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| Number | Title | Issue Date |
| 7439591 | Gate layer diode method and apparatus Method, apparatus, and article of manufacture for a diode defined by a portion of a gate layer of an integrated circuit. Illustrative, non-limiting embodiments of the invention are provided, including a temperature compensated DRAM, a temperature compensated CPU, a ... | 10/21/2008 |
| 7439601 | Linear integrated circuit temperature sensor apparatus with adjustable gain and offset Embodiments of the invention include a temperature sensor apparatus, method and system for providing an output voltage response that is linear to the temperature of the integrated circuit to which the temperature sensor belongs and/or the integrated circuit die on w... | 10/21/2008 |
| 7417312 | Use of solder paste for heat dissipation A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of binder particles and filler particles, or a solder paste. As an example... | 08/26/2008 |
| 7417315 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine... | 08/26/2008 |
| 7411281 | Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same Die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. A die-down array IC device package includes a heat spreader having a central cavity. A first substrate surface is coupled to the heat... | 08/12/2008 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate.... | 06/17/2008 |
| 7381346 | Thermal interface material A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface mat... | 06/03/2008 |
| 7371615 | Heat sink and method for its production A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member ea... | 05/13/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7352062 | Integrated circuit package design A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package su... | 04/01/2008 |
| 7335534 | Semiconductor component and method of manufacture A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection moldin... | 02/26/2008 |
| 7335984 | Microfluidics chips and methods of using same Microfluidics chips and methods of use are described, comprising a pair of wafers, at least one having a patterned surface, and two polymeric barrier films between the wafers conforming to the patterned surface. The polymeric barrier films allow the wafers of the in... | 02/26/2008 |
| 7327027 | Thermal interface structure with integrated liquid cooling and methods A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are... | 02/05/2008 |
| 7317248 | Memory module having memory chips protected from excessive heat The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected by the printed circuit board; having a buffer chip for driving the me... | 01/08/2008 |
| 7307845 | Multiple integrated circuit package module A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A c... | 12/11/2007 |
| 7256431 | Insulating substrate and semiconductor device having a thermally sprayed circuit pattern An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit pattern which is a cold sprayed thermal spray coating formed on the i... | 08/14/2007 |
| 7239002 | Integrated circuit device In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided on regions of the multi-layer wiring layer which covers the vias. An ... | 07/03/2007 |
| 7235876 | Semiconductor device having metallic plate with groove A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block between the second metallic plate and the semiconductor element; a s... | 06/26/2007 |
| 7217997 | Ground arch for wirebond ball grid arrays A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integr... | 05/15/2007 |
| 7202561 | Semiconductor package with heat dissipating structure and method of manufacturing the same A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chi... | 04/10/2007 |
| 7199467 | Semiconductor device with improved heat dissipation, and a method of making semiconductor device A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member... | 04/03/2007 |
| 7196415 | Low voltage drop and high thermal performance ball grid array package An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first surface is electrically connected through the substrate to a plurality... | 03/27/2007 |
| 7196416 | Electronic device and method of manufacturing same The electronic device (100) is a chip-on-chip construction on a lead frame (10) comprising a heat sink (13) in an encapsulation (80). The first chip (20) and the second chip (30) are mutually connected by first conductive in... | 03/27/2007 |
| 7183642 | Electronic package with thermally-enhanced lid Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package in... | 02/27/2007 |
| 7166913 | Heat dissipation for heat generating element of semiconductor device and related method A structure and method are disclosed for heat dissipation relative to a heat generating element in a semiconductor device. The structure includes a plurality of heat transmitting lines partially vertically coincidental with the heat generating element, and at least ... | 01/23/2007 |
| 7115988 | Bypass capacitor embedded flip chip package lid and stiffener The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. I... | 10/03/2006 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 7087459 | Method for packaging a multi-chip module of a semiconductor device A method for packaging a multi-chip module is carried out by connecting a first chip having thereon wafer bumps to lower parts of inner leads of TAB tapes having the inner lead and an outer lead, thereby electrical signals being communicated therebetween; connecting... | 08/08/2006 |
| 7011717 | Method for heat treatment of silicon wafers and silicon wafer According to the present invention, there are provided a method for heat treatment of silicon wafers wherein a silicon wafer is subjected to a heat treatment at a temperature of from 1000° C. to the melting point of silicon in an inert gas atmosphere, and temperatu... | 03/14/2006 |
| 6969907 | Cooling structure for multichip module A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation p... | 11/29/2005 |
| 6879008 | Integrated thermal difference sensor for power dissipating device A Seebeck effect thermal sensor is formed in an integrated fashion with a power-dissipating device such as a power MOSFET. The integrated device generates a temperature difference between a relatively cold peripheral area and a relatively warm central area, the temp... | 04/12/2005 |
| 6694282 | Method and device for determining an operating temperature of a semiconductor component A method and a device determine an operating temperature of a semiconductor component during operation, wherein the semiconductor component has a PROM memory area which can be read from the outside. The device further has a programming device for programm... | 02/17/2004 |
| 6674623 | Microcomputer equipped with built-in temperature sensor In a microcomputer equipped with a built-in temperature sensor, diodes as a temperature sensor are incorporated in a pair of circuit blocks, respectively, and placed in opposite polarity connection to each other. When detecting a temperature of the microc... | 01/06/2004 |
| 6672381 | Multi-load thermal regulating system with multiple serial evaporators A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while... | 01/06/2004 |
| 6671152 | Power MOS transistor with overtemperature protection circuit A power MOS transistor having a PMT chip located in a transistor housing in which the temperature of the transistor barrier junction is monitored is described. Protection of the PMT chip against overload and permanent damage is guaranteed without negative... | 12/30/2003 |
| 6662865 | Multi-load thermal regulating system having electronic valve control In a thermal regulating system, individual temperatures of a plurality of components are maintained within a predetermined temperature range. This thermal regulating system includes a refrigeration system having a refrigerant contained in a refrigerant li... | 12/16/2003 |
| 6658736 | Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent A heat exchanger, for regulating the temperature of multiple integrated circuit modules, is fabricated by constructing a face on a hollow jacket such that the face consists essentially of a malleable metal with a coating of a release agent. In one embodim... | 12/09/2003 |
| 6662136 | Digital temperature sensor (DTS) system to monitor temperature in a memory subsystem A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperatu... | 12/09/2003 |
| 6647310 | Temperature control of an integrated circuit An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying and in thermal contact with the microprocessor or integrat... | 11/11/2003 |
| 6621703 | Automotive bridge rectifier assembly with thermal protection A rectifier assembly employs a set of diodes to rectify alternating current from an alternator to direct current for use by the electrical system of an automobile. The rectifier includes a plurality of thermal safety disconnects coupled along circuit path... | 09/16/2003 |
