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| Number | Title | Issue Date |
| 7432585 | Semiconductor device electronic component, circuit board, and electronic device A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a co... | 10/07/2008 |
| 7417306 | Apparatuses and methods for forming electronic assemblies Apparatuses and methods for forming microelectronic assemblies are claimed. One embodiment of the invention includes a contact smart card wherein fluidic self assembly is used to build the microelectronic structures on the microelectronic assembly such that a contac... | 08/26/2008 |
| 7411284 | Accessible electronic storage apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 08/12/2008 |
| 7405470 | Adaptable electronic storage apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 07/29/2008 |
| 7397140 | Chip module A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. ... | 07/08/2008 |
| 7375421 | High density multilayer circuit module Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit modul... | 05/20/2008 |
| 7348662 | Composite multi-layer substrate and module using the substrate A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and... | 03/25/2008 |
| 7332798 | Non-contact ID card and manufacturing method thereof Provided is a non-contact ID card which is superior in the productivity and the electrical properties, and a method capable of manufacturing such non-contact ID card. The non-contact ID card of the present invention is characterized in that the non-contact ID card c... | 02/19/2008 |
| 7320738 | Method for encapsulation of a chip card and module obtained thus Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided t... | 01/22/2008 |
| 7312528 | Semiconductor device having antenna connection electrodes A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of the semiconductor chip compared to the first and second antenna connec... | 12/25/2007 |
| 7294917 | IC tag The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit whi... | 11/13/2007 |
| 7288834 | Semiconductor device, carrier, card reader, methods of initializing and checking authenticity The semiconductor device has a security coating with embedded magnetic particles and magnetoresistive sensors. This renders possible a measurement of the impedance of security elements defined by magnetoresistive sensors and security coating. If initial values of th... | 10/30/2007 |
| 7264992 | Removable flash integrated memory module card and method of manufacture A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device throu... | 09/04/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7208823 | Semiconductor arrangement comprising transistors based on organic semiconductors and non-volatile read-write memory cells A semiconductor arrangement is disclosed, having transistors based on organic semiconductors and non-volatile read/write memory cells. The invention relates to a semiconductor arrangement, constructed from transistors, in the case of which the semiconductor path is ... | 04/24/2007 |
| 7193305 | Memory card ESC substrate insert A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and... | 03/20/2007 |
| 7170162 | Chip embedded package structure A chip embedded package structure is provided. A stiffener is disposed on a tape. The tape has at least an alignment mark and the stiffener has at least a chip opening. A chip having a plurality of bonding pads thereon is disposed on the tape within the chip opening... | 01/30/2007 |
| 7132746 | Electronic assembly with solder-bonded heat sink A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the h... | 11/07/2006 |
| 7112875 | Secure digital memory card using land grid array structure A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted... | 09/26/2006 |
| 7095104 | Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same An approach to DRAM memory chip packaging leveraging the chip center position for wire bond pads to minimize time-of-flight and impedance effects resulting from stacking in a BGA application. A top layer of a dual device stack of center bus chips is stacked with an ... | 08/22/2006 |
| 6667192 | Device and method for making devices comprising at least a chip fixed on a support A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a bump contact in weldable material. The bump contact has a... | 12/23/2003 |
| 6660557 | Method of manufacturing an electronic device The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings ea... | 12/09/2003 |
| 6642611 | Storage apparatus, card type storage apparatus, and electronic apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 dispose... | 11/04/2003 |
| 6635968 | Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal A semiconductor device manufacturing method is used for packaging a thin semiconductor chip in an economical manner. A semiconductor chip having one electrode terminal, a first member having a first conductor on its surface, and a second member having a s... | 10/21/2003 |
| 6624005 | Semiconductor memory cards and method of making same Alternative methods for making memory cards for computers and such eliminate a need for a separate external housing and a separate chip encapsulation step and enable more memory to be packaged in a same-sized card. One of said methods includes providing a... | 09/23/2003 |
| 6589855 | Methods of processing semiconductor wafer and producing IC card, and carrier The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base... | 07/08/2003 |
| 6580369 | Electronic tag assembly and method therefor An electronic tag assembly (100) includes a substrate (102) having an antenna pattern (104, 106) disposed thereon, an integrated circuit die (108) having electrical interface terminals (204, 206) that directly contact or interface with the antenna pattern... | 06/17/2003 |
| 6576990 | Stress-free silicon wafer and a die or chip made therefrom and method A stress-free wafer comprising a substrate formed of a semiconductor material having front side and back side planar and parallel surfaces and having a thickness which can be as thin as 1 to 2 mils. The front side has electronic circuitry therein with exp... | 06/10/2003 |
| 6573158 | Methods of processing semiconductor wafer and producing IC card, and carrier The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base... | 06/03/2003 |
| 6565008 | Module card and a method for manufacturing the same A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module c... | 05/20/2003 |
| 6566163 | Method for making a contactless card with antenna connected with soldered wires The invention concerns a method of making contactless smart cards. To facilitate the fixing of an integrated circuit chip in a contactless smart card, and in particular the chip connection with the antenna incorporated in the card, the method consists in ... | 05/20/2003 |
| 6551449 | Thin electronic circuit component and method and apparatus for producing the same Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and t... | 04/22/2003 |
| 6492717 | Smart card module and method of assembling the same A module (10) for use with a smart card (50) is disclosed. The module (10) includes a substrate (14) having a first side (16) and a second side (18). The first and second sides each have deposited thereon a metallic layer (19, 21), with the substrate (14)... | 12/10/2002 |
| 6486541 | Semiconductor device and fabrication method A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower sur... | 11/26/2002 |
| 6446874 | Method of fabricating an electronic module or label, module or label obtained and medium including a module or label of this kind The present invention relates to a method of fabricating at least one electronic module or label which is adapted to be rendered adhesive. The method includes the following steps: an insulative film is supplied including at least one contact and/or antenn... | 09/10/2002 |
| 6440773 | Semiconductor device An IC card strong against bending and with a thin semiconductor chip mounted thereon is disclosed which is further provided with a reinforcing plate to reduce damage of the semiconductor chip caused by a point pressure. The IC card is employable even unde... | 08/27/2002 |
| 6435414 | Electronic module for chip card The invention concerns an electronic module that is designed to be fixed in an electronic device in the form of a card. The module includes a medium having at least a surface provided with contact pads and a microcircuit which is fixed on the medium and h... | 08/20/2002 |
| 6433285 | Printed wiring board, IC card module using the same, and method for producing IC card module The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the inv... | 08/13/2002 |
| 6420660 | Film used as a substrate for integrated circuits The chips for chip cards are customarily provided on a film strip which consists of a synthetic foil and a conductor track pattern and are connected to the conductor track pattern by way of bonding wires. Automatic mounting is made possible by the use of ... | 07/16/2002 |
| 6404643 | Article having an embedded electronic device, and method of making same A card has an electronic device, such as an integrated circuit, a conductive, resistive or capacitive network, or other electronic device, embedded therein. The card, sometimes referred to as a "smart card," has the electronic device mounted to a substrat... | 06/11/2002 |
