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| Number | Title | Issue Date |
| 7384807 | Method of fabricating vertical structure compound semiconductor devices A method of fabricating a vertical structure opto-electronic device includes fabricating a plurality of vertical structure opto-electronic devices on a crystal substrate, and then removing the substrate using a laser lift-off process. The method then fabricates a me... | 06/10/2008 |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal... | 05/06/2008 |
| 7368807 | Low cost method to produce high volume lead frames A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequent... | 05/06/2008 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabri... | 04/22/2008 |
| 7348664 | Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress... | 03/25/2008 |
| 7332375 | Method of making an integrated circuit package A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad... | 02/19/2008 |
| 7329944 | Leadframe for semiconductor device A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to... | 02/12/2008 |
| 7285845 | Lead frame for semiconductor package A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface adhesiveness and solder wettability of an Au wire, and a method of manufactur... | 10/23/2007 |
| 7278202 | Method for making overlay surface mount resistor A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween... | 10/09/2007 |
| 7268415 | Semiconductor device having post-mold nickel/palladium/gold plated leads A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end... | 09/11/2007 |
| 7262440 | Light emitting diode package and fabrication method thereof The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a packag... | 08/28/2007 |
| 7256481 | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (302) and a plurality of lead segments (303). Covering the base metal are, consecutively, a continuous nickel ... | 08/14/2007 |
| 7192809 | Low cost method to produce high volume lead frames A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequent... | 03/20/2007 |
| 7176582 | Semiconductor device and method of manufacturing same In an example embodiment, the semiconductor device comprises a carrier and a semiconductor element, such as an integrated circuit. The carrier is provided with apertures, thereby defining connecting conductors having side faces. Notches are present in the side faces... | 02/13/2007 |
| 7138707 | Semiconductor package including leads and conductive posts for providing increased functionality A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the semiconductor die, the semiconductor package includes at least one l... | 11/21/2006 |
| 7119420 | Chip packaging structure adapted to reduce electromagnetic interference A chip packaging structure adapted to reduce EMI includes a chip having contacts provided on one side thereof, and a leadframe having a plurality of leads arranged in a predetermined manner and provided at a bottom side with a conducting protrusion each for electric... | 10/10/2006 |
| 6864579 | Carrier with a metal area and at least one chip configured on the metal area A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 μm and 10 μm, is arranged on the metal area. The chip does not have a ... | 03/08/2005 |
| 6703693 | Apparatus for reversing lead frame An apparatus for reversing upper and lower surfaces of a lead frame which passes through a silver-plating process in a lead frame manufacturing process includes at least one guide rail having a curved portion for guiding the lead frame to be fallen down a... | 03/09/2004 |
| 6700188 | Low-pin-count chip package having concave die pad and/or connections pads A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip wherein the die pad and the connection pads have a concave profile. A package body is for... | 03/02/2004 |
| 6677056 | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of a current passing period of not less than 3 ms and not mor... | 01/13/2004 |
| 6667073 | Leadframe for enhanced downbond registration during automatic wire bond process A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line and an array of dots are plate... | 12/23/2003 |
| 6663980 | Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame The present invention relates to a clad sheet for lead frame which can manufacture economically and has excellent characteristics, lead frame using thereof and manufacturing method thereof. A clad sheet for lead frame is manufactured by press-bonding copp... | 12/16/2003 |
| 6656275 | Partial plating system A partial plating system able to gold plate only inner leads of a TAB frame, provided with a mask having an opening formed to correspond to a plating region of a TAB frame and provided horizontally; an elevating means for lowering the TAB frames toward th... | 12/02/2003 |
| 6653169 | Packaged semiconductor and process for manufacturing the same A method of manufacturing a packaged semiconductor device includes mounting a semiconductor device having multiple leads. The leads are formed by mounting the semiconductor device in a lead frame and punching and sealing the leads in the semiconductor dev... | 11/25/2003 |
| 6646330 | Lead frame for semiconductor device, process for producing the same and semiconductor device using the same The present invention relates to a lead frame for semiconductor devices having an outer lead part improved in solder wettability which comprises i. a substrate comprising an alloy comprising at least one member selected from the group consisting of nickel,... | 11/11/2003 |
| 6639308 | Near chip size semiconductor package A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. One aspect of the semiconductor package comprises a leadframe, a semiconductor chip attached to the leadframe, electri... | 10/28/2003 |
| 6608366 | Lead frame with plated end leads A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Eac... | 08/19/2003 |
| 6593643 | Semiconductor device lead frame A semiconductor device lead frame made of copper or a copper alloy used for a resin sealing type semiconductor device, comprising a lead frame body made of copper or a copper alloy, a double-layer under plating film formed on the lead frame body and compr... | 07/15/2003 |
| 6583500 | Thin tin preplated semiconductor leadframes A leadframe for use with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering the base metal and a plated layer of pure tin, only | 06/24/2003 |
| 6575354 | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film prefer... | 06/10/2003 |
| 6573459 | Graded metallic leads for connection to microelectronic elements Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between t... | 06/03/2003 |
| 6545344 | Semiconductor leadframes plated with lead-free solder and minimum palladium A leadframe for use with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering said base metal; a plated layer of lead-free solder on said nickel layer, selectively covering areas of said leadframe intended for at... | 04/08/2003 |
| 6544820 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication A conductive plastic lead frame and method of manufacturing the same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating... | 04/08/2003 |
| 6545342 | Pre-finished leadframe for semiconductor devices and method of fabrication A leadframe for use with integrated circuit chips comprising a base metal, usually copper or a copper alloy, having a modified surface adapted to provide bondability and solderability and adhesion to polymeric compounds. The modified surface comprises a l... | 04/08/2003 |
| 6540927 | Semiconductor packaging part and method producing the same A semiconductor packaging part and a method of forming the part by applying a minute plating with a high positional accuracy to a semiconductor chip to be packaged. A pair of alignment holes 2, 3 are formed at a pitch equal to n-times (n=1, 2 . . . ) of a... | 04/01/2003 |
| 6528879 | Semiconductor device and semiconductor module A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the ins... | 03/04/2003 |
| 6525406 | Semiconductor device having increased moisture path and increased solder joint strength Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface ... | 02/25/2003 |
| 6521358 | Lead frame for semiconductor device and method of producing same A lead frame for a semiconductor device includes a sheet-like body and a Pd coating plated on the sheet-like body. The Pd coating includes Ni in an amount of not more than 2%. In another embodiment, the Pd coating includes Cu in an amount of not more than... | 02/18/2003 |
| 6518653 | Lead frame and semiconductor device A lead frame comprising a plurality of leads and a die pad disposed at a position surrounded by top ends on one side of the leads, wherein at least the outermost layer on the obverse of the die pad comprises a nickel plated layer, as well as a semiconduct... | 02/11/2003 |
| 6518508 | Ag-pre-plated lead frame for semiconductor package A lead frame for a semiconductor package includes a base metal layer made of copper (Cu), Cu alloy or iron-nickel (Fe-Ni) alloy, an underlying plating layer formed on at least one surface of the base metal layer and made of Ni or Ni alloy, an intermediate... | 02/11/2003 |
