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| Number | Title | Issue Date |
| 7132746 | Electronic assembly with solder-bonded heat sink A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the h... | 11/07/2006 |
| 7013555 | Method of applying phase change thermal interface materials The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface ... | 03/21/2006 |
| 6963131 | Integrated circuit system with a latent heat storage module The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage... | 11/08/2005 |
| 6703128 | Thermally-capacitive phase change encapsulant for electronic devices An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phas... | 03/09/2004 |
| 6672378 | Thermal interface wafer and method of making and using the same A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting... | 01/06/2004 |
| 6672370 | Apparatus and method for passive phase change thermal management A heat sink includes a heat sink body including a number of fins and a cavity for holding a phase change material and a number of particles to enhance the mixing of the phase change material during the operation of the heat sink. In operation, the body of... | 01/06/2004 |
| 6673434 | Thermal interface materials A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or "soft gel". The gel state is ... | 01/06/2004 |
| 6656770 | Thermal enhancement approach using solder compositions in the liquid state Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder compositio... | 12/02/2003 |
| 6651331 | Method of establishing a thermal joint on a heat sink A method for depositing a thermal interface onto a heat sink including the selection of a highly thixotropic compound formed into a bulk form so as to present a tip which is melted upon contact with a preheated heat sink. The tip cross section preferably ... | 11/25/2003 |
| 6652705 | Graphitic allotrope interface composition and method of fabricating the same An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of gra... | 11/25/2003 |
| 6631755 | Thermal module with temporary heat storage A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase ch... | 10/14/2003 |
| 6620515 | Thermally conductive phase change materials A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any des... | 09/16/2003 |
| 6621702 | Method and apparatus for absorbing thermal energy An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing... | 09/16/2003 |
| 6617517 | Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2 /W at a pressure of... | 09/09/2003 |
| 6616999 | Preapplicable phase change thermal interface pad A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a porti... | 09/09/2003 |
| 6570362 | Portable electronic device with enhanced battery life and cooling Battery life and cooling are improved in an electronic device. A thermoelectric module and phase change material module are placed near a heat source in an electronic device. The thermoelectric module and phase change material module insulate a surface to... | 05/27/2003 |
| 6451422 | Thermal interface materials Described is an interface material composition that includes rubber, phase change material and thermally conductive filler.... | 09/17/2002 |
| 6399209 | Integrated release films for phase-change interfaces A thermally conductive conformable interface pad for inter-position between a heat generating solid state electronic device and a heat sinking surface. The interface comprises a laminate of at least two layers, including a relatively soft conformable body... | 06/04/2002 |
| 6400565 | Thermally conductive interface member An electronic package including a printed circuit substrate having a semiconductor device mounted thereon. A heat dissipating device is attached to the semiconductor device. A thermal interface member is mounted between the semiconductor device and the he... | 06/04/2002 |
| 6372997 | Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2 /W at a pressure of... | 04/16/2002 |
| 6286212 | Thermally conductive material and method of using the same A method for establishing a thermal interface between an electrical component and a heat sink including the selection of a compound having a melt temperature above the normal operating temperature of the component. The electrical component initially reach... | 09/11/2001 |
| 6281573 | Thermal enhancement approach using solder compositions in the liquid state Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder compositio... | 08/28/2001 |
| 6260613 | Transient cooling augmentation for electronic components An electronic assembly that may include a two-phase material that absorbs heat generated by an integrated circuit. The heat may be transferred from the integrated circuit to the two-phase material by a heat pipe. The two-phase material can absorb heat in ... | 07/17/2001 |
| 6237223 | Method of forming a phase change heat sink A method of forming a phase change passive heat sink, with a base member and heat dissipating members, is provided. The base member is hollow and defines an evaporation chamber therein. A number of heat dissipating members are connected to the base member... | 05/29/2001 |
| 6212073 | Heat sink An automatically mountable heat sink for effectively conducting and dissipating heat of an electronic part comprises a heat dissipation plate formed by bending a rectangular metal plate of aluminum, copper or the like by means of pressing along the lines ... | 04/03/2001 |
| 6202739 | Apparatus including a heat-dissipating apparatus, and method for forming same The present invention provides an apparatus (200) that includes a heat-generating component (202) and a heat-dissipating apparatus (120). The heat-generating component (202) is mounted on a substrate (204). The heat-dissipating apparatus (120) includes a ... | 03/20/2001 |
| 6181558 | Heat absorber and combination electrical apparatus producing heat and heat absorber A heat absorber including a container providing an internal cavity, phase change material, such as microencapsulated phase change material, residing in the cavity, the container including at least one wall of thermally conductive material in thermal conta... | 01/30/2001 |
| 6097602 | Integrated circuit package heat sink attachment An interface between an integrated circuit package and a heat sink comprises a sandwich of a temperature-induced, solid-to-liquid phase-changing, thermally-conductive material wafer impregnated in a liquid-permeable mounting mesh sheet sandwiched between ... | 08/01/2000 |
| 6046907 | Heat conductor A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel with alumina as a heat conductive filler dispersed therein,... | 04/04/2000 |
| 5945217 | Thermally conductive polytrafluoroethylene article A thermally conductive composite article is provided having a PTFE material or a PTFE matrix material which has disposed therein thermally conductive particles, and a phase change material.... | 08/31/1999 |
| 5930893 | Thermally conductive material and method of using the same A method for establishing a thermal interface between an electrical component and a heat sink including the selection of a compound having a melt temperature above the normal operating temperature of the component. The compound may be placed on a carrier ... | 08/03/1999 |
| 5631799 | Fusion heat sink for integrated circuit An integrated circuit system includes an integrated circuit with a heat sink assembly including a fusible core. In the event that power dissipation by the integrated circuit threatens to exceed its safe operating range, the fusible core melts, absorbing t... | 05/20/1997 |
| 5477409 | Fusion heat sink for integrated circuit An integrated circuit system includes an integrated circuit with a heat sink assembly including a fusible core. In the event that power dissipation by the integrated circuit threatens to exceed its safe operating range, the fusible core melts, absorbing t... | 12/19/1995 |
| 5455458 | Phase change cooling of semiconductor power modules Semiconductor wafer (22) and substrate (20) are enclosed in housing (12) on heat extracting base (14) . The space within the housing is filled with a phase change material (28) which absorbs heat at a transitional temperature below the critical temperatur... | 10/03/1995 |
| 5325913 | Module cooling system An apparatus is provided for cooling electronic components mounted on a cuit board. The circuit board is placed in thermal contact with a heat sink enclosure that has an interior cavity and a release opening that provides a path from the interior cavity ... | 07/05/1994 |
| 5223747 | Heat dissipating device Heat dissipating devices for electronic component semiconductor chips are provided in the form of channels or grooves which are either integrated in the underside of the semiconductor chip or are formed in an additional thin semiconductor chip which has l... | 06/29/1993 |
| 5097387 | Circuit chip package employing low melting point solder for heat transfer A circuit chip package and method for assembling the same is disclosed which employs low eutectic or melting point solder, such as an indium alloy, as a thermally conductive medium between each circuit chip and the package cover. The melting point of the ... | 03/17/1992 |
| 5024264 | Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the heat generat... | 06/18/1991 |
| 5012858 | Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semicond... | 05/07/1991 |
| 4446916 | Heat-absorbing heat sink An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings comprising a device-embedded compound that absorbs heat, delaying temperature rise in the heat generator, at a specific temperature by melting or en... | 05/08/1984 |
