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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 7417292 | Arrangement for connecting the terminal contacts of an optoelectronic component to a printed circuit board An arrangement for connecting the terminal contacts of an optoelectronic component to electrical contacts of a printed circuit board using a flexible conductor arrangement. The flexible conductor arrangement has a planar form and includes a plurality of interconnect... | 08/26/2008 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a... | 05/13/2008 |
| 7335975 | Integrated circuit stacking system and method The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs o... | 02/26/2008 |
| 7316939 | Semiconductor device manufacturing method and manufacturing apparatus A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals ... | 01/08/2008 |
| 7279778 | Semiconductor package having a high-speed signal input/output terminal A semiconductor package including a flexible tape having a mounting portion and an extended portion, a plurality of arrayed connection electrodes provided on the mounting portion of the flexible tape, and a semiconductor chip mounted on the mounting portion of the f... | 10/09/2007 |
| 7256496 | Semiconductor device having adhesion increasing film to prevent peeling A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is... | 08/14/2007 |
| 7247951 | Chip carrier with oxidation protection layer A chip carrier comprising a laminated layer and an oxidation protection layer is provided. The oxidation protection layer is a non-electrolytic metallic coating or an organic oxidation protection film on the surface of bonding finger pads or other contacts formed by... | 07/24/2007 |
| 7224062 | Chip package with embedded panel-shaped component A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip i... | 05/29/2007 |
| 7154171 | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor A semiconductor stacking structure has a semiconductor device. A flexible substrate is coupled to a bottom surface of the semiconductor device. The flexible substrate is folded over on at least two sides to form flap portions. The flap portions are coupled to an upp... | 12/26/2006 |
| 7109575 | Low-cost flexible film package module and method of manufacturing the same Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film packa... | 09/19/2006 |
| 7105916 | Inlet for an electronic tag Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer ed... | 09/12/2006 |
| 7091595 | Semiconductor device with semiconductor chip and rewiring layer and method for producing the same The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall t... | 08/15/2006 |
| 6693346 | Semiconductor memory module having double-sided stacked memory chip layout In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of hig... | 02/17/2004 |
| 6670696 | Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof A slit is formed in a polyimide substrate and a copper wiring pattern is formed on the surface of the polyimide substrate. Moreover, solder resist, which has a young's modulus in the range of 5 kgf/mm2 to 70 kgf/mm2 and contains a fi... | 12/30/2003 |
| 6664616 | Semiconductor device and manufacturing method thereof A semiconductor chip 2 is disposed within a device hole as formed in a tape base material 1a of a tape carrier 1, which chip is smaller in thickness than the tape base material 1a, and then sealing is performed using a seal resin 3 to permit both the prin... | 12/16/2003 |
| 6664618 | Tape carrier package having stacked semiconductor elements, and short and long leads A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the per... | 12/16/2003 |
| 6653172 | Methods for providing void-free layers for semiconductor assemblies A method of treating an interposer layer includes disposing an interposer layer between a semiconductor wafer and a substrate so that voids within the interposer layer are sealed and applying pressure to substantially eliminate the voids. A method of crea... | 11/25/2003 |
| 6646335 | Flexible tape carrier with external terminals formed on interposers In order to provide a semiconductor apparatus in which both semiconductor chips and interposers are provided on a carrier tape, electrical properties can be improved using short wiring in a wiring pattern substantially symmetric with respect to the semico... | 11/11/2003 |
| 6639323 | Semiconductor device and its manufacturing method A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elast... | 10/28/2003 |
| 6637103 | Method of tape bonding A tape bonding system may include a tape and a lead coupled to the tape. The lead may have a stress relief formed along its length which is adapted to relieve stresses and strains arising from differential thermal expansion of the materials to which the t... | 10/28/2003 |
| 6630731 | Semiconductor device Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the wh... | 10/07/2003 |
| 6627478 | Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction A microelectronic assembly is made by bonding the tip ends of leads on a first element to bonding contacts on a second element. The tip ends of the leads are releasably connected to the first element, so that the leads are held in place during the bonding... | 09/30/2003 |
| 6627994 | Semiconductor device and film carrier tape The present invention is a semiconductor device with improved adhesion properties of a resin with a wiring pattern, comprising a film fragment 14 having a patterned wiring pattern 16 including a projection 17, a semiconductor chip 12 having electrodes 13 ... | 09/30/2003 |
| 6617197 | Multi row leadless leadframe package A packaging arrangement is described that utilizes a conductive panel (such as a leadless leadframe) as its base. The conductive panel has a matrix of device areas that each include a plurality of rows of contacts that are located outside of a die area. T... | 09/09/2003 |
| 6611012 | Semiconductor device Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the wh... | 08/26/2003 |
| 6608387 | Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate A semiconductor device includes a support member having first and second major surfaces and an elongate hole extending between the first and second major surfaces. The hole has first and second elongate edges extending along a side of the support member a... | 08/19/2003 |
| 6593648 | Semiconductor device and method of making the same, circuit board and electronic equipment A method of manufacturing a semiconductor device includes a step of providing a semiconductor chip having electrodes to face a tape having a plurality of first holes, a support member surrounded by the first holes, and leads extending across the first hol... | 07/15/2003 |
| 6589810 | BGA package and method of fabrication A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dens... | 07/08/2003 |
| 6589817 | Semiconductor device, method for manufacturing the same, and method for mounting the same A method for manufacturing a semiconductor device is provided. The semiconductor device includes a semiconductor chip having an edge and having a surface with a plurality of electrodes. A film is mounted over the surface of the semiconductor chip, the fil... | 07/08/2003 |
| 6580316 | Power transistor module, power amplifier and methods in the fabrication thereof The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or a ground transmitter for TV or radio, wherein said power transistor module comprises a suppo... | 06/17/2003 |
| 6573459 | Graded metallic leads for connection to microelectronic elements Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between t... | 06/03/2003 |
| 6563212 | Semiconductor device A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with ... | 05/13/2003 |
| 6555200 | Method of making semiconductor devices, semiconductor device, circuit board, and electronic apparatus A method of making semiconductor devices comprising the steps of: preparing non-defective individual film packages having good quality, wherein leads are formed and a semiconductor chip is mounted on each of the film packages; attaching each of the non-de... | 04/29/2003 |
| 6555412 | Packaged semiconductor chip and method of making same The present invention provides a packaged chip that includes at least one dam disposed between the chip and interposer, blocking an encapsulant flow path in the package formed by the assembly of the interposer and chip. In one preferred embodiment, the da... | 04/29/2003 |
| 6555898 | Dam structure for center-bonded chip package The present invention provides a packaged chip that includes at least one dam disposed between the chip and interposer, blocking an encapsulant flow path in the package formed by the assembly of the interposer and chip. In one preferred embodiment, the da... | 04/29/2003 |
| 6552419 | Semiconductor device and liquid crystal module using the same A semiconductor device using TCP structure, includes a first semiconductor chip mounted on a tape carrier by ILB and a second semiconductor chip mounted on the tape carrier by stacking onto the first semiconductor chip. The first semiconductor chip is arr... | 04/22/2003 |
| 6552427 | BGA package and method of fabrication A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dens... | 04/22/2003 |
| 6549413 | Tape ball grid array semiconductor package structure and assembly process A package structure includes a heat spreader, a ground plane affixed to the heat spreader, and a flex tape interconnect substrate affixed to the ground plane. An aperture in the ground plane reveals a die attach surface on the heat spreader, and an apertu... | 04/15/2003 |
| 6521993 | Semiconductor memory module having double-sided stacked memory chip layout In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of hig... | 02/18/2003 |
| 6517662 | Process for making semiconductor chip assembly A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded th... | 02/11/2003 |
