Bizarre Patents
A forehead support apparatus for resting a standing users forehead against a wall above a bathroom commode or urinal or beneath a showerhead.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7443025 | Thermally improved placement of power-dissipating components onto a circuit board The invention refers to an electronic system, comprising several power-dissipating components, and a circuit board, wherein said power-dissipating components are mounted both to a top side and a bottom side of said circuit board. Further, the invention refers to met... | 10/28/2008 |
| 7405107 | Semiconductor device, method and apparatus for fabricating the same A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the ... | 07/29/2008 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate.... | 06/17/2008 |
| 7382047 | Heat dissipation device A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fi... | 06/03/2008 |
| 7382000 | Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6 | 06/03/2008 |
| 7378730 | Thermal interconnect systems methods of production and uses thereof Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated ... | 05/27/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7352062 | Integrated circuit package design A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package su... | 04/01/2008 |
| 7338840 | Method of forming a semiconductor die with heat and electrical pipes Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in the substrate that extend from a bottom surface of the substrate to a p... | 03/04/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7317247 | Semiconductor package having heat spreader and package stack using the same A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semicondu... | 01/08/2008 |
| 7315077 | Molded leadless package having a partially exposed lead frame pad Provided are a molded leadless package, and a sawing type molded leadless package and method of manufacturing same. The molded leadless package includes a lead frame pad having first and second surfaces opposite to each other. A semiconductor chip is adhered to the ... | 01/01/2008 |
| 7307269 | Phase-change RAM containing AIN thermal dissipation layer and TiN electrode Provided is a phase-change RAM containing a substrate, a lower electrode, a phase-change material, an upper electrode and a thermal dissipation layer, wherein the thermal dissipation layer contains an aluminum-nitride thermal dissipation layer having a high heat con... | 12/11/2007 |
| 7294912 | Semiconductor device A semiconductor device is composed of a heat sink, an IC chip mounted and fixed on a specific face of the heat sink, a lead frame electrically connected to the IC chip and a sealing mold resin package. One or more of the faces of the heat sink has a specific surface... | 11/13/2007 |
| 7262440 | Light emitting diode package and fabrication method thereof The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a packag... | 08/28/2007 |
| 7259451 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 08/21/2007 |
| 7256489 | Semiconductor apparatus In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On th... | 08/14/2007 |
| 7256492 | Heat sink and display panel including heat sink A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate hea... | 08/14/2007 |
| 7235876 | Semiconductor device having metallic plate with groove A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block between the second metallic plate and the semiconductor element; a s... | 06/26/2007 |
| 7233065 | Semiconductor device having capacitors for reducing power source noise A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconducto... | 06/19/2007 |
| 7230320 | Electronic circuit device with reduced breaking and cracking In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal membe... | 06/12/2007 |
| 7227257 | Cooling micro-channels The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same. ... | 06/05/2007 |
| 7224058 | Integrated circuit package employing a heat-spreader member An integrated circuit package is proposed in which a laminar substrate 41 is provided with an aperture 43. A heat-spreader member 1 is mounted to cover this aperture 43, and contains a cavity 3 opening towards the aperture 43 | 05/29/2007 |
| 7202559 | Method of assembling a ball grid array package with patterned stiffener layer Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. An IC die is mounted in a centrally located cavity of a substantially planar first surface of a stiffener. The first surface of a substrate is attached to a substantiall... | 04/10/2007 |
| 7199465 | Wire bonding system and method of use A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A suppor... | 04/03/2007 |
| 7193318 | Multiple power density chip structure A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different... | 03/20/2007 |
| 7148562 | Power semiconductor device and power semiconductor module A plurality of power semiconductor chips (power transistors or the like) are arranged, being separated from each other with a free space of a terminal board interposed therebetween. A radiating block is in contact with an insulating layer (a package and grease below... | 12/12/2006 |
| 7129571 | Semiconductor chip package having decoupling capacitor and manufacturing method thereof A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second surface and coupled to the circuit lines, and ball lands provided on th... | 10/31/2006 |
| 7115988 | Bypass capacitor embedded flip chip package lid and stiffener The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. I... | 10/03/2006 |
| 7112883 | Semiconductor device with temperature control mechanism A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal heat-conductive medium thermally connected to the first metal heat-conduc... | 09/26/2006 |
| 7098533 | Printed circuit board with a heat dissipation element and package comprising the printed circuit board A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip and reduces a printed circuit board height. The PCB includes a heat sin... | 08/29/2006 |
| 7075174 | Semiconductor packaging techniques for use with non-ceramic packages A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which f... | 07/11/2006 |
| 6703698 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same A BGA (ball grid array) package with enhanced electrical and thermal performance, and a method for fabricating the BGA package, are proposed. This BGA package is characterized by the use of a power-connecting heat spreader and a ground-connecting heat spr... | 03/09/2004 |
| 6703261 | Semiconductor device and manufacturing the same A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink ... | 03/09/2004 |
| 6576985 | Semiconductor device packaging assembly The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembl... | 06/10/2003 |
| 6552421 | Semiconductor device and a method of manufacturing the same The present invention provides a semiconductor device which is stably operated even with respect to heat generated upon its operation and makes no use of an environmental harmful substance (lead). The semiconductor device includes a support plate for supp... | 04/22/2003 |
| 6531760 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/11/2003 |
| 6525409 | CCD mold package with improved heat radiation structure A heat radiation structure of a mold package for a semiconductor device. The heat radiation structure includes an island of a lead frame having a high heat conductivity for mounting a semiconductor device; outside leads having a high heat conductivity and... | 02/25/2003 |
| 6518098 | IC package with dual heat spreaders An integrated circuit device has a heat spreader attached to each of the major outer encapsulant surfaces. One or both of the heat spreaders has a pair of end posts configured for insertion into through-holes in a substrate to position and support the dev... | 02/11/2003 |
| 6505400 | Method of making chip scale package with heat spreader A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventional die attach me... | 01/14/2003 |
