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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 7439199 | Capacitive element, method of manufacture of the same, and semiconductor device A capacitive element is characterized by including: a base (12); a lower barrier layer (13) formed on the base (12); capacitors (Q1 and Q2) made by forming a lower electrode (14a), capacitor dielectric layers ... | 10/21/2008 |
| 7365428 | Array capacitor with resistive structure An apparatus comprises a first plurality of contacts disposed on a first side of the apparatus, adapted to engage with a first corresponding plurality of contacts on an external integrated circuit package. The apparatus further comprises a plurality of capacitive st... | 04/29/2008 |
| 7348661 | Array capacitor apparatuses to filter input/output signal An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package and an underlying substrate such as a printed circuit board. ... | 03/25/2008 |
| 7319268 | Semiconductor device having capacitors for reducing power source noise A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconducto... | 01/15/2008 |
| 7190083 | High frequency integrated circuit using capacitive bonding A high frequency integrated circuit includes a die, a package and capacitive bond. The die includes a circuit that processes a high frequency signal and also includes at least one bonding pad coupled to the circuit. The package includes a plurality of bonding posts,... | 03/13/2007 |
| 7135758 | Surface mount solder method and apparatus for decoupling capacitance and process of making A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump. The decoupling... | 11/14/2006 |
| 7122888 | Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device A semiconductor device is arranged so as to include (i) a wire L1, connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB1 connected not directly to but to one of a pair of electrod... | 10/17/2006 |
| 7091588 | Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while... | 08/15/2006 |
| 6661091 | Semiconductor device A semiconductor device comprises a die pad having an opening, a semiconductor chip located in the opening and another semiconductor chip. The semiconductor chip has a terminal surface and a non-terminal surface positioned opposite to the terminal surface.... | 12/09/2003 |
| 6643418 | Electric or opto-electric component with a packaging of plastic and a method for varying the impedance of a terminal lead of the component by attaching a dielectric plate to at least one terminal lead The invention relates to an electric or opto-electric component (1, 11) with a packaging (2, 12) of plastic, at least one electric or opto-electric integrated circuit (3, 13) arranged in the packaging (2, 12) and terminal leads (4, 14) protruding from the... | 11/04/2003 |
| 6608375 | Semiconductor apparatus with decoupling capacitor A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminal... | 08/19/2003 |
| 6538313 | IC package with integral substrate capacitor An integrated circuit package is described that includes a capacitor structure having a pair of plates separated by a dielectric material. An integrated circuit (IC) die is carried by a top surface of the first capacitor plate. The die carried by the capa... | 03/25/2003 |
| 6531765 | Interdigitated capacitor design for integrated circuit lead frames and method A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated c... | 03/11/2003 |
| 6515359 | Lead frame decoupling capacitor semiconductor device packages including the same and methods A lead frame assembly including at least two layers. A first of the lead frame layers includes a first wide, electrically conductive bus and a plurality of leads that extend substantially unidirectionally from a single edge of the lead frame assembly. The... | 02/04/2003 |
| 6515353 | Multi-layer lead frame for a semiconductor device A multilayer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a c... | 02/04/2003 |
| 6504236 | Semiconductor die assembly having leadframe decoupling characters and method A packaged integrated circuit device with a multi-level leadframe has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower leadframe and an upper leadframe, one of the leadframes being subdivided into a plurality of... | 01/07/2003 |
| 6486535 | Electronic package with surface-mountable device built therein An electronic package comprises a lead frame having a die pad for supporting a semiconductor chip. The electronic package is characterized by directly mounting at least a surface-mountable device on the lead frame thereby increasing the electric performan... | 11/26/2002 |
| 6472737 | Lead frame decoupling capacitor, semiconductor device packages including the same and methods A lead frame assembly including at least two layers. A first of the lead frame layers includes a first wide, electrically conductive bus and a plurality of leads that extend substantially unidirectionally from a single edge of the lead frame assembly. The... | 10/29/2002 |
| 6396134 | Interdigitated capacitor design for integrated circuit lead frames A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated c... | 05/28/2002 |
| 6373127 | Integrated capacitor on the back of a chip A semiconductor device is disclosed. The device includes an integrated circuit chip having integral de-coupling capacitors on the chip backside. The de-coupling capacitors includes a metal layer in intimate contact with the semiconductor substrate of the ... | 04/16/2002 |
| 6310388 | Semiconductor die assembly having leadframe decoupling characters A packaged integrated circuit device with a multi-level leadframe has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower leadframe and an upper leadframe, one of the leadframes being subdivided into a plurality of... | 10/30/2001 |
| 6307255 | Multi-layer lead frame for a semiconductor device A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a ... | 10/23/2001 |
| 6307256 | Semiconductor package with a stacked chip on a leadframe The present invention provides a leadframe package formed by flip chip on leadframe technique. The chips are face to face attached on both sides of the leadframe surface. Another embodiment according to the present invention is that the chips are back to ... | 10/23/2001 |
| 6265764 | Interdigitated capacitor design for integrated circuit lead frames A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated c... | 07/24/2001 |
| 6238950 | Integrated circuit with tightly coupled passive components A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfac... | 05/29/2001 |
| 6184574 | Multi-capacitance lead frame decoupling device A packaged integrated circuit device with a multi-level lead frame has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower lead frame and an upper lead frame, one of the lead frames being subdivided into a pluralit... | 02/06/2001 |
| 6185124 | Storage circuit apparatus A storage circuit apparatus includes a support material, a semiconductor chip on which at least one shadow RAM is integrated, a capacitor element and a circuit housing. The storage circuit shadow RAM apparatus is able to perform a STORE operation to secur... | 02/06/2001 |
| 6124630 | Multi-layer lead frame for a semiconductor device A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a ... | 09/26/2000 |
| 6114756 | Interdigitated capacitor design for integrated circuit leadframes A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated c... | 09/05/2000 |
| 6093957 | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof A lead frame structure and semiconductor package using the same and fabrication method thereof is provided that decreases noise by providing prescribed impedances for leads of a lead frame. The lead frame structure for the semiconductor package includes a... | 07/25/2000 |
| 6091144 | Semiconductor package A semiconductor package in which a semiconductor chip 16 is formed above a die pad 12 interposing a capacitor 22 therebetween, or the semiconductor chip 16 and the capacitor 22 in a vortex-shaped form are respectively formed on both faces of the die pad 1... | 07/18/2000 |
| 6054754 | Multi-capacitance lead frame decoupling device A packaged integrated circuit device with a multi-level lead frame has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower lead frame and an upper lead frame, one of the lead frames being subdivided into a pluralit... | 04/25/2000 |
| 6054764 | Integrated circuit with tightly coupled passive components A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfac... | 04/25/2000 |
| 5965936 | Multi-layer lead frame for a semiconductor device A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a ... | 10/12/1999 |
| 5945728 | Lead frame capacitor and capacitively coupled isolator circuit A capacitor is provided including first and second electrodes formed from portions of the lead frame structure used in conventional integrated circuit packaging. The electrodes are encapsulated with dielectric molding material which provides dielectric in... | 08/31/1999 |
| 5926358 | Lead frame capacitor and capacitively-coupled isolator circuit using same A capacitor is provided including first and second electrodes formed from portions of the lead frame structure used in conventional integrated circuit packaging. The electrodes are encapsulated with dielectric molding material which provides dielectric in... | 07/20/1999 |
| 5895966 | Integrated circuit and supply decoupling capacitor therefor An integrated circuit assembly is formed with an integral power supply decoupling capacitor for monolithic circuitry in a semiconductor substrate by using the substrate itself as one plate of the capacitor. A dielectric is formed on the "back" side, or su... | 04/20/1999 |
| 5847467 | Device packaging using heat spreaders and assisted deposition of wire bonds A device or die is presented which uses laser deposited leads, with a filler to bridge the gap between the die and the lead frame. The filler may be oxide, poly amide, a combination of oxide layers and poly amide layers, plastic or a plastic which has pla... | 12/08/1998 |
| 5734198 | Multi-layer lead frame for a semiconductor device A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a ... | 03/31/1998 |
| 5650357 | Process for manufacturing a lead frame capacitor and capacitively-coupled isolator circuit using same A capacitor is provided including first and second electrodes formed from portions of the lead frame structure used in conventional integrated circuit packaging. The electrodes are encapsulated with dielectric molding material which provides dielectric in... | 07/22/1997 |
