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| Number | Title | Issue Date |
| 7388285 | Hermetically sealed package for optical, electronic, opto-electronic and other devices Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate... | 06/17/2008 |
| 7381346 | Thermal interface material A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface mat... | 06/03/2008 |
| 7378731 | Heat spreader and package structure utilizing the same A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest ... | 05/27/2008 |
| 7345364 | Structure and method for improved heat conduction for semiconductor devices A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity... | 03/18/2008 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are s... | 03/11/2008 |
| 7329948 | Microelectronic devices and methods A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When ... | 02/12/2008 |
| 7250674 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 07/31/2007 |
| 7193316 | Integrated circuit coolant microchannel with movable portion According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume o... | 03/20/2007 |
| 7088586 | Techniques for cooling a circuit board component within an environment with little or no forced convection airflow A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the centra... | 08/08/2006 |
| 6988531 | Micro-chimney and thermosiphon die-level cooling A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the l... | 01/24/2006 |
| 6665186 | Liquid metal thermal interface for an electronic module A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a ... | 12/16/2003 |
| 6665187 | Thermally enhanced lid for multichip modules An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the ... | 12/16/2003 |
| 6639360 | High power radiation emitter device and heat dissipating package for electronic components The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; ... | 10/28/2003 |
| 6631078 | Electronic package with thermally conductive standoff A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper sur... | 10/07/2003 |
| 6621699 | Electronic component cooling apparatus An electronic component cooling apparatus is provided that can prevent a reduction in a heat dissipation effect on an electronic component with a pushing force toward a heat sink thereof being applied to the opposite wall of a casing thereof. Pushing forc... | 09/16/2003 |
| 6617684 | Packaged die on PCB with heat sink encapsulant An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical ... | 09/09/2003 |
| 6552906 | Radiator for electronic parts, electronic device, electric circuit device, and computer To prevent generation of air bubbles in thermal grease 37 when a wired board 24 is bent due to a difference of thermal expansibility between a CPU chip 31 and a heat sink 32 in a CPU package 21, the thermal grease 37 being filled between the CPU chip 31 a... | 04/22/2003 |
| 6538308 | Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided between first radiation block and cooling block. The press-fitt... | 03/25/2003 |
| 6534858 | Assembly and methods for packaged die on pcb with heat sink encapsulant An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical ... | 03/18/2003 |
| 6455924 | Stress-relieving heatsink structure and method of attachment to an electronic package A stress-relieving heatsink structure and method of forming thereof for an electronic package, for instance, that including a semiconductor chip package which is mounted on a wired carrier, such as a circuitized substrate. The heatsink structure is consti... | 09/24/2002 |
| 6444496 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the... | 09/03/2002 |
| 6442043 | Chip assembly module of bump connection type using a multi-layer printed circuit substrate A multi-layer structured printed circuit substrate having an upper conductive layer and a lower conductive layer with an inter-layer insulating layer is used. A chip assembly part of bump connection type is formed by forming openings in a portion of the u... | 08/27/2002 |
| 6441480 | Microelectronic circuit package A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capa... | 08/27/2002 |
| 6436733 | Bonding layer method in a semiconductor device A semiconductor chip is bonded on a radiator plate consisting of copper material with interposition of a bonding layer having a total thickness of 80 μm comprising a laminated structure including a thermoplastic film bonding layer 12a having a thickness ... | 08/20/2002 |
| 6429510 | Liquid damping of high frequency bond wire vibration A plurality of conductors and an electrical component are disposed on a substrate, wherein the electrical component has a plurality of leads that are connected to the conductors on the substrate by a plurality of bond wires. A damping material is then sit... | 08/06/2002 |
| 6424033 | Chip package with grease heat sink and method of making The present invention relates to enhanced protection of the active surface and the bond wires or ball array of a microelectronic device, and to thermal management of the microelectronic device as it is package with a printed circuit board (PCB) or other s... | 07/23/2002 |
| 6413353 | Method for direct attachment of a chip to a cooling member A semiconductor chip module uses a silicone adhesive between the semiconductor chip and a cap, said adhesive having sufficient bond strength to secure said cap to said chip without additional mechanical constraint while providing a direct thermally conduc... | 07/02/2002 |
| 6409859 | Method of making a laminated adhesive lid, as for an Electronic device An electronic package or module is protected by a lid sealed with a thermoplastic or thermosetting adhesive laminate that has been pre-applied onto the lid, including the bonding area of the lid. The adhesive is deposited as wet adhesive or is laminated i... | 06/25/2002 |
| 6396701 | Semiconductor unit and cooling device A semiconductor unit is provided, which includes a substrate, a plurality of semiconductor components loaded on the substrate, and a cooling device provided above the semiconductor components. A flat-bottomed dent, slightly smaller than the semiconductor ... | 05/28/2002 |
| 6320267 | Bonding layer in a semiconductor device A semiconductor chip is bonded on a radiator plate consisting of copper material with interposition of a bonding layer having a total thickness of 80 μm comprising a laminated structure including a thermoplastic film bonding layer 12a having a thickness ... | 11/20/2001 |
| 6294408 | Method for controlling thermal interface gap distance A method and apparatus for electronic chip assembly maintains a thin gap spacing between the chip and the lid or heat sink and provides for the electronic chip to operate at a relatively cool temperature. The thermal performance is enhanced by a thermal i... | 09/25/2001 |
| 6292362 | Self-contained flowable thermal interface material module A self-contained flowable thermal interface material module includes a carrier having opposite sides and a continuous peripheral edge. A thermal interface material is mounted on the carrier. A portion of the interface material is exposed on each of the op... | 09/18/2001 |
| 6285078 | Thermal spreader cap and grease containment structure for semiconductor device An apparatus and method for protecting the various components of a microprocessor is provided. The apparatus includes a thermal spreader cap that is disposed between the processor die and thermal plate, and the OLGA and thermal plate. Thermal grease layer... | 09/04/2001 |
| 6281579 | Insert-molded leadframe to optimize interface between powertrain and driver board An insert-molded leadframe having wire bonding posts formed on an inner portion, device pins formed on an outer portion, and a central portion connecting between the inner portion and the outer portion. Plastic encases the central portion of the conductiv... | 08/28/2001 |
| 6282092 | Electronic circuit device and method of fabricating the same An electronic circuit device having an improved heat dissipating effect, a small size and a high reliability is provided with a metal substrate having a first surface and a second surface and a case. Electronic parts are mounted on only the first surface ... | 08/28/2001 |
| 6275381 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the... | 08/14/2001 |
| 6271058 | Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board There is provided a method of manufacturing a semiconductor device that ensures the connection state and enhance structural stability, reliability and heat-radiation performance. In a first step, metal bumps are joined to one of electrodes on a semiconduc... | 08/07/2001 |
| 6255139 | Method for providing a thermal path through particles embedded in a thermal cap The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a metho... | 07/03/2001 |
| 6252308 | Packaged die PCB with heat sink encapsulant An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical ... | 06/26/2001 |
| 6222264 | Cooling apparatus for an electronic package An electronic apparatus including a semiconductor device mounted on a substrate. A support member is disposed between the semiconductor device and the substrate. A heat dissipating body has a cavity formed therein. The heat dissipating body is positioned ... | 04/24/2001 |
