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| Number | Title | Issue Date |
| 7427809 | Repairable three-dimensional semiconductor subsystem A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together using re-workable flip chip connectors; each flip chip connector compr... | 09/23/2008 |
| 7361985 | Thermally enhanced molded package for semiconductors An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit. ... | 04/22/2008 |
| 7315446 | Hard drive connecting device for notebook computer A hard drive connecting device for a notebook PC is installed in a case of the notebook PC for connecting a main board and a hard drive in the case, which includes a flexible board having at least a first side, at least a second side, and conductive lines for electr... | 01/01/2008 |
| 7309918 | Chip package structure This invention relates to a chip package structure comprising of a chip, multiple leads with inner and outer ends, an exposed chip upper surface, an encapsulated body encloses the peripherals of the chip, and multiple conducting wires used to connect electrically th... | 12/18/2007 |
| 7304381 | Package and method for attaching an integrated heat spreader In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached t... | 12/04/2007 |
| 7285851 | Liquid immersion cooled multichip module In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with ... | 10/23/2007 |
| 7208342 | Package warpage control A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a... | 04/24/2007 |
| 7122448 | Annealing apparatus, annealing method, and manufacturing method of a semiconductor device An annealing apparatus, includes a substrate stage placing a semiconductor substrate; a light source facing the substrate stage, configured to irradiate a pulsed light at a pulse width of approximately 0.1 ms to 100 ms on a surface of the semiconductor substrate; an... | 10/17/2006 |
| 6969907 | Cooling structure for multichip module A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation p... | 11/29/2005 |
| 6700195 | Electronic assembly for removing heat from a flip chip An electronic assembly for conducting heat from a semiconductor device, such as a power flip chip, attached to a substrate. The substrate has a first region with conductors thereon, a second region surrounding and supporting the first region, and a third ... | 03/02/2004 |
| 6621699 | Electronic component cooling apparatus An electronic component cooling apparatus is provided that can prevent a reduction in a heat dissipation effect on an electronic component with a pushing force toward a heat sink thereof being applied to the opposite wall of a casing thereof. Pushing forc... | 09/16/2003 |
| 6580612 | Electric circuit An electronic circuit is equipped with a lid-shaped heat sink made from aluminum sheet. Components are held in contact with the wall of the heat sink by means of lugs connected to the heat sink. The lugs are formed by bending U-shaped parts of the aluminu... | 06/17/2003 |
| 6545870 | Screwless retention of heatsink load to chassis A technique is provided for the insertion and removal of a motherboard and a heatsink from a computer chassis without the use of tools or threaded fasteners. The technique allows the heatsink to be supported by the chassis and not the motherboard thereby ... | 04/08/2003 |
| 6506073 | Mounting bracket for integrated circuit device The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to acco... | 01/14/2003 |
| 6501647 | Computer with thermal cooling and a thermal cooling system and method A thermal cooling system in which a clamp assembly clamps a heat dissipating device to a heat generating device in the chassis of an electrical device. The clamp assembly ensures that the heat dissipating device exerts a relatively high, constant, uniform... | 12/31/2002 |
| 6472742 | Thermal gap control A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease... | 10/29/2002 |
| 6448642 | Pressure-bonded heat-sink system This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm2. The method is characterized by the steps of remo... | 09/10/2002 |
| 6430050 | Mechanical loading of a land grid array component using a wave spring A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placi... | 08/06/2002 |
| 6377463 | Retention module for processor and chipset thermal solutions A heat sink apparatus includes a first heat sink thermally coupled with at least a first component of a substrate, and a second heat sink thermally coupled with at least a second component of the substrate. The apparatus further includes a unitary retenti... | 04/23/2002 |
| 6346672 | Structure for preventing electromagnetic interference of central processing unit The present invention proposes an improved structure for preventing electromagnetic interference (EMI) of a central processing unit (CPU), which structure includes a base, a shielding element, at least a first pin, and at least a second pin. The present i... | 02/12/2002 |
| 6310773 | Heat sink system A heat dissipation system for an integrated circuit assembly uses a compressible support structure to support a cooling solution, or heat sink, that dissipates heat generated by an integrated circuit. The compressible support structure, in one embodiment,... | 10/30/2001 |
| 6286586 | Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components A torsion bar clamp device and method for mounting a heat sink to an electronic component comprising a torsion bar having a longitudinally extending bar and at least one integral lever adapted to engage a heat sink and mounting legs which couple forces im... | 09/11/2001 |
| 6266244 | Mounting method and apparatus for electrical components A heat sink is formed from a base component and a clamping component. The base component and clamping component include a locking groove and a tab for insertion into the locking groove. The clamping component includes at least one clamping leg. The base c... | 07/24/2001 |
| 6256199 | Integrated circuit cartridge and method of fabricating the same An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially ... | 07/03/2001 |
| 6153932 | Fix base of integrated circuit chipset and heat sink An improved fix base of a heat sink used to dissipate the heat produced by an integrated circuit chipset in a personal computer is disclosed. The fix base includes a rectangular frame, which has two side plates downwards below the bottom of the two opposi... | 11/28/2000 |
| 6029740 | Protective cap for heat conducting medium A protective cap comprises a cap portion and a mounting bracket attached to the cap portion along its peripheral walls. The mounting bracket includes upper and lower bars connected to opposite peripheral walls of the cap portion. A mounting seat is define... | 02/29/2000 |
| 6012510 | Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components A torsion bar clamp device and method for mounting a heat sink to an electronic component comprising a torsion bar having a longitudinally extending bar and at least one integral lever adapted to engage a heat sink and mounting legs which couple forces im... | 01/11/2000 |
| 6002591 | Printed circuit board mounting assembly and a method for mounting an integrated circuit device The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to acco... | 12/14/1999 |
| 5869897 | Mounting arrangement for securing an intergrated circuit package to heat sink A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a rib... | 02/09/1999 |
| 5816319 | Cooling radiator The present invention relates to improvements on a cooling radiator for cooling a heating element by radiating and removing heat generated by a heating element, such as CPU. In a cooling radiator with a fan according to the present invention, which is use... | 10/06/1998 |
| 5771559 | Removable heat sink assembly process for a chip package The process of the invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink to... | 06/30/1998 |
| 5646444 | Apparatus and method for mounting a component to an electrical circuit An apparatus to improve upon the problem of mismatched CTEs in electrical circuits comprises a small heat sink (206), a substrate (202), and an aperture existing within the substrate (202). The heat sink (206) is located on one side of the substrate (202)... | 07/08/1997 |
| 5640304 | Power electronic device mounting apparatus A plastically deformable lever is used to compress a flat spring against the upper surface of a power electronic device in mounting the device on a bus bar or heat sink. The lever preferably is integral with the bus bar or heat sink. The heat sink or bus ... | 06/17/1997 |
| 5629562 | Conductive contact structure for two conductors In a conductive contact structure for two conductors, a lower electrode also serves as a cooling element, and two grooves are formed in the lower surface of an electrode. A grease-like insulating material high in thermal conductivity is applied to the low... | 05/13/1997 |
| 5612677 | System to monitor the temperature of an integrated circuit and to dissipate heat generated thereby A system to monitor the temperature of an integrated circuit and to dissipate heat generated thereby includes a heat sink to overlie the integrated circuit. A temperature sensor is located on the heat sink to detect the temperature adjacent the integrated... | 03/18/1997 |
| 5596485 | Plastic packaged integrated circuit with heat spreader A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant sur... | 01/21/1997 |
| 5581441 | Electrically-operated heat exchanger release mechanism A heat operated release mechanism. The release mechanism is controllable to allow a heat exchanger to be firmly held in place over a heat producing element and effortlessly withdrawn when so desired. A spring is disposed above a heat producing element for... | 12/03/1996 |
| 5568683 | Method of cooling a packaged electronic device A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attache... | 10/29/1996 |
| 5566052 | Electronic devices with electromagnetic radiation interference shields and heat sinks An electronic device with an EMI shield surrounding an electronic component on a substrate. A heat sink extends through an opening in the shield from heat conductive contact with the component to a position outside the shield. The heat sink operates also ... | 10/15/1996 |
| 5548482 | Semiconductor integrated circuit apparatus including clamped heat sink The present invention provides a semiconductor integrated circuit apparatus with a heat sink that can be changed in size, that accommodates a board and electronic parts having different sizes, and that increases heat radiation. The present invention inclu... | 08/20/1996 |
