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| Number | Title | Issue Date |
| 7301227 | Package lid or heat spreader for microprocessor packages A package for an integrated circuit (IC) die comprises a substrate and a lid. The substrate has an upper surface facing an interior of the package and a lower surface facing an exterior of the package. The upper surface of the substrate carries an IC die and provide... | 11/27/2007 |
| 7282393 | Microelectromechanical device packages with integral heaters A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between w... | 10/16/2007 |
| 6969907 | Cooling structure for multichip module A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation p... | 11/29/2005 |
| 6677557 | Ceramic heater An object of the present invention is to provide a heater wherein even if a through hole into which lifter pins and the like for supporting a semiconductor wafer will be inserted is made, the temperature in the vicinity of the through hole is not lowered ... | 01/13/2004 |
| 6671205 | Low voltage non-volatile memory cell A memory cell comprises a multilayer gate heating structure formed over a channel region between source and drain regions. The multilayer gate heating structure comprises polysilicon and metal silicide layers stacked over a similarly shaped gate oxide. Wh... | 12/30/2003 |
| 6618539 | Heater module and optical waveguide module To provide a heater module which can improve the temperature uniformity in an optical waveguide while keeping the power consumption and the thickness of the optical waveguide module. A heater module 20 in accordance with the present invention is a heater ... | 09/09/2003 |
| 6590280 | Disk-like gettering unit, integrated circuit, encapsulated semiconductor device, and method for manufacturing the same A gettering unit encompasses a silicon substrate, a thin film heater disposed on the silicon substrate, and a gettering layer disposed selectively on the thin film heater. Here, the thin film heater is made of metallic film such as platinum (Pt) or chromi... | 07/08/2003 |
| 6586835 | Compact system module with built-in thermoelectric cooling An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory... | 07/01/2003 |
| 6496416 | Low voltage non-volatile memory cell A memory cell comprises a multilayer gate heating structure formed over a channel region between source and drain regions. The multilayer gate heating structure comprises polysilicon and metal silicide layers stacked over a similarly shaped gate oxide. Th... | 12/17/2002 |
| 6492620 | Equipotential fault tolerant integrated circuit heater Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing ... | 12/10/2002 |
| 6452798 | Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways t... | 09/17/2002 |
| 6448575 | Temperature control structure A semiconductor structure for controlling the temperature of a component is described. The structure includes a resistive layer having one or more channels provided therein and having a resistance characteristic such that a signal applied thereto causes t... | 09/10/2002 |
| 6448662 | Arrangement for accessing region of a flip chip die A method and structure for accessing the circuit region on a flip chip die are provided. The method and device permit multiple portions of the circuit region to be tested and analyzed simultaneously or in sequence. Access to the circuit region is gained w... | 09/10/2002 |
| 6423939 | Micro soldering method and apparatus An apparatus having a heating circuit including a resistor layer and a patterned conductor layer is disclosed. The pattern defines a current path that includes at least one portion of the resistor layer. When current is applied to the current path, heat i... | 07/23/2002 |
| 6423938 | Method for the electrical and/or mechanical interconnection of components of a microelectronic system A method for the electrical and/or mechanical interconnection of components of a microelectronic system includes at least one first component and at least one second component to be connected, and at least one local Joule-effect micro-heater is incorporat... | 07/23/2002 |
| 6403934 | Thermstrate reflow process A heat generating element, such as an electrical resistor, is located interiorally of a T/R module such as by being located on an inner surface of a heat sink member and on which a thermstrate member is attached. The heat generating member is connected to... | 06/11/2002 |
| 6253556 | Electrical system with cooling or heating An electrical system is disclosed which includes a supply voltage and electronic circuitry which requires an operational voltage that is less than the supply voltage. A thermoelectric heat pump is interposed between the supply voltage and the electronic c... | 07/03/2001 |
| 6246581 | Heated PCB interconnect for cooled IC chip modules A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing and attached to a printed circuit board through an interconnect including a heating element embedded therein.... | 06/12/2001 |
| 6184494 | Printed circuit board having a heating element and heating method thereof The present invention relates to a heating method and a printed circuit board comprising a heating element which generates heat required to heat printed circuit board components. The printed circuit board comprises heat conductor between the heating eleme... | 02/06/2001 |
| 6054676 | Method and apparatus for cooling an integrated circuit device An apparatus for cooling an integrated circuit device includes a sealed thermally insulated chamber containing the integrated circuit device. A cooling element is located in chamber and is in thermal contact with the integrated circuit device for cooling ... | 04/25/2000 |
| 6046433 | Monolithic integrated circuit die heater and methods for using same The invention provides an integrated circuit die containing a metal heater resistor. In an embodiment of the invention, the metal heater resistor is disposed around the periphery of the die, with one end of the metal heater resistor connected to a first b... | 04/04/2000 |
| 6031729 | Integral heater for reworking MCMS and other semiconductor components A multi-chip module or other electronic semiconductor component (1) contains a multi-layer substrate (9) whose bottom surface, the bottom of the bottom layer (15) of that substrate, serves as the bonding surface for bonding the multi-chip module or compon... | 02/29/2000 |
| 5968389 | Method and machine for hybridization by refusion A method and device for hybridization of components by solder beads on a substrate using an oven, comprising: raising the temperature of a heating element of the oven, with no contact either with substrate or with component, bringing substrate into therma... | 10/19/1999 |
| 5918665 | Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dis... | 07/06/1999 |
| 5896259 | Preheating device for electronic circuits A system for preheating electronic components on a printed wiring board or other interconnecting substrate prior to application of voltage to the components in extreme cold temperature environments. Copper traces are employed as embedded heater elements. ... | 04/20/1999 |
| 5864176 | Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dis... | 01/26/1999 |
| 5844208 | Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature A temperature control system comprises: an electric heater that has a first face which contacts an electronic device, and a second face which is opposite the first face; a heat sink, coupled to the second face of the heater, which absorbs heat from the el... | 12/01/1998 |
| 5821505 | Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink A temperature control system comprises: an electric heater that has a first face which makes contact with an electronic device, and a second face which is opposite the first face; a heat sink, coupled to the second face of the heater, which absorbs heat f... | 10/13/1998 |
| 5809211 | Ramping susceptor-wafer temperature using a single temperature input A method and apparatus for uniformly ramping the temperatures of a wafer and a susceptor using a first heat source primarily directed at the wafer and a second heat source primarily directed at the susceptor while keeping the wafer at approximately the sa... | 09/15/1998 |
| 5665636 | Suscepter and process for production thereof A suscepter, which is composed substantially of a vitreous carbon derived from polycarbodiimide resin; and a process for producing a suscepter, which includes molding a polycarbodiimide resin or a composition composed mainly of a polycarbodiimide resin, i... | 09/09/1997 |
| 5665260 | Ceramic electrostatic chuck with built-in heater A ceramic electrostatic chuck with a built-in heater having electrodes of an electroconductive ceramic bonded to a surface of a supporting substrate of an electrically conducting ceramic. A heat generating layer of an electroconductive ceramic is bonded t... | 09/09/1997 |
| 5645123 | Semiconductor device having temperature regulation means formed in circuit board A semiconductor device according to the present invention includes a resistant heating element as a temperature regulation means on a circuit board. A semiconductor chip of the device is connected to the circuit board through connecting electrodes. A diff... | 07/08/1997 |
| 5539186 | Temperature controlled multi-layer module A multi-layer module that has incorporated therein an additional sheet with a heat generating film resistor formed thereon. A temperature responsive controller regulates the film resistor current in order to regulate the temperature at the surface of the ... | 07/23/1996 |
| 5334829 | Package for solid state imager with heating means to repair imager lattice defect A CCD image sensor includes a package (2) in which there are packaged a CCD solid state imaging device (1) in which a getter layer is formed on the rear surface of a silicon substrate and a photo-sensing portion and a CCD register are formed on the surfac... | 08/02/1994 |
| 5324916 | System and method for dynamic power compensation A system and method for compensating in real time the dynamic power variation of a computer chip containing CMOS devices is provided. The present invention functions to control the temperature variations on the chip thus eliminating the drift to analog si... | 06/28/1994 |
| 5323150 | Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices The present invention introduces a method of reducing conductive and convective heat loss from the battery unit in battery-powered devices, such as RFID tag devices. Battery heat loss prevention is accomplished by suspending the battery in a vacuum or wit... | 06/21/1994 |
| 5105066 | Device comprising a heating sample carrier A device that includes a heating sample carrier which has a carrying surface, an electrical heating system and a frame support for receiving a frame. The electrical heating system is formed of a disk of a refractory insulating material.... | 04/14/1992 |
| 5099311 | Microchannel heat sink assembly The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated ... | 03/24/1992 |
| 5059770 | Multi-zone planar heater assembly and method of operation A heater assembly and method of operation for use in processing of a substrate such as a semiconductor wafer, for example in a chemical vapor deposition (CVD) reactor chamber, the heater assembly including a dielectric heater base, radially spaced apart a... | 10/22/1991 |
| 5034688 | Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support The invention concerns a temperature conditioning support for thermal tests on small objects such as semiconductor wafers incorporating integrated circuits. It consists of a platen and a hollow base. Inside the hollow cavity is contained a serpentine whic... | 07/23/1991 |
