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| Number | Title | Issue Date |
| 7414319 | Semiconductor chip assembly with metal containment wall and solder terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pa... | 08/19/2008 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a... | 05/13/2008 |
| 7361937 | White-light emitting device and the use thereof A white-light emitting device includes a first die and a second die. The first die has a first semiconductor light-emitting layer emitting a first primary color light. The second die has a second semiconductor light-emitting layer emitting a second primary color lig... | 04/22/2008 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7288847 | Assembly including a circuit and an encapsulation frame, and method of making the same An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall t... | 10/30/2007 |
| 7268439 | Semiconductor device having resin-sealed area on circuit board thereof A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being cr... | 09/11/2007 |
| 7247937 | Mounting pad structure for wire-bonding type lead frame packages A chip package having a lead frame, a chip, a plurality of bonding wires, and an insulation material is provided. The lead frame comprises a die pad, a plurality of leads, a plurality of signal pads and a plurality of non-signal pads. The signal pads and non-signal ... | 07/24/2007 |
| 7241645 | Method for assembling a ball grid array package with multiple interposers Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second surface of the first stiffener is attached to a first surface of a sec... | 07/10/2007 |
| 7230320 | Electronic circuit device with reduced breaking and cracking In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal membe... | 06/12/2007 |
| 7227198 | Half-bridge package A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated di... | 06/05/2007 |
| 7211451 | Process for producing a component module A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps: arranging separated components on a surface-adhesive fil... | 05/01/2007 |
| 7190069 | Method and system of tape automated bonding A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of t... | 03/13/2007 |
| 7176506 | High frequency chip packages with connecting elements A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting u... | 02/13/2007 |
| 7148564 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadfr... | 12/12/2006 |
| 7119423 | Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument A semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. The first group of leads extends in a direction away from the second group of el... | 10/10/2006 |
| 7090482 | Semiconductor device package manufacturing method and semiconductor device package manufactured by the method A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplasti... | 08/15/2006 |
| 6703700 | Semiconductor packaging structure A semiconductor packaging structure mainly has a lead frame with a die pad and a plurality of leads, a wall portion formed by molding compound positioned around a periphery of the lead frame, a chip mounted on the die pad and electrically connected with t... | 03/09/2004 |
| 6702624 | Electronic component in which an insert member is tightly held by a resin portion and prevented from deformation thereof An electronic component has an insert member embedded in a resin portion by an insert molding method, with a part of the insert member exposed at an outer surface of the resin portion. At least a part of the exposed portion of the insert member is depress... | 03/09/2004 |
| 6696753 | Enhancement of wire bondability in semiconductor device package A semiconductor device package includes a semiconductor device, a resin casing, a plurality of leads, and a plurality of bonding wires. The semiconductor device includes a plurality of bonding pads. The resin casing has a device-mounting surface. The devi... | 02/24/2004 |
| 6696752 | Encapsulated semiconductor device with flash-proof structure An encapsulated semiconductor device includes a lead frame formed with a flash-proof body. The flash-proof body includes a dam bar formed on atop surface of the lead frame and a tape adhered to a bottom surface of the lead frame, where the dam bar is atta... | 02/24/2004 |
| 6664616 | Semiconductor device and manufacturing method thereof A semiconductor chip 2 is disposed within a device hole as formed in a tape base material 1a of a tape carrier 1, which chip is smaller in thickness than the tape base material 1a, and then sealing is performed using a seal resin 3 to permit both the prin... | 12/16/2003 |
| 6665190 | Modular PC card which receives add-in PC card modules A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Car... | 12/16/2003 |
| 6660562 | Method and apparatus for a lead-frame air-cavity package Embodiments provide a method, article of manufacture, and apparatus for providing a component package for components such as integrated circuits. In one embodiment, a carrier includes a plurality of sidewalls formed thereon to form a component package ass... | 12/09/2003 |
| 6643919 | Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used to house an optically-sensitive semiconductor device such ... | 11/11/2003 |
| 6627824 | Support circuit with a tapered through-hole for a semiconductor chip assembly A support circuit is adapted to be mechanically and electrically coupled to a semiconductor chip such that the support circuit and the chip in combination form a semiconductor chip assembly. The support circuit includes an insulative base and a conductive... | 09/30/2003 |
| 6617510 | Stress relief bend useful in an integrated circuit redistribution patch A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free ... | 09/09/2003 |
| 6602735 | Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips A lead frame for a semiconductor chip package includes a frame body and at least two chip-receiving windows formed in the frame body. Each chip-receiving window receives a respective integrated circuit chip therein. A plurality of internal connection lead... | 08/05/2003 |
| 6577000 | Premold type semiconductor package A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin ... | 06/10/2003 |
| 6548152 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and bec... | 04/15/2003 |
| 6541851 | Lead frame for a semiconductor device In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or... | 04/01/2003 |
| 6522555 | Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein a... | 02/18/2003 |
| 6518501 | Electronic part and method of assembling the same An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the to... | 02/11/2003 |
| 6489572 | Substrate structure for an integrated circuit package and method for manufacturing the same A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each othe... | 12/03/2002 |
| 6486548 | Semiconductor module and power converting apparatus using the module A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor... | 11/26/2002 |
| 6483040 | Package and method of manufacturing the same The present invention provides a package whose heat dissipation performance by a semiconductor device has been improved, which synchronizes with the rapid development of high transmission density in multiplex communications. In place of the conventional p... | 11/19/2002 |
| 6476469 | Quad flat non-leaded package structure for housing CMOS sensor A quad flat non-leaded package structure for housing a sensor. The package includes a die pad, a plurality of leads, a die, a plurality of bonding wires, a packaging plastic body and a lid cover. A plurality of supporters are formed near the edges on the ... | 11/05/2002 |
| 6476478 | Cavity semiconductor package with exposed leads and die pad A semiconductor chip package and a method of making the package are disclosed. The method includes forming a lead frame having a die pad and leads. At least one of the leads has a tab projecting upward and laterally from a body of the lead. In one embodim... | 11/05/2002 |
| 6469260 | Wiring boards, semiconductor devices and their production processes A wiring board comprising a substrate having applied on the same side surface thereof one or more terminals for connecting a semiconductor element and one or more terminals for external connection, in which the terminals for connecting the semiconductor e... | 10/22/2002 |
| 6465279 | Lead frame and production method thereof, and semiconductor device and fabrication method thereof A lead frame comprises: outer leads formed by a metal base member; first interconnection film portions formed by a metal plating layer, each of which is disposed inside the outer leads in such a manner as to be connected to an inner end of one principal p... | 10/15/2002 |
