Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 6670634 | Silicon carbide interconnect for semiconductor components An interconnect for semiconductor components includes a substrate, and interconnect contacts on the substrate for electrically engaging component contacts on the components. The interconnect contacts include silicon carbide conductive layers, and conducto... | 12/30/2003 |
| 6620650 | Chip package and method for manufacturing the same In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ba... | 09/16/2003 |
| 6559528 | Semiconductor device and method for the fabrication thereof Disclosed is a semiconductor device 10 comprising a first semiconductor element 11 with an arrangement of first element electrodes 12, a second semiconductor element 13 with an arrangement of second element electrodes 14, a connection member 15 electrical... | 05/06/2003 |
| 6506321 | Silicon based conductive material and process for production thereof A silicon based conductive material based on a semiconductor silicon and having an electric resistivity of 10-3 (Ω.multidot.m) or less at ambient temperature which has been unattainable heretofore, while facilitating production and handling. A... | 01/14/2003 |
| 6249053 | Chip package and method for manufacturing the same In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ba... | 06/19/2001 |
| 6236061 | Semiconductor crystallization on composite polymer substrates A structure and methodology for providing electronic devices comprised of semiconductor materials deposited and crystallized using a pulsed laser source on oxide and/or metal layers on polymeric and polymer composite substrates of low coefficient of therm... | 05/22/2001 |
| 6002578 | Ceramic substrate, circuit substrate and electronic circuit substrate by use thereof and method for preparing ceramic substrate A ceramic substrate comprises having two or more functional portions separated from each other, by providing a first region comprising a first dielectric porcelain having an insulating layer at the crystal grain boundaries of a semiconductor porcelain con... | 12/14/1999 |
| 5955179 | Coating for the structured production of conductors on the surface of electrically insulating substrates A coating for the structured production of conductors on the surface of electrically insulating substrates, in particular for producing sensor elements and printed circuit boards. The coating is formed from a doped tin oxide layer having the composition S... | 09/21/1999 |
| 5855993 | Electronic devices having metallurgies containing copper-semiconductor compounds Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging ... | 01/05/1999 |
| 5049978 | Conductively enclosed hybrid integrated circuit assembly using a silicon substrate A conductively enclosed hybrid integrated circuit assembly for use with microwave and millimeter wave signals is disclosed. The enclosure utilizes a silicon substrate into which recesses are formed by conventional silicon etching processes to support indi... | 09/17/1991 |
| 4589008 | Apparatus for electrically joining the ends of substantially parallel semiconductor lines Apparatus, comprising a series of staggered metal contacts, is used to join adjacent ends of adjacent sets of substantially parallel semiconductor lines. The lines of one set can have a conductivity type opposite that of the lines of the adjacent set. Als... | 05/13/1986 |
