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| Number | Title | Issue Date |
| RE38588 | Lead material for electronic part, lead and semiconductor device using the same A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has... | 09/14/2004 |
| 6173760 | Co-axial bellows liquid heatsink for high power module test A system for controlling the temperature an electronic component. The system includes a block for temporarily engaging a surface of the component. The block includes channels for circulating a temperature controlling fluid to control a temperature the blo... | 01/16/2001 |
| 5847366 | Apparatus and method for controlling the temperature of an integrated circuit under test The present invention is an apparatus and method for controlling the temperature of a heat generating device. The invention is particularly adaptable to controlling the temperature of an integrated circuit under test. In one embodiment the invention invol... | 12/08/1998 |
| 5640046 | Cooling structure for integrated circuit element modules, electronic device and heat sink block In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the ... | 06/17/1997 |
| 5491363 | Low boiling point liquid coolant cooling structure for electronic circuit package A cooling structure which is used for forced cooling of an electronic circuit package such as an integrated circuit is disclosed. The cooling structure comprises a tubular fin member having many through-holes of small diameter, a flat plate member which i... | 02/13/1996 |
| 5206791 | Bellows heat pipe apparatus for cooling systems Provided is a cooling system for transferring heat away from heat dissipative devices. The cooling system includes a thermally conductive heat sink member which is connected on one side to a heat dissipating device and attached on the second side to a res... | 04/27/1993 |
| 5195020 | Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the compone... | 03/16/1993 |
| 5166863 | Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling A liquid-cooled assembly of heat-generating devices which are mounted on an electrical interconnect structure. A hydraulic interconnect structure transfers coolant between coolant chambers associated with the heat-generating devices. Flexible tubular memb... | 11/24/1992 |
| 5145001 | High heat flux compact heat exchanger having a permeable heat transfer element The present invention is directed to a compact heat exchanger having a permeable heat transfer element and an impervious heat transfer element. Fluid passes through the permeable element through passages which are substantially normal to the interface bet... | 09/08/1992 |
| 5126919 | Cooling system for an electronic circuit device A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-mel... | 06/30/1992 |
| 5050037 | Liquid-cooling module system for electronic circuit components A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit boa... | 09/17/1991 |
| 5029638 | High heat flux compact heat exchanger having a permeable heat transfer element The present invention is directed to a compact heat exchanger having a permeable heat transfer element. Fluid passes through the permeable element to passages which are provided at the interface between the permeable heat transfer element and a high therm... | 07/09/1991 |
| 4996589 | Semiconductor module and cooling device of the same A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solde... | 02/26/1991 |
| 4977443 | Semiconductor module and an electronic computer using the semiconductor module A semiconductor module comprises semiconductor elements, cooling structures for cooling the semiconductor elements by liquid refrigerant, and a housing for accommodating the semiconductor elements and the cooling structures, wherein within the housing, th... | 12/11/1990 |
| 4949219 | Module sealing structure A sealed module includes a cold plate having a passage through which a cooling medium flows, a plurality of bellows structures having first ends which communicate with the passage in the cold plate to form a thermal conduction type cooling system and a pl... | 08/14/1990 |
| 4920574 | Cooling system for an electronic circuit device A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coola... | 04/24/1990 |
| 4910642 | Coolant activated contact compact high intensity cooler A coolant activated contact-compact high intensity cooler (10) for cooling electronic modules and the like has an outer bellows portion (17) and a stack of alternating orifice/target plates (18) and spacer plates (19). Pressurize cooling fluid is caused t... | 03/20/1990 |
| 4879629 | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation A liquid cooled integrated circuit module includes a substrate, a plurality of chips mounted on the substrate, and electrical conductors integrated into the substrate to interconnect the chips. A compliant member which is completely seamless overlies all ... | 11/07/1989 |
| 4879632 | Cooling system for an electronic circuit device A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-mel... | 11/07/1989 |
| 4870477 | Integrated circuit chips cooling module having coolant leakage prevention device An improved integrated circuit chips cooling module in which a cooling member having an inside space through which a coolant flows is attached to each of the integrated circuit chips by pressure welding or anchoring to effect cooling, wherein the improvem... | 09/26/1989 |
| 4858077 | Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board A condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielect... | 08/15/1989 |
| 4825284 | Semiconductor resin package structure A semiconductor resin package structure formed according to the flip-chip connection method and permitting to cool the rear surface of semiconductor chips, comprising semiconductor chip and carrier substrate which is soldered on one surface thereof to ele... | 04/25/1989 |
| 4819857 | Method for fabricating composite structure A method for fabricating a composite structure, in which an intermediate member is sandwiched between first and second members, is disclosed. In this method, the intermediate member is disposed along the periphery of a spatial region formed between facing... | 04/11/1989 |
| 4809134 | Low stress liquid cooling assembly A liquid cooled electronic circuit includes a printed circuit board having two oppositely facing surfaces, electronic components mounted on one of the two surfaces, and conduits which carry a liquid and touch the electronic components to cool them; wherei... | 02/28/1989 |
| 4783721 | Cooling system for an electronic circuit device A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coola... | 11/08/1988 |
| 4759403 | Hydraulic manifold for water cooling of multi-chip electric modules A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow f... | 07/26/1988 |
| 4750086 | Apparatus for cooling integrated circuit chips with forced coolant jet The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible micro... | 06/07/1988 |
| 4740866 | Sealed-type liquid cooling device with expandable bellow for semiconductor chips A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion a... | 04/26/1988 |
| 4729060 | Cooling system for electronic circuit device A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a c... | 03/01/1988 |
| 4712158 | Cooling system for electronic circuit components A cooling system for electronic circuit components mounted on a printed circuit board, includes a cooling plate having a coolant passage, thermal contacts arranged on the cooling plate to be in resilient contact with the surfaces of the electronic compone... | 12/08/1987 |
| 4688147 | Cooling device attached to each surface of electronic parts on a printed-wiring board A cooling device located between a cooling plate having a first coolant circulating therein, and an electronic part to be cooled, mounted on a printed-wiring board, comprising a hollow part being thermally conductive, having a hollow chamber through which... | 08/18/1987 |
| 4686606 | Device for cooling integrated circuit chip A cooling structure for cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate formed with minute grooves on one of its surfaces is disposed between each integrated circuit chip and an associated ... | 08/11/1987 |
| 4644385 | Cooling module for integrated circuit chips This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated c... | 02/17/1987 |
| 4558395 | Cooling module for integrated circuit chips A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circul... | 12/10/1985 |
| 4450505 | Apparatus for cooling integrated circuit chips A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellow... | 05/22/1984 |
| 4138692 | Gas encapsulated cooling module A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be c... | 02/06/1979 |
