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"I hate what they've done to my child...I would never let my own children watch it. "
Vladimir Zworykin, television pioneer ; Talking about an invention in which he played a critical role.
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| Number | Title | Issue Date |
| 7414319 | Semiconductor chip assembly with metal containment wall and solder terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pa... | 08/19/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7301226 | Conductor substrate, semiconductor device and production method thereof A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and t... | 11/27/2007 |
| 6664136 | Semiconductor device and manufacturing method thereof A semiconductor device comprises: a semiconductor chip; a copper series lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are posit... | 12/16/2003 |
| 6531760 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/11/2003 |
| 6465885 | Positioning of soldering pads in semiconductor diode package The soldering pads on metal contacts for connection to the electrodes of a semiconductor diode chip are surrounded with a coating of insulating material to prevent the spreading of the molten solder, which may cause misalignment of the chip with respect t... | 10/15/2002 |
| 6204552 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/20/2001 |
| 6191492 | Electronic device including a densified region An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-... | 02/20/2001 |
| 6124642 | Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same A lead structure is provided in a semiconductor device, having a body of a lead having at least a part of which is in contact with an adhesive which bonds with an insulation tape, and a protection layer selectively provided on the body of the lead so that... | 09/26/2000 |
| 6087715 | Semiconductor device, and manufacturing method of the same To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11... | 07/11/2000 |
| 6087713 | Plastic package, semiconductor device, and method of manufacturing plastic package Disclosed is a plastic package for storing a chip, the plastic package being further improved in moisture resistance and reduced in manufacturing costs. The plastic package comprises a plastic package body for storing a chip and a lead electrically connec... | 07/11/2000 |
| 6081023 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 06/27/2000 |
| 6081035 | Microelectronic bond ribbon design An improved bond ribbon design, said bond ribbon having a dual taper that functions to localize the bending along a predetermined distribution of the bond ribbon during the bonding of the bond ribbon to an associated contact of a semiconductor chip. Use o... | 06/27/2000 |
| 6072231 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 06/06/2000 |
| 6069029 | Semiconductor device chip on lead and lead on chip manufacturing As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 05/30/2000 |
| 6046075 | Oxide wire bond insulation in semiconductor assemblies A semiconductor integrated circuit package is provided with insulated bonding wires. The semiconductor die is mounted to a base of either a leadframe or a grid-array package. A plurality of bonding wires are bonded between bonding pads on the semiconducto... | 04/04/2000 |
| 6040633 | Oxide wire bond insulation in semiconductor assemblies A semiconductor integrated circuit package is provided with insulated bonding wires. The semiconductor die is mounted to a base of either a leadframe or a grid-array package. A plurality of bonding wires are bonded between bonding pads on the semiconducto... | 03/21/2000 |
| 6018191 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 01/25/2000 |
| 5981315 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 11/09/1999 |
| 5937279 | Semiconductor device, and manufacturing method of the same To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11... | 08/10/1999 |
| 5914530 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 06/22/1999 |
| 5863817 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 01/26/1999 |
| 5821606 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 10/13/1998 |
| 5817544 | Enhanced wire-bondable leadframe A method for improving adhesion from a leadframe to a metallic wire is disclosed including using a laser beam to remove selected areas of an package adhesion enhancing layer to expose a layer on the leadframe which has a higher adhesion to metallic wires.... | 10/06/1998 |
| 5677571 | Semiconductor package having reinforced lead pins The present invention relates to a semiconductor package having lead pins of lead frame for outwardly extending terminals of electrodes of a semiconductor chip embedded in a mold resin. The semiconductor package according to the present invention comprise... | 10/14/1997 |
| 5643834 | Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers A process for manufacturing a plastic package type semiconductor device composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon ... | 07/01/1997 |
| 5622896 | Method of manufacturing a thin silicon-oxide layer A method of providing an ultra-thin ( | 04/22/1997 |
| 5612569 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/18/1997 |
| 5585667 | Lead frame for handling crossing bonding wires A method is disclosed for packaging for an integrated circuit having lead frames with closely spaced leads that are configured in such a way that the bonding wires must cross over other leads prior to bonding to the appropriate lead. The method includes t... | 12/17/1996 |
| 5530286 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 06/25/1996 |
| 5459103 | Method of forming lead frame with strengthened encapsulation adhesion This invention relates to a process for strengthening the adhesive bond between a lead frame and a plastic mold compound (350). The process involves plating the lead frame with a copper strike and selectively exposing the copper strike to an oxidizing age... | 10/17/1995 |
| 5455453 | Plastic package type semiconductor device having a rolled metal substrate A plastic package type semiconductor device is composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite... | 10/03/1995 |
| 5446315 | Resin-sealed semiconductor device containing porous fluorocarbon resin A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any... | 08/29/1995 |
| 5359224 | Insulated lead frame for integrated circuits and method of manufacture thereof An insulated lead frame is disclosed. The preferred embodiment contains a lead over chip lead frame having an aluminum oxide insulator on portions of the power supply busses where no electrical connections will be made. The aluminum oxide may be easily de... | 10/25/1994 |
| 5358904 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 10/25/1994 |
| 5319241 | Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution A conductive tape for a packaged semiconductor device is disclosed. The tape contains a first adhesive layer, a base film on top of the first adhesive layer, a conductive layer on top of the base film layer, and a second adhesive layer on top of the condu... | 06/07/1994 |
| 5315152 | Lead frame with improved adhesiveness property against plastic and plastic sealing type semiconductor packaging using said lead frame A lead frame including a matrix for the lead frame formed of a copper based alloy and an oxide layer formed on the lead frame. A copper based alloy including dispersive particles of which part distributively appears on the surface is used as a matrix for ... | 05/24/1994 |
| 5278101 | Semiconductor device and method for manufacturing the same A semiconductor device includes a first frame having a bed, a semiconductor chip mounted on the bed and having a bonding pad, a second frame having an inner lead located above the semiconductor chip, a bonding wire connecting the bonding pad of the semico... | 01/11/1994 |
| 5276351 | Electronic device and a manufacturing method for the same A method for manufacturing a lead frame comprises the steps of covering, with a cover film, a die to which an electronic device is attached and a conducting section of a lead section to be electrically connected to the die, covering the whole of the die a... | 01/04/1994 |
| 5235209 | Multi-layer lead frame for a semiconductor device with contact geometry A multi-layer lead frame for a semiconductor device comprises a lead frame body made of a metal strip having a first opening and a plurality of inner leads having respective innertips which define the opening. A metal plane independent from the lead frame... | 08/10/1993 |
