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| Number | Title | Issue Date |
| 7443021 | Electronic component packaging structure and method for producing the same An electronic component packaging structure, includes: circuit boards each having a wiring at least on a surface thereof; and an electronic component package secured between the circuit boards. The electronic component package includes at least one electronic compon... | 10/28/2008 |
| 7411289 | Integrated circuit package with partially exposed contact pads and process for fabricating the same A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bond... | 08/12/2008 |
| 7408244 | Semiconductor package and stack arrangement thereof A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor pac... | 08/05/2008 |
| 7408251 | Semiconductor packaging device comprising a semiconductor chip including a MOSFET A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing member, the semiconductor chip having a source electrode and a gate ... | 08/05/2008 |
| 7402901 | Semiconductor device and method of manufacturing semiconductor device The present invention provides a semiconductor device that is inexpensive and can suppress signal transmission delay, and a manufacturing method thereof. The semiconductor device includes: a plurality of semiconductor chips; a semiconductor substrate that has, on th... | 07/22/2008 |
| 7394152 | Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same The present invention provide a wafer level chip size packaged chip device with a N-shape junction at which external leads electrically connect to peripheral arrayed compatible pads and a method of fabricating the same. In the wafer level chip size package, with suc... | 07/01/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
| 7372133 | Microelectronic package having a stiffening element and method of making same A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact l... | 05/13/2008 |
| 7338841 | Leadframe with encapsulant guide and method for the fabrication thereof A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant guides are formed angled on a plurality of the leads to push the leads... | 03/04/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7314820 | Carrier-free semiconductor package and fabrication method thereof A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically co... | 01/01/2008 |
| 7301227 | Package lid or heat spreader for microprocessor packages A package for an integrated circuit (IC) die comprises a substrate and a lid. The substrate has an upper surface facing an interior of the package and a lower surface facing an exterior of the package. The upper surface of the substrate carries an IC die and provide... | 11/27/2007 |
| 7291904 | Downsized package for electric wave device A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrical... | 11/06/2007 |
| 7285850 | Support elements for semiconductor devices with peripherally located bond pads A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector o... | 10/23/2007 |
| 7270867 | Leadless plastic chip carrier A process for fabricating a leadless plastic chip carrier includes selectively depositing a plurality of base layers on a first surface of a base of a leadframe strip to at least partially define a die attach pad and at least one row of contact pads. At least one fu... | 09/18/2007 |
| 7247937 | Mounting pad structure for wire-bonding type lead frame packages A chip package having a lead frame, a chip, a plurality of bonding wires, and an insulation material is provided. The lead frame comprises a die pad, a plurality of leads, a plurality of signal pads and a plurality of non-signal pads. The signal pads and non-signal ... | 07/24/2007 |
| 7193305 | Memory card ESC substrate insert A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and... | 03/20/2007 |
| 7183619 | Surface acoustic wave apparatus A SAW apparatus is provided capable of realizing a small size without adverse affect while mounting the active surfaces of the semiconductor integrated circuit and the surface acoustic wave element. The SAW apparatus comprises a semiconductor IC and a SAW element. T... | 02/27/2007 |
| 7170183 | Wafer level stacked package Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically con... | 01/30/2007 |
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower ... | 12/26/2006 |
| 7098528 | Embedded redistribution interposer for footprint compatible chip package conversion An embedded redistribution interposer is disclosed for providing footprint compatible chip package migration in which a die designed to be mounted into chip package is originally implemented using a first type of silicon platform and is subsequently redesigned for a... | 08/29/2006 |
| 7087461 | Process and lead frame for making leadless semiconductor packages A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. Each lead of the lead frame has a first portion, a second portion and a third portion connecting the first port... | 08/08/2006 |
| 7067908 | Semiconductor package having improved adhesiveness and ground bonding A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation m... | 06/27/2006 |
| 6909166 | Leads of a no-lead type package of a semiconductor device The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the peri... | 06/21/2005 |
| 6700181 | Method and system for broadband transition from IC package to motherboard A method and system for broadband transition between an integrated circuit (IC) package and a printed wiring board (PWB). A vertical quasi-coaxial cable structure is created connecting the transmission line inside the package to the transmission line on t... | 03/02/2004 |
| 6693243 | Surface mounting component and mounted structure of surface mounting component On a mounting surface of a multilayered component as a surface mounting component, an isolated electrode is arranged so as to be isolated from other terminal electrodes on the mounting surface. For solder applied to the isolated electrode, the application... | 02/17/2004 |
| 6682957 | Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof A land grid array (LGA) type semiconductor chip package includes an insulation body having a plurality of first conductive interconnections embedded therein. A cavity is formed in an upper portion of the insulation body. A plurality of first conductive in... | 01/27/2004 |
| 6682953 | Method for making a mounting structure for an electronic component having an external terminal electrode A method for manufacturing an electronic component includes forming an aggregate electronic component including a plurality of electronic components and dividing the aggregate electronic component to separate the plurality of electronic components to form... | 01/27/2004 |
| 6680526 | Socket with low inductance side contacts for a microelectronic device package A socket coupled to a circuit board to receive a package of microelectronic device has one or more electrical contacts coupled to its outer surfaces. Each contact provides a low inductance shunt connection from the side of the package to the circuit board... | 01/20/2004 |
| 6680528 | Electronic component and electronic equipment using the same An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability... | 01/20/2004 |
| 6675472 | Process and structure for manufacturing plastic chip carrier A process for forming a burrless castellation for a plastic chip carrier comprising forming one or more through holes in a substrate, plating the through holes with a metal to a thickness ranging from about 2 microns to about 6 microns, routing slots alon... | 01/13/2004 |
| 6665194 | Chip package having connectors on at least two sides A substrate for supporting a semiconductor chip has area array connectors on at least two surfaces to provide a large number of connectors to the chip. At least one contact on one surface is not connected to a contact on the other surface through the subs... | 12/16/2003 |
| 6661101 | Semiconductor device There is provided a semiconductor device capable of properly processing RF signals even though the number of electrodes as well as terminals for external connection is large while pitches at which the electrodes are juxtaposed are narrower than those for ... | 12/09/2003 |
| 6659334 | Method for forming end-face electrode There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid.... | 12/09/2003 |
| 6639311 | Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside ... | 10/28/2003 |
| 6635953 | IC chip package An IC chip package is constructed to comprise a substrate, a chip, adhesive means, and a cover. The substrate comprises a top side and a receiving chamber, the receiving chamber having an opening disposed in the top side. The top side of the substrate is ... | 10/21/2003 |
| 6635829 | Circuit board having side attach pad traces through buried conductive material A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge conn... | 10/21/2003 |
| 6627986 | Substrate for semiconductor device and semiconductor device fabrication using the same A substrate for a semiconductor device is provided, which prevents a semiconductor element or IC chip mounted thereon from being broken or damaged electrostatically in a fabrication process sequence or a semiconductor device. The substrate comprises (a) a... | 09/30/2003 |
| 6628043 | Electronic component and method of production thereof An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electricall... | 09/30/2003 |
| 6623663 | Electroconductive paste and method for manufacturing a multilayer ceramic electronic part using the same An electroconductive paste is provided containing from about 5% to 18% by weight of an organic vehicle comprising a solvent and a binder, from about 80% to 93% by weight of an electroconductive metal powder in a spherical or granular shape and with a part... | 09/23/2003 |
