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| Number | Title | Issue Date |
| 6603662 | Computer cooling system A computer cooling system including a cooling fluid source, and a cooling duct array adapted to distribute cooling fluid from the cooling fluid source over a plurality of high dissipation components on a circuit board.... | 08/05/2003 |
| 6123145 | Synthetic jet actuators for cooling heated bodies and environments Briefly described, the present invention is concerned with cooling heated bodies and/or heated fluid with synthetic jet actuators in either open or closed systems. A first preferred embodiment of a cooling system of the present invention comprises a synth... | 09/26/2000 |
| 6064572 | Thermosyphon-powered jet-impingement cooling device A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to th... | 05/16/2000 |
| 5864466 | Thermosyphon-powered jet-impingement cooling device A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to th... | 01/26/1999 |
| 5705854 | Cooling apparatus for electronic device A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly moun... | 01/06/1998 |
| 5522452 | Liquid cooling system for LSI packages In a liquid cooling system for a printed circuit board on which integrated circuit packages are mounted, heat sinks are secured respectively to the packages in heat transfer contact therewith. Nozzles are provided in positions corresponding to the heat si... | 06/04/1996 |
| 5491363 | Low boiling point liquid coolant cooling structure for electronic circuit package A cooling structure which is used for forced cooling of an electronic circuit package such as an integrated circuit is disclosed. The cooling structure comprises a tubular fin member having many through-holes of small diameter, a flat plate member which i... | 02/13/1996 |
| 5463528 | Cooling structure for integrated circuits A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided,... | 10/31/1995 |
| 5390076 | Cooling structure for integrated circuits A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided,... | 02/14/1995 |
| 5384687 | Cooling structure for electronic circuit package A cooling structure is used for forced cooling of an electronic circuit package. The cooling structure has a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle for jetting coolant toward the bottom heat radiation plat... | 01/24/1995 |
| 5360993 | Cooling unit capable of speedily cooling an integrated circuit chip In a cooling unit for use in combination with a cooling medium supplying unit (37) and for cooling at least one integrated circuit chip (31), a heat transfer tube (47) passes a cooling medium and is supported by a hat (21) with a gap left between the tube... | 11/01/1994 |
| 5329419 | Integrated circuit package having a cooling mechanism An integrated circuit package having a cooling mechanism according to the present invention comprises a plurality of integrated chips disposed to make a matrix and coolers utilizing jet impingement of liquid coolant for cooling which are positioned corres... | 07/12/1994 |
| 5309319 | Integral cooling system for electric components An integral cooling system for cooling a plurality of electronic components, including: a cooling fluid manifold for mounting over the plurality of electronic components; a main fluid inflow duct within the manifold for supplying pumped cooling fluid; a m... | 05/03/1994 |
| 5264984 | Cooling system for a package with electronic circuit components A cooling system for cooling electronic circuit components mounted on a wiring substrate includes containers placed on the respective components, and nozzles each having a central through-hole and peripheral through-holes. The outer bottom surface of each... | 11/23/1993 |
| 5241131 | Erosion/corrosion resistant diaphragm The present invention relates generally to a new erosion/corrosion resistant diaphragm, and more particularly to an erosion/corrosion resistant diaphragm that can be used in an apparatus for cooling integrated circuit chips. An erosion/corrosion resistant... | 08/31/1993 |
| 5228502 | Cooling by use of multiple parallel convective surfaces An improved electronic cooling module having thermally optimized and fully integrated vertical water channels located between pistons. The water channels include directed jets matched to the piston localized performance and an inner tube locally attached ... | 07/20/1993 |
| 5177667 | Thermal conduction module with integral impingement cooling A thermal conduction module for cooling an array of integrated circuit chips mounted on a substrate includes a moveable piston for cooling the chips, the piston having a base, urged against an upper surface of the chips, of thermally conductive material. ... | 01/05/1993 |
| 5168348 | Impingment cooled compliant heat sink An impingement cooled compliant heat sink (CHS) is employed to extract heat from an array of computer chips in an electric module. A variety of embodiments and variations are provided. The most basic implementation is a metal sheet that is brought into co... | 12/01/1992 |
| 5097385 | Super-position cooling A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip.... | 03/17/1992 |
| 5021924 | Semiconductor cooling device A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convectio... | 06/04/1991 |
| 5016090 | Cross-hatch flow distribution and applications thereof A cold plate and an integrated circuit cooling module embodying a cross-hatch coolant flow distribution scheme. Cross hatch flow distribution is achieved by way of two sets of channels which run perpendicular to each other. The first set of channels is fo... | 05/14/1991 |
| 4940085 | Fluid heat exchanger for an electronic component A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base, a plurality of parallel fins in the housing, a center fed inlet connected to the housing opposite the base for supplying cooling fluid towa... | 07/10/1990 |
| 4928207 | Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston In an improved circuit module with a flat chip-carrying substrate and cylindrical pistons that contact the chips for cooling, each piston has an axial bore that carries a dielectric liquid to the chip and the lower face of the piston (facing the chip) is ... | 05/22/1990 |
| 4910642 | Coolant activated contact compact high intensity cooler A coolant activated contact-compact high intensity cooler (10) for cooling electronic modules and the like has an outer bellows portion (17) and a stack of alternating orifice/target plates (18) and spacer plates (19). Pressurize cooling fluid is caused t... | 03/20/1990 |
| 4909315 | Fluid heat exchanger for an electronic component A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base heat transfer member, a plurality of parallel fins in the housing and center fed concentric inlet and outlet tubes connected to the housing ... | 03/20/1990 |
| 4750086 | Apparatus for cooling integrated circuit chips with forced coolant jet The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible micro... | 06/07/1988 |
| 4740866 | Sealed-type liquid cooling device with expandable bellow for semiconductor chips A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion a... | 04/26/1988 |
| 4258383 | Minimum pressure drop liquid cooled structure for a semiconductor device The device includes a semiconductor wafer that is cooled on one side, and preferably on both sides, by a liquid cooling system. The system preferably comprises a cylindrical cooling chamber including a relatively thin thermally conductive base wall bonded... | 03/24/1981 |
