along the shank of the bolt; and a hollow support s... | 12/16/2003 |
| 6549407 | Heat exchanger retention mechanism A heat dissipation device including a heat spreader or support structure having a first surface and a second surface with a flange extending from the heat spreader second surface. A heat exchanger is disposed within a housing and the housing is attached t... | 04/15/2003 |
| 6538308 | Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided between first radiation block and cooling block. The press-fitt... | 03/25/2003 |
| 6496375 | Cooling arrangement for high density packaging of electronic components A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provide... | 12/17/2002 |
| 6441480 | Microelectronic circuit package A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capa... | 08/27/2002 |
| 6404638 | Small gaps cooling technology The present invention provides a thermal conduction module assembly kit comprising a base being substantially planar in shape and adapted to receive on a top surface a substrate adapted to receive at least one integrated circuit having top and bottom surf... | 06/11/2002 |
| 6251709 | Method of manufacturing a cooling structure of a multichip module A cooling structure is provided for a multichip module on which integrated circuit devices (i.e., LSI devices) having heat-radiation surfaces are mounted, wherein there are provided a heat sink, thermal conduction blocks and thermal compounds. Recess port... | 06/26/2001 |
| 6214647 | Method for bonding heatsink to multiple-height chip A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having... | 04/10/2001 |
| 6046498 | Device having a heat sink for cooling an integrated circuit A cooling structure is provided for a multichip module on which integrated circuit devices (i.e., LSI devices) having heat-radiation surfaces are mounted, wherein there are provided a heat sink, thermal conduction blocks and thermal compounds. Recess port... | 04/04/2000 |
| 5999407 | Electronic module with conductively heat-sunk components A heat transfer arrangement for one or more heat-generating components (18a) on a printed-circuit board (16) includes a heat transfer plate (316) defining an aperture (416) registered with the components. A "vertically" movable heatsink adapter (410) is a... | 12/07/1999 |
| 5949647 | Heat pipe to baseplate attachment method An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is atta... | 09/07/1999 |
| 5862038 | Cooling device for mounting module A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which ... | 01/19/1999 |
| 5844311 | Multichip module with heat sink and attachment means There is disclosed a multichip module having a sealing-cooling structure which achieves a high packaging density, high sealing-connection reliability, a low manufacturing cost and a high cooling ability. A frame 15, conforming in thermal expansion coeffic... | 12/01/1998 |
| 5774334 | Low thermal resistant, fluid-cooled semiconductor module Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the s... | 06/30/1998 |
| 5751062 | Cooling device of multi-chip module A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are m... | 05/12/1998 |
| 5705850 | Semiconductor module The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of ... | 01/06/1998 |
| 5699227 | Heat pipe to baseplate attachment method An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is atta... | 12/16/1997 |
| 5615086 | Apparatus for cooling a plurality of electrical components mounted on a printed circuit board Apparatus for cooling a plurality of electrical components mounted to a circuit board includes a base plate mounted in proximate relation to component sites on the circuit board at which electrical components are mounted. The base plate includes alignment... | 03/25/1997 |
| 5595240 | Cooling apparatus of electronic devices A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clear... | 01/21/1997 |
| 5549835 | Apparatus equipped with a cooling block unit having sliding parts and a compound used to the same Disclosed are an apparatus having sliding parts and a compound for preventing diffusion or separation of a base oil; and a compound for preventing diffusion or separation of the base oil used for the apparatus: an electronic or electric appliance using a ... | 08/27/1996 |
| 5525548 | Process of fixing a heat sink to a semiconductor chip and package cap A process of manufacturing a semiconductor chip module by mounting a semiconductor chip on a substrate and contacting the chip with a heat sink. A cap is adhered to the substrate and an adhesive material is embedded in a gap between the heat sink and the ... | 06/11/1996 |
| 5525835 | Semiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor element The semiconductor chip module according to the present invention comprises a semiconductor substrate on which a wiring portion is formed, a semiconductor chip 4 mounted so as to face a circuit side up to the wiring portion, a heat sink 3, 3a, 13 with one ... | 06/11/1996 |
| 5515912 | Cooling apparatus of electronic devices A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clear... | 05/14/1996 |
| 5463528 | Cooling structure for integrated circuits A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided,... | 10/31/1995 |
| 5447750 | Heat sink method of manufacturing the same and device of manufacturing the same The heat sink is mounted on a semiconductor chip module sealed hermetically with a cap. The heat sink comprises an absorption means for absorbing the heat generated from a semiconductor chip, being inserted into an opening formed in a cap so as to make co... | 09/05/1995 |
| 5403400 | Heat sink method of manufacturing the same and device of manufacturing the same The heat sink is mounted on a semiconductor chip module sealed hermetically with a cap. The heat sink comprises an absorption means for absorbing the heat generated from a semiconductor chip, being inserted into an opening formed in a cap so as to make co... | 04/04/1995 |
| 5394299 | Topology matched conduction cooling module The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the pistons and the walls of the recesses within which the pistons... | 02/28/1995 |
| 5390076 | Cooling structure for integrated circuits A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided,... | 02/14/1995 |
| 5387815 | Semiconductor chip module The semiconductor chip module comprises a substrate on which a wiring portion is formed, a semiconductor chip mounted so as to face a circuit side down to the wiring portion, a heat sink with one end in contact with a side opposite to the circuit side of ... | 02/07/1995 |
| 5360993 | Cooling unit capable of speedily cooling an integrated circuit chip In a cooling unit for use in combination with a cooling medium supplying unit (37) and for cooling at least one integrated circuit chip (31), a heat transfer tube (47) passes a cooling medium and is supported by a hat (21) with a gap left between the tube... | 11/01/1994 |
| 5345107 | Cooling apparatus for electronic device The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact... | 09/06/1994 |
| 5339215 | Heat sink, method of manufacturing the same, and device of manufacturing the same A heat sink mounted on a semiconductor chip module sealed hermetically with a cap. The heat sink includes an absorption portion for absorbing the heat generated by a semiconductor chip. The absorption portion is inserted into an opening formed in a cap to... | 08/16/1994 |
| 5329419 | Integrated circuit package having a cooling mechanism An integrated circuit package having a cooling mechanism according to the present invention comprises a plurality of integrated chips disposed to make a matrix and coolers utilizing jet impingement of liquid coolant for cooling which are positioned corres... | 07/12/1994 |
| 5309319 | Integral cooling system for electric components An integral cooling system for cooling a plurality of electronic components, including: a cooling fluid manifold for mounting over the plurality of electronic components; a main fluid inflow duct within the manifold for supplying pumped cooling fluid; a m... | 05/03/1994 |
| 5303555 | Electronics package with improved thermal management by thermoacoustic heat pumping Electronic chips are cooled to an efficient operating temperature by engaging their exposed planar surfaces with a heat sink assembly. The heat sink assembly is a part of the cold end heat sink of a thermoacoustic heat pump that utilizes either traveling ... | 04/19/1994 |
| 5294830 | Apparatus for indirect impingement cooling of integrated circuit chips An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surfa... | 03/15/1994 |
| 5265321 | Integrated circuit structure with heat exchanger elements secured thereto and method of making An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated cir... | 11/30/1993 |
| 5264984 | Cooling system for a package with electronic circuit components A cooling system for cooling electronic circuit components mounted on a wiring substrate includes containers placed on the respective components, and nozzles each having a central through-hole and peripheral through-holes. The outer bottom surface of each... | 11/23/1993 |
