Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 7443027 | Electronic device having coalesced metal nanoparticles An apparatus composed of: (a) a substrate; and (b) a deposited composition comprising a liquid and a plurality of metal nanoparticles with a covalently bonded stabilizer. ... | 10/28/2008 |
| 7429778 | Methods for forming wiring and electrode There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) met... | 09/30/2008 |
| 7345331 | Ferroelectric capacitor circuit for sensing hydrogen gas A ferroelectric capacitor circuit for sensing hydrogen gas having a closed integrated circuit package, a ferroelectric capacitor within the closed integrated circuit package, the ferroelectric capacitor having a bismuth oxide based ferroelectric layer being able to ... | 03/18/2008 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic... | 10/02/2007 |
| 7262498 | Assembly with a ring and bonding pads formed of a same material on a substrate An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material. ... | 08/28/2007 |
| 7253523 | Reworkable thermal interface material A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the ... | 08/07/2007 |
| 7235871 | Stacked microelectronic dies An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device adjacent to a support member having support member circuitry, with the fi... | 06/26/2007 |
| 7227240 | Semiconductor device with wire bond inductor and method A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L... | 06/05/2007 |
| 7202154 | Suspension for filling via holes in silicon and method for making the same A metallization process and material system for metallizing either blind or through vias in silicon, involving forming a low coefficient of thermal expansion composite or suspension, relative to pure metals, such as copper, silver, or gold, and filling the via holes... | 04/10/2007 |
| 7148562 | Power semiconductor device and power semiconductor module A plurality of power semiconductor chips (power transistors or the like) are arranged, being separated from each other with a free space of a terminal board interposed therebetween. A radiating block is in contact with an insulating layer (a package and grease below... | 12/12/2006 |
| 7091603 | Semiconductor device In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the principal front surface side of the semiconductor chips, wherein subst... | 08/15/2006 |
| 6699304 | Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom Provided are palladium-containing powders and a method and apparatus for manufacturing the palladium-containing particles of high quality, of a small size and narrow size distribution. An aerosol is generated from liquid feed and sent to a furnace, where ... | 03/02/2004 |
| 6679937 | Copper powders methods for producing powders and devices fabricated from same Copper metal powders, methods for producing copper metal powders and products incorporating the powders. The copper metal powders have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the metal partic... | 01/20/2004 |
| 6669079 | Conductive paste and semiconductor component having conductive bumps made from the conductive paste A conductive paste (16) for use in making conductive bumps (18) and a method for using the conductive paste to make conductive bumps (18) on a substrate (10). The conductive paste (16) is formed by combining a tin alloy with a flux composition containing ... | 12/30/2003 |
| 6660185 | Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same Photoluminescent phosphor powders and a method for making phosphor powders. The phosphor powders have a small particle size, narrow particle size distribution and are substantially spherical. The method of the invention advantageously permits the economic... | 12/09/2003 |
| 6659004 | Screen printing paste, screen printing method, and baked thick film body A screen printing paste from which a fine pattern can be formed precisely is provided by setting the viscosity at a shear rate of 4 sec-1 to be not less than about 40 Pa.multidot.sec and the viscosity at a shear rate of 10 sec-1 to b... | 12/09/2003 |
| 6660680 | Electrocatalyst powders, methods for producing powders and devices fabricated from same Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of pre... | 12/09/2003 |
| 6658733 | Method of manufacturing via interconnection of glass-ceramic wiring board A via interconnection of a glass-ceramic wiring board is made by blending a copper powder to a vehicle including a cellulose derivative, adding a metal oxide powder having a mean particle diameter of from at least 1 μm to at most 4 μm to the vehicle and... | 12/09/2003 |
| 6645398 | Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same. The powders have a small particle size, narrow particle size distribution and are substantially spherical. The method of the invention permits the cont... | 11/11/2003 |
| 6635348 | Aerosol method and apparatus, particulate products, and electronic devices made therefrom Provided is an aerosol method, and accompanying apparatus, for preparing powdered products of a variety of materials involving the use of an ultrasonic aerosol generator (106) including a plurality of ultrasonic transducers (120) underlying and ultrasonic... | 10/21/2003 |
| 6632532 | Particle material anisotropic conductive connection and anisotropic conductive connection material A particle material for anisotropic conductive connection, is comprised of a conductive particle and an insulating resin layer covering the surface thereof, wherein the insulating resin layer includes an insulating gelled resin with a gel proportion of at... | 10/14/2003 |
| 6630742 | Method for forming bumps, semiconductor device, and solder paste The present invention relates to a method for forming bumps on a substrate provided with electrode pads. The method includes providing a mask having openings corresponding to the electrode pads, filling each of the openings with a solder paste, and heat t... | 10/07/2003 |
| 6623663 | Electroconductive paste and method for manufacturing a multilayer ceramic electronic part using the same An electroconductive paste is provided containing from about 5% to 18% by weight of an organic vehicle comprising a solvent and a binder, from about 80% to 93% by weight of an electroconductive metal powder in a spherical or granular shape and with a part... | 09/23/2003 |
| 6620345 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being har... | 09/16/2003 |
| 6602446 | Electrically conductive paste and method of forming circuit An electrically conductive paste is provided in that complexes A each made up of an electrically conductive filler 1 and a heating element 3 adapted to generate heat on electromagnetic induction are compounded with a resin 5.... | 08/05/2003 |
| 6599833 | Method and article for filling apertures in a high performance electronic substrate The present invention provides a method of filling an at least one aperture in a semiconductor substrate by placing a sacrificial carrier structure on a surface of the substrate, wherein the structure comprises, a first layer, a fill material over the fir... | 07/29/2003 |
| 6596052 | Ultrafine nickel powder Provided is an ultrafine nickel powder suitable for a laminated ceramic capacitor electrode material. According to the ultrafine nickel powder, cracks and/or delamination are not liable to generate in the process for producing a ceramic capacitor, and its... | 07/22/2003 |
| 6592943 | Stencil and method for depositing solder A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also provided such as to have a stencil aperture and a coeffici... | 07/15/2003 |
| 6583201 | Conductive materials with electrical stability for use in electronics devices An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the elec... | 06/24/2003 |
| 6580169 | Method for forming bumps, semiconductor device, and solder paste The present invention relates to a method for forming bumps on a substrate provided with electrode pads. The method includes providing a mask having openings corresponding to the electrode pads, filling each of the openings with a solder paste, and heat t... | 06/17/2003 |
| 6579474 | Conductive composition A conductive composition, and articles and methods using the conductive composition are disclosed.... | 06/17/2003 |
| 6565917 | Method of forming features on a ceramic substrate using platible pastes A paste for one of a via and an external feature, such as a pad, tab, or line, of a ceramic substrate, includes at least one of titania and zirconia, and a filler material mixed with the at least one of titania and zirconia. Further, the via structure or ... | 05/20/2003 |
| 6555022 | Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same Phosphor powders and a method for making phosphor powders. The powders are oxygen-containing, such as metal oxides, silicates, borates or titanates and have a small particle size, narrow particle size distribution and are substantially spherical. The meth... | 04/29/2003 |
| 6544638 | Electronic chip package An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temp... | 04/08/2003 |
| 6530972 | Method for preparing metal powder A method for preparing a highly crystallized metal powder, involving the steps of: supplying at least one heat-decomposable metal compound powder into a reaction vessel using a carrier gas; and forming a metal powder by heating the metal compound powder i... | 03/11/2003 |
| 6518163 | Method for forming bumps, semiconductor device, and solder paste The present invention relates to a bump formation method, comprising the steps of providing a mask, in which a plurality of openings have been formed corresponding to a plurality of electrode pads, to a substrate provided with this plurality of electrode ... | 02/11/2003 |
| 6510059 | Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows co... | 01/21/2003 |
| 6506448 | Method of protective coating BGA solder alloy spheres A method of efficiently coating surfaces of solder alloy spheres by a vapor deposition process using a solvent-based coating solution including a low viscosity organic material and at least one solute, such as a surfactant. The method surface coats solder... | 01/14/2003 |
| 6506321 | Silicon based conductive material and process for production thereof A silicon based conductive material based on a semiconductor silicon and having an electric resistivity of 10-3 (Ω.multidot.m) or less at ambient temperature which has been unattainable heretofore, while facilitating production and handling. A... | 01/14/2003 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the... | 11/05/2002 |
