Quotables
"Fooling around with alternating current is just a waste of time. Nobody will use it, ever."
Thomas Edison ; 1889
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7394028 | Flexible circuit substrate for flip-chip-on-flex applications A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical t... | 07/01/2008 |
| 7385298 | Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component mounted... | 06/10/2008 |
| 7385297 | Under-bond pad structures for integrated circuit devices An under bond pad structure is described for integrated circuit dice are that have active circuits located below at least some of the bond pads. The metallization layers interconnection structures within the die are arranged so that electrically conductive vias do n... | 06/10/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7368375 | Electronic component with compliant elevations having electrical contact areas and method for producing it An electronic component includes compliant elevations having electrical contact areas for contact-connecting the component to an electronic circuit. The compliant elevations are arranged on a surface of the component and the electrical contact areas are arranged on ... | 05/06/2008 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 12/11/2007 |
| 7298042 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the inte... | 11/20/2007 |
| 7274098 | Chip packaging structure without leadframe A chip packaging structure without leadframe includes a bare chip having one surface provided with a plurality of contacts, and an adhesive and a fixing layer sequentially attached to the surface of the bare chip with the contacts, and a plurality of lead wires sand... | 09/25/2007 |
| 7268438 | Semiconductor element including a wet prevention film A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc... | 09/11/2007 |
| 7262510 | Chip package structure A process for fabricating a chip package structure with the following steps is provided. First, a chip having an active surface is provided. A plurality of solder bumps is disposed on the active surface. Then, a polymer material including flux is placed on the surfa... | 08/28/2007 |
| 7262498 | Assembly with a ring and bonding pads formed of a same material on a substrate An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material. ... | 08/28/2007 |
| 7230332 | Chip package with embedded component A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes a plurality of first pads on a surface thereof. The interconnection s... | 06/12/2007 |
| 7227249 | Three-dimensional stacked semiconductor package with chips on opposite sides of lead A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on opposite sides of the lead, and the wire bonds contact the same side of t... | 06/05/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7180170 | Lead-free integrated circuit package structure An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive mate... | 02/20/2007 |
| 7141869 | Electronic package for image sensor, and the packaging method thereof A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defin... | 11/28/2006 |
| 7132742 | Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the inte... | 11/07/2006 |
| 6939735 | Microelectronic assembly formation with releasable leads A first microelectronic element is provided with leads having anchor ends connected to contacts and tip ends moveable with respect to the first microelectronic element. The leads can be provided on a carrier sheet that is assembled to the first microelectronic eleme... | 09/06/2005 |
| 6694613 | Method for producing a printed-circuit board having projection electrodes A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste; compressing the prepreg under heat to cure the prepreg an... | 02/24/2004 |
| 6693359 | High density wire bonding pads for semiconductor package A semiconductor package, which is to attach an electric device, such as a die, thereon and electrically connect therewith, has a substrate with a conductor pattern thereon. The conductor pattern consists of a plurality of traces in a specific layout. The ... | 02/17/2004 |
| 6690081 | Compliant wafer-level packaging devices and methods of fabrication Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer lay... | 02/10/2004 |
| 6690188 | Method of testing a semiconductor device A method testing a semiconductor device mounted upon an interposer. The interposer electrically couples the semiconductive device to an electrical apparatus and includes (i) a substrate comprised of an electrically insulating, thermally conductive ceramic... | 02/10/2004 |
| 6685817 | Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ... | 02/03/2004 |
| 6686222 | Stacked semiconductor device manufacturing method In a semiconductor device manufacturing method, a semiconductor element is mounted on a substrate including first connection electrodes, first interconnections electrically connected to the first connection electrodes and a first alignment mark with the s... | 02/03/2004 |
| 6682998 | Methods for bumped die and wire bonded board-on-chip package Methods for making a semiconductor assembly and, specifically, interconnecting a semiconductor die to a carrier substrate. The carrier substrate includes a first surface and a second surface with at least one opening therethrough. The die includes an acti... | 01/27/2004 |
| 6683387 | Flip chip carrier package with adapted landing pads A carrier member is provided that has a plurality of landing pads thereon where at least one of the landing pads has a depression therein to hold at least one solder terminal of a device to be mounted thereto. Embodiments include a ceramic or a bismaleimi... | 01/27/2004 |
| 6680217 | Apparatus for providing mechanical support to a column grid array package An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate h... | 01/20/2004 |
| 6670718 | Wiring board utilizing a conductive member having a reduced thickness In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and ... | 12/30/2003 |
| 6669489 | Interposer, socket and assembly for socketing an electronic component and method of making and using same Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, an... | 12/30/2003 |
| 6667190 | Method for high layout density integrated circuit package substrate This invention relates to high layout density integrated circuit package substrate and a method for the same with a non-photo type mask. A solder wettable metal is used as the material of the bump pads and a non-photo type mask layer with high reliability... | 12/23/2003 |
| 6667556 | Flip chip adaptor package for bare die A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circu... | 12/23/2003 |
| 6664131 | Method of making ball grid array package with deflectable interconnect A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the can... | 12/16/2003 |
| 6665190 | Modular PC card which receives add-in PC card modules A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Car... | 12/16/2003 |
| 6664637 | Flip chip C4 extension structure and process An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a conductive structure that couples a first substrate to a second substrate. The first substrate may include a chip or a module. The second substrate m... | 12/16/2003 |
| 6664621 | Semiconductor chip package with interconnect structure An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bon... | 12/16/2003 |
| 6664620 | Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer An integrated circuit die and/or package. An apparatus is described having a substrate with a central region and an outer region. A first plurality of electrical connections is spaced apart by a first distance on the outer region of the substrate. A secon... | 12/16/2003 |
| 6661098 | High density area array solder microjoining interconnect structure and fabrication method A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint receptacles with an adhesion layer, barrier layer and a noble me... | 12/09/2003 |
| 6660946 | Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin A pin standing resin substrate comprises: a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface; and a pin solder-jointed ... | 12/09/2003 |
| 6658728 | Method for fabricating a spring structure on a substrate Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-a... | 12/09/2003 |
