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| Number | Title | Issue Date |
| 7349218 | Locking device for a heat sink A locking device is for locking a heat sink to an electronic device. The locking device includes a retaining frame and a guiding member positioned on the retaining frame. The guiding member includes a seat having a base sitting on the retaining frame, a sleeve exten... | 03/25/2008 |
| 7339266 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads... | 03/04/2008 |
| 7333333 | Locking device for heat sink A heat dissipation device includes a heat sink, a retention module and a clip. The retention module includes a plurality of locking portions. The clip includes a main piece, an operating piece pivotally connecting with the main piece, and a buckling piece pivotally ... | 02/19/2008 |
| 7304381 | Package and method for attaching an integrated heat spreader In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached t... | 12/04/2007 |
| 7292447 | Back plate assembly for a board A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latc... | 11/06/2007 |
| 7289330 | Heat sink assembly having a fan mounting device A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaini... | 10/30/2007 |
| 7170165 | Circuit board assembly with a brace surrounding a ball-grid array device An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is... | 01/30/2007 |
| 6870258 | Fixture suitable for use in coupling a lid to a substrate and method A fixture suitable for coupling a lid to a substrate having a semiconductor chip coupled thereto and a method for coupling the lid to the substrate. A support structure has a cavity having a floor and a pedestal protruding from the floor. A guide extends from the su... | 03/22/2005 |
| 6703707 | Semiconductor device having radiation structure A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of ... | 03/09/2004 |
| 6703261 | Semiconductor device and manufacturing the same A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink ... | 03/09/2004 |
| 6697263 | Socket having frame for supporting thermal module A socket (10) for connecting a CPU (30) to a PCB (50) includes a base (12) and a frame (20) surrounding the base. The base has a plurality of terminals (14) received therein. A receiving space is defined between the base and the frame, for receiving the C... | 02/24/2004 |
| 6680848 | Device and method for mounting integrated circuits on a printed circuit card The subject of the present invention is a device (1) for mounting at least two electrical components (4A, 4B) on a printed circuit card (2), the card (2) comprising connection pads on both of its sides. According to the invention, the card (2) is traverse... | 01/20/2004 |
| 6678158 | Heat sink assembly with fixing device A heat sink assembly includes a fixing device (10), a fin member (40), and a fan (50). The fixing device is integrally formed by extruding aluminum. The fixing device includes a base (12), two side plates (16) extending upwardly from opposite sides of the... | 01/13/2004 |
| 6667885 | Attachment of a single heat dissipation device to multiple components with vibration isolation A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the inven... | 12/23/2003 |
| 6665188 | Snapping device for CPU cooler The present invention is to provide a snapping device comprising a fastening resilient strip including a main body; at least one bolt parallel to the fastening resilient strip; a contact section moveable along the shank of the bolt; and a hollow support s... | 12/16/2003 |
| 6660563 | Method and system for assembling a printed circuit board using a land grid array A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number ... | 12/09/2003 |
| 6657131 | I/C package / thermal-solution retention mechanism with spring effect A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, ... | 12/02/2003 |
| 6650544 | Integrated circuit chip cooling structure with vertical mounting through holes An integrated circuit chip cooling structure is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between said top and bottom plate member, the top and bottom plate members each having a plura... | 11/18/2003 |
| 6650541 | Fan-securing device for use with a heat transfer device A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the ... | 11/18/2003 |
| 6646881 | Mounting assembly for heat sink A mounting assembly for securing a heat sink (10) to an electronic package (50) mounted on a circuit board (40) includes a back plate (20), a clip (30), and two screws (70). The back plate abuts an underside of the circuit board. The back plate includes a... | 11/11/2003 |
| 6643137 | Heat-dissipating device with grounding capability A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a heat-dissipating member, a grounding member and a connectin... | 11/04/2003 |
| 6639800 | Heat sink subassembly A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating... | 10/28/2003 |
| 6639803 | Compliant heat sink device/mounting system interconnect and a method of implementing same A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between t... | 10/28/2003 |
| 6633489 | Dynamic isolating mount for processor packages The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present... | 10/14/2003 |
| 6631078 | Electronic package with thermally conductive standoff A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper sur... | 10/07/2003 |
| 6625022 | Direct heatpipe attachment to die using center point loading An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.... | 09/23/2003 |
| 6611431 | Heat dissipation assembly A heat dissipation assembly includes a heat sink (10), a backplate (30), a plurality of bolts (42) and springs (46), and a PCB (50). The PCB supports a chip (60) thereon and defines a plurality of through holes (52) around the chip. The backplate forms a ... | 08/26/2003 |
| 6608380 | Semiconductor chip package having one or more sealing screws A semiconductor chip package comprising a chip with a lid having venting holes hermetically sealed with screws and a manufacturing method thereof are provided. The semiconductor chip package of the present invention comprises a chip such as a central proc... | 08/19/2003 |
| 6574106 | Mounting structure of semiconductor device A mounting structure for a semiconductor device of the present invention includes a substrate, a semiconductor device, a plurality of connecting members and a member. The substrate has a first surface and a plurality of pads on the first surface. The semi... | 06/03/2003 |
| 6567269 | Computer system having removable processor and modular thermal unit An electronic device system having a removable processor and a removable modular thermal unit. The electronic device enabling a first modular thermal and processor installed within the electronic device to be replaced by a second modular thermal unit and ... | 05/20/2003 |
| 6557675 | Tunable vibration damper for processor packages The present invention relates to a method and apparatus that minimizes shock/vibrational motion in interposer sockets. The ability to control shock/vibration can ensure successful operation and substantially increase socket lifetime. The present invention... | 05/06/2003 |
| 6560111 | Bracket for CPU cooler A reliable bracket for CPU cooler having a latched piece on each of four corners is provided. Bracket comprises a rectangular hollow frame, a flat area extended between frame and a central opening for supporting cooler, a lower surface of flat area being ... | 05/06/2003 |
| 6560113 | Electronic device assembly having thermal module for heat dissipation An electronic device assembly includes a PCB (20), a socket (26) mounted on the PCB, a CPU (22) connected with the socket, a thermal module (30) in thermal contact with the CPU, and a back plate (10) attached to an underside of the PCB opposite the CPU. T... | 05/06/2003 |
| 6549410 | Heatsink mounting system The invention relates to a mounting arrangement for a heatsink for cooling a microelectronic device contained within a chassis. The mounting arrangement includes a heatsink, a motherboard incorporating the microelectronic device thereon and securing means... | 04/15/2003 |
| 6542366 | Circuit board support The present invention is directed to an improved circuit board support. The present invention provides for quick-assembly, limits circuit board flex, and supports a heat sink. In one aspect of the present invention, an apparatus suitable for supporting a ... | 04/01/2003 |
| 6542365 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of the... | 04/01/2003 |
| 6541855 | Printed board unit A printed board unit includes a printed board including lands thereon, a semiconductor device unit, and an attachment mechanism to attach the semiconductor device unit to the printed board. The semiconductor device unit includes a heat transfer member, a ... | 04/01/2003 |
| 6538893 | Securing device for a locking member of a heat dissipating element of a CPU A securing device for a locking member of a heat dissipating element of a CPU includes several engaging members and a main body. The heat dissipating element is locked between upper removable parts and a base of the locking member. The engaging members ea... | 03/25/2003 |
| 6515860 | CPU heat sink fastener A CPU heat sink fastener having a four-foot seat for mounting a heat sink inserted outside a fastening seat on a mother-board for installing a CPU is characterized that a base plate is disposed in the lower aspect of the mother-board opposite to the four-... | 02/04/2003 |
| 6507981 | Fastener carrier A flexible/foldable fastener carrier, comprising one or more captive fasteners inserted at predetermined positions on the carrier. The positions correspond to fastening points on a separate article being secured by the fastener, permitting the each fasten... | 01/21/2003 |
