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| Number | Title | Issue Date |
| 7170165 | Circuit board assembly with a brace surrounding a ball-grid array device An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is... | 01/30/2007 |
| 6700195 | Electronic assembly for removing heat from a flip chip An electronic assembly for conducting heat from a semiconductor device, such as a power flip chip, attached to a substrate. The substrate has a first region with conductors thereon, a second region surrounding and supporting the first region, and a third ... | 03/02/2004 |
| 6673434 | Thermal interface materials A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or "soft gel". The gel state is ... | 01/06/2004 |
| 6670699 | Semiconductor device packaging structure A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed with... | 12/30/2003 |
| 6660566 | Heat conductive molded body and manufacturing method thereof and semiconductor device A heat conductive molded body effectively radiating heat generated from semiconductor elements, power supply or light source used for electric apparatuses, and a manufacturing method thereof and a semiconductor device excellent in heat radiation. A heat c... | 12/09/2003 |
| 6657297 | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads A flexible plastic thermally conductive multilayer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to opposed major surfaces thereof. The bulk layer and the surface... | 12/02/2003 |
| 6653167 | Facilitating heat transfer from an integrated circuit package In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. The thermal conductor is placed on the silicon layer after the silicon layer has been bonded... | 11/25/2003 |
| 6649443 | System for facilitating alignment of silicon die In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. An alignment tool is used to align the spacer with the silicon die. A thermal conductor can ... | 11/18/2003 |
| 6637506 | Multi-material heat spreader In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center po... | 10/28/2003 |
| 6631077 | Heat spreader with oscillating flow A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The o... | 10/07/2003 |
| 6622782 | Device for cooling of electronic components On a fastening element for securing a thermal conducting bag filed with liquid comprising a frame a number individual resilient tongues are attached. Such an arrangement obtains that a pad or bag filled with liquid securely can be positioned in the frame ... | 09/23/2003 |
| 6623279 | Separable power delivery connector A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a se... | 09/23/2003 |
| 6617199 | Electronic device having fibrous interface Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers... | 09/09/2003 |
| 6617683 | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material A microprocessor package and a method of dissipating heat therefrom have improved thermal performance by utilizing low modulus thermal interface material between the flip chip, central processing unit and a heat spreader in the package. A modulus of elast... | 09/09/2003 |
| 6597582 | Semiconductor device incorporating module structure A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The block socket assumes an annular shape and has connection ... | 07/22/2003 |
| 6585925 | Process for forming molded heat dissipation devices Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding proc... | 07/01/2003 |
| 6556455 | Ultra-low impedance power interconnection system for electronic packages A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance ... | 04/29/2003 |
| 6522543 | IC heat radiation structure and display device A first heat-conductive rubber is disposed on a surface of a printed wiring film, which is an opposite side to a driver IC, a second heat-conductive rubber is disposed on a surface of the driver IC, which is an opposite side to the surface of the printed ... | 02/18/2003 |
| 6496373 | Compressible thermally-conductive interface A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one or more forms. The interface either melt flows or cures at ... | 12/17/2002 |
| 6490161 | Peripheral land grid array package with improved thermal performance A flip-chip module is interconnected to a PCB or circuit card through a peripheral LGA interposer connector. The flip-chip is mounted on the same surface of the module substrate as the peripheral array of LGA interconnection pads and projects into a centr... | 12/03/2002 |
| 6483128 | Connecting device for power semiconductor modules with compensation for mechanical stresses A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the slee... | 11/19/2002 |
| 6461891 | Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substra... | 10/08/2002 |
| 6426877 | Semiconductor device incorporating module structure A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The block socket assumes an annular shape and has connection ... | 07/30/2002 |
| 6424533 | Thermoelectric-enhanced heat spreader for heat generating component of an electronic device A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., a... | 07/23/2002 |
| 6411513 | Compliant thermal interface devices and method of making the devices A compliant, thermally conductive interface device for use between two surfaces, such as a component and a heat sink surface, that can accommodate a range of gap distances and angular misalignment (tilt). The device is comprised of a plurality of foils (2... | 06/25/2002 |
| 6407922 | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader A heat spreader, method of making the heat spreader, and incorporation of the heat spreader in an assembly such as an electronic assembly, are disclosed. The heat spreader includes a matrix material, which has incorporated therein carbon nanotubes and/or ... | 06/18/2002 |
| 6407924 | Enhanced thermal path mechanical tolerance system A method and structure for interfacing a thermally conductive pad between a heat generating module and a heatsink, such that the pad is in substantial thermal contact with both the module and the heatsink despite the fact that both the module and the heat... | 06/18/2002 |
| 6404063 | Die-to-insert permanent connection and method of forming The invention disclosed herein is a semiconductor die assembly and method of making the same having a die and insert substrate that are electrically interconnected by diffusing gold bumps attached to the connecting surface of the substrate to aluminum-bas... | 06/11/2002 |
| 6392309 | Semiconductor device including solid state imaging device A semiconductor device such as a solid state imaging device has a semiconductor chip mounted on a bottom surface of a cavity of a hermetic sealed box-shaped resin-molded package. The device comprises a radiator plate provided in a bottom wall of the packa... | 05/21/2002 |
| 6387714 | Die-to-insert permanent connection and method of forming The invention disclosed herein is a semiconductor die assembly and method of making the same having a die and insert substrate that are electrically interconnected by diffusing gold bumps attached to the connecting surface of the substrate to aluminum-bas... | 05/14/2002 |
| 6380621 | Semiconductor device and manufacturing method thereof An electrically reliable heat radiating package provided with ball grid array (BGA) structure and a method of manufacturing the package are disclosed. In the concrete, a semiconductor chip is mounted on one surface of a ceramic wiring board via a first so... | 04/30/2002 |
| 6373133 | Multi-chip module and heat-sink cap combination A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconn... | 04/16/2002 |
| 6367541 | Conforming heat sink assembly A conforming heat sink assembly for removing heat from heat generating components, having respective top surfaces defining different heights is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom s... | 04/09/2002 |
| 6367263 | Integrated circuit refrigeration device A heat pipe includes a flow diverter that separates the heat pipe into an evaporator chamber and a condenser chamber. Each of the evaporator chamber and the condenser chamber are coupled to a compressor with a one-way valve. The compressor receives vaporo... | 04/09/2002 |
| 6353256 | IC package structure for achieving better heat dissipation With increasing density and improving performance as well as growing function variety of the circuits integrated in a semiconductor chip, the heat dissipating capability of an IC package must be effectively promoted. An IC package based on a simple struct... | 03/05/2002 |
| 6343643 | Cabinet assisted heat sink A heat sink structure includes a lower heat sink in thermal contact with a heat emitting component. The heat sink structure further includes an upper heat sink and at least one heat pipe extending from the lower heat sink to the upper heat sink. At least ... | 02/05/2002 |
| 6337796 | Semiconductor device mount structure having heat dissipating member for dissipating heat generated from semiconductor device A semiconductor device mount structure includes a heat dissipating member, a circuit board, a semiconductor device and a leaf spring member. The heat dissipating member has a mounting surface. The circuit board is opposed to the mounting surface of the he... | 01/08/2002 |
| 6315038 | Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area thereof. The thermal interface is attached to the cooling d... | 11/13/2001 |
| 6294731 | Apparatus for multichip packaging The present invention comprises a high performance single chip or multi-chip package which combines a CTE controlled electronic substrate, a multi-layer interconnect, bare dice or packaged devices, a top layer encapsulant and an interposer to provide a co... | 09/25/2001 |
| 6292367 | Thermally efficient semiconductor chip A heat sink assembly and process for fabricating the assembly in which a semiconductor chip is formed with at least one high conductivity layer on its back side and some of the integrated circuits are high power circuits and, during operation, generate "h... | 09/18/2001 |
