Bizarre Patents
Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7402910 | Solder, microelectromechanical component and device, and a process for producing a component or device A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing... | 07/22/2008 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate.... | 06/17/2008 |
| 7352063 | Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same A semiconductor device has a semiconductor chip having first and second surfaces; a sealing resin formed over the first surface; and a cooling structure having a first conductive layer formed on the first surface, an n-type semiconductor formed on the first conducti... | 04/01/2008 |
| 7304380 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 12/04/2007 |
| 7282798 | Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation A method and structure for heat transport, cooling, sensing and power generation is described. A photonic bandgap structure (3) is employed to enhance emissive heat transport from heat sources such as integrated circuits (2) to heat spreaders (4... | 10/16/2007 |
| 7268019 | Method and apparatus for high temperature operation of electronics Embodiments of methods and apparatus for high temperature operation of electronics according to the invention are disclosed. One embodiment of the invention generally includes an integrated circuit package having a substrate. A plurality of integrated circuits are c... | 09/11/2007 |
| 7224059 | Method and apparatus for thermo-electric cooling Embodiments of the present invention provide a method, apparatus and system for absorbing heat from an active side of a die by a plurality of cold conductive elements embedded in said die, and releasing said absorbed heat by a plurality of hot conductive elements em... | 05/29/2007 |
| 7218523 | Liquid cooling system Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat... | 05/15/2007 |
| 7157801 | Device and a method for thermal sensing A device for thermal sensing is disclosed based on one thermopile. The cold junctions of the thermopile are coupled thermally to a first channel comprising a first substance while the hot junctions of the thermopile are coupled thermally to a second channel comprisi... | 01/02/2007 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 6969907 | Cooling structure for multichip module A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation p... | 11/29/2005 |
| 6700053 | Thermoelectric module A thermoelectric module comprising an N-type thermoelectric element having excellent characteristics in air atmosphere even when the temperature rises to a medium-to-high temperature region of about 500° C. and, further, improving the conversion efficien... | 03/02/2004 |
| 6696635 | Thermoelectrically cooling electronic devices A thermoelectric cooler utilizing superlattice and quantum-well materials may be deposited directly onto a die using thin-film deposition techniques. The materials may have a figure-of-merit of greater than one.... | 02/24/2004 |
| 6677555 | Optical device module using integral heat transfer module An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so ... | 01/13/2004 |
| 6645786 | Integrated circuit device having a built-in thermoelectric cooling mechanism A method for manufacturing a thermoelectric cooling mechanism for an integrated circuit is disclosed. Initially, electric circuits are formed on one side of a wafer. Subsequently, thermoelectric cooling devices are formed on an opposite side of the same w... | 11/11/2003 |
| 6639242 | Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits A method and structure for a semiconductor structure that includes a substrate having at least one integrated circuit heat generating structure is disclosed. The invention has at least one integrated circuit cooling device on the substrate adjacent the he... | 10/28/2003 |
| 6614109 | Method and apparatus for thermal management of integrated circuits Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated... | 09/02/2003 |
| 6588217 | Thermoelectric spot coolers for RF and microwave communication integrated circuits An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate therma... | 07/08/2003 |
| 6586835 | Compact system module with built-in thermoelectric cooling An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory... | 07/01/2003 |
| 6581388 | Active temperature gradient reducer An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric devi... | 06/24/2003 |
| 6573596 | Non-rectangular thermo module wafer cooling device using the same A non-rectangular thermo module is formed by disposing a plurality of Peltier devices between a pair of heat radiating plates, wherein the heat radiating plate has a circular or straight outer peripheral contour portion and inner peripheral contour portio... | 06/03/2003 |
| 6570362 | Portable electronic device with enhanced battery life and cooling Battery life and cooling are improved in an electronic device. A thermoelectric module and phase change material module are placed near a heat source in an electronic device. The thermoelectric module and phase change material module insulate a surface to... | 05/27/2003 |
| 6563227 | Temperature control method for integrated circuit Application of a potential difference across a doped region formed on an integrated circuit allows management of thermal energy directly on the chip surface. Individual temperature control cells are formed by ion implanting N- and P-type dopant into adjac... | 05/13/2003 |
| 6559538 | Integrated circuit device having a built-in thermoelectric cooling mechanism An integrated circuit device having a built-in thermoelectric cooling mechanism is disclosed. The integrated circuit device includes a package and a substrate. Contained within the package, the substrate has a front side and a back side. Electric circuits... | 05/06/2003 |
| 6556752 | Dual thermoelectric cooler optoelectronic package and manufacture process An optoelectronic device comprising a laser and a lens for generating collimated light, a locker including an etalon for wavelength locking the collimated light, a first thermoelectric cooler coupled to the laser, and a second thermoelectric cooler couple... | 04/29/2003 |
| 6548894 | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removi... | 04/15/2003 |
| 6532746 | Method and apparatus for securing an electronic component A securing apparatus is used to secure an electronic component, such as a thermoelectric cooler in a thermoelectric cooling system. The securing apparatus includes a clamping mechanism that clamps the electronic component between a first plate, such as a ... | 03/18/2003 |
| 6525934 | Thermal controller for computer, thermal control method for computer and computer equipped with thermal controller A thermal controller and thermal control method for a computer and computer equipped with a thermal controller is disclosed which avoids giving an uncomfortable feeling to the user due to heat generated within a personal computer. A thermal controller for... | 02/25/2003 |
| 6512291 | Flexible semiconductor device support with integrated thermoelectric cooler and method for making same A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negative... | 01/28/2003 |
| 6489551 | Electronic module with integrated thermoelectric cooling assembly An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for e... | 12/03/2002 |
| 6476483 | Method and apparatus for cooling a silicon on insulator device In an electronic device with an active region on top of and isolated from an substrate, a first material region is defined on top of and/or adjacent to and electrically isolated from the active region and a second material region is attached to a surface ... | 11/05/2002 |
| 6474074 | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers An apparatus for dense chip packaging using heat pipes and thermoelectric coolers is provided. The apparatus includes an evaporator region, a condenser region, and a capillary region. The evaporator region includes one or more hot point elements used to t... | 11/05/2002 |
| 6476508 | Temperature control structure for integrated circuit Application of a potential difference across a doped region formed on an integrated circuit allows management of thermal energy directly on the chip surface. Individual temperature control cells are formed by ion implanting N- and P- type dopant into adja... | 11/05/2002 |
| 6445580 | Adaptable heat dissipation device for a personal computer A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-... | 09/03/2002 |
| 6424533 | Thermoelectric-enhanced heat spreader for heat generating component of an electronic device A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., a... | 07/23/2002 |
| 6415612 | Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler A portable computer has enhanced cooling of its processor in a docked mode of operation. External cooling of the computer processor takes place using a thermoelectric cooler in the docking station which has its cold side engaged in heat conducting relatio... | 07/09/2002 |
| 6408630 | Computer enclosure cooling unit A computer enclosure cooling unit adapted to current dimensional standards which is capable of controlled cooling of individual semiconductor devices as well as of the air circulated within the computer housing. The disclosed invention utilizes Peltier de... | 06/25/2002 |
| 6365821 | Thermoelectrically cooling electronic devices A thermoelectric cooler utilizing superlattice and quantum-well materials may be deposited directly onto a die using thin-film deposition techniques. The materials may have a figure-of-merit of greater than one.... | 04/02/2002 |
| 6347521 | Temperature control device and method for manufacturing the same The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting ... | 02/19/2002 |
| 6338251 | Mixed thermoelectric cooling apparatus and method Apparatus and method for sub-ambient cooling using thermoelectric cooling in convention with dynamics conventional cooling techniques. In one form, a vapor phase cooling system provides a temperature (T) and is associated with a thermoelectric cooler. The... | 01/15/2002 |
