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| Number | Title | Issue Date |
| 7345356 | Optical package with double formed leadframe Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing a... | 03/18/2008 |
| 7304371 | Lead frame having a lead with a non-uniform width A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width t... | 12/04/2007 |
| 7298026 | Large die package and method for the fabrication thereof A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a portion of the paddle and at least a portion of the leads of the lead-fram... | 11/20/2007 |
| 7129568 | Chip package and electrical connection structure between chip and substrate A chip package has lead frame, chip, generic wires, at least one characterized wire, ground wires and insulation material. The lead frame includes die pad, generic leads and at least a characterized lead structure. Generic leads and the characterized lead structure ... | 10/31/2006 |
| 7105916 | Inlet for an electronic tag Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer ed... | 09/12/2006 |
| 6696752 | Encapsulated semiconductor device with flash-proof structure An encapsulated semiconductor device includes a lead frame formed with a flash-proof body. The flash-proof body includes a dam bar formed on atop surface of the lead frame and a tape adhered to a bottom surface of the lead frame, where the dam bar is atta... | 02/24/2004 |
| 6693304 | Laminated lead frame, and optical communication module and method of manufacturing the same The optical communication module comprises a laminated lead frame composed of a plurality of lead frames that are laminated and held by a tie bar made of an insulating material, and an optical communication functional unit that is disposed on at least one... | 02/17/2004 |
| 6646329 | Power chip scale package A packaging arrangement for a semiconductor device including a leadframe and a die coupled thereto. The die is coupled to the leadframe such that its back surface (drain area) is coplanar with source leads and a gate lead extending from the leadframe. A s... | 11/11/2003 |
| 6627977 | Semiconductor package including isolated ring structure A semiconductor package includes a chip mounting pad having a peripheral edge. The package further includes a semiconductor chip attached to the chip mounting pad. The package further includes a plurality of leads which each have an inner end disposed adj... | 09/30/2003 |
| 6531760 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/11/2003 |
| 6339252 | Electronic device package and leadframe The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. In one embodiment, the package includes an integrated circuit device on a metal die pad... | 01/15/2002 |
| 6258629 | Electronic device package and leadframe and method for making the package The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. The package includes an integrated circuit device on a metal die pad. A metal ring is b... | 07/10/2001 |
| 6249042 | Member for lead A lead member includes a plurality of conductors arranged in parallel and an insulating film fixing the conductors at a predetermined pitch. Each conductor includes a first end portion, a second end portion, and a flat portion extending between the first ... | 06/19/2001 |
| 6225146 | Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead f... | 05/01/2001 |
| 6204552 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/20/2001 |
| 6166430 | Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device The lead frame of the present invention includes: an outer frame having an opening; a plurality of leads consisting of outer and signal-connecting leads and extending inside the opening from the outer frame toward a region in which the semiconductor chip ... | 12/26/2000 |
| 6157074 | Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same A lead frame and a semiconductor package using the lead frame are disclosed in which one lead frame can be used to perform the package process regardless of the size of a chip. The size of the chip can be varied within the limit that the number of bonding... | 12/05/2000 |
| 6124642 | Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same A lead structure is provided in a semiconductor device, having a body of a lead having at least a part of which is in contact with an adhesive which bonds with an insulation tape, and a protection layer selectively provided on the body of the lead so that... | 09/26/2000 |
| 6114749 | Integrated circuit with lead frame package having internal power and ground busses An integrated circuit includes a semiconductor integrated circuit chip housed in a package providing external electrical connections for the circuit chip. The package has only a limited number of external connections available for such use. The package in... | 09/05/2000 |
| 6111308 | Ground plane for plastic encapsulated integrated circuit die packages A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed ... | 08/29/2000 |
| 6081035 | Microelectronic bond ribbon design An improved bond ribbon design, said bond ribbon having a dual taper that functions to localize the bending along a predetermined distribution of the bond ribbon during the bonding of the bond ribbon to an associated contact of a semiconductor chip. Use o... | 06/27/2000 |
| 6081023 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 06/27/2000 |
| 6072231 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 06/06/2000 |
| 6069029 | Semiconductor device chip on lead and lead on chip manufacturing As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 05/30/2000 |
| 6057177 | Reinforced leadframe to substrate attachment A method and apparatus for a reinforced leadframe to substrate attachment in a semiconductor assembly. In one embodiment, a printed circuit board having a plurality of electrically coupled electrical contact regions and wire bond areas formed thereon has ... | 05/02/2000 |
| 6043108 | Lead frame with lead-securing tape bonded to the inner lead sections of plural leads and a method of manufacturing the same A lead frame comprises an island supported by island supports at its four corners and leads extending from its frame section to the island. The leads are composed of inner leads and outer leads which are connected to each other with dam bars. Plating laye... | 03/28/2000 |
| 6037652 | Lead frame with each lead having a peel generation preventing means and a semiconductor device using same A lead frame is provided that prevents breaks in bonding wires caused by thermal stress which is applied when mounting a resin semiconductor. A plating layer is applied to the surfaces of internal leads to which bonding wires are to be connected and an in... | 03/14/2000 |
| 6018191 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 01/25/2000 |
| 6005293 | Wire-bonded semiconductor device The present invention provides a wire-bonding structure of a semiconductor device comprising short and long bonding-wires. The short bonding-wires are provided for electrical connections between outer-positioned electrode bonding pads of the semiconductor... | 12/21/1999 |
| 5981315 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 11/09/1999 |
| 5982025 | Wire fixation structure A lead structure includes an insulating film, a plurality of leads, and a plurality of adhesive layers separately provided on the insulating film. Two adjacent leads are fixed by adjacent adhesive layers, respectively, such that an adhesive does not exist... | 11/09/1999 |
| 5977615 | Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead f... | 11/02/1999 |
| 5969412 | Tape-fixed leadframe A tape-fixed leadframe is provided, which prevents ion migration of metal contained in leads with a simple configuration. The leadframe is comprised of electrically-conductive lead fingers and an electrically-insulating tape for fixing the lead fingers. T... | 10/19/1999 |
| 5952711 | Lead finger immobilization apparatus A lead finger immobilization apparatus is disclosed. The apparatus utilizes a perforated layer of a nonconductive material.... | 09/14/1999 |
| 5949132 | Dambarless leadframe for molded component encapsulation A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing... | 09/07/1999 |
| 5939775 | Leadframe structure and process for packaging intergrated circuits An improved leadframe structure and an improved IC package and process using such structure are disclosed. The improved leadframe structure eliminates the dambar commonly found on leadframes for use in plastic packages. A polymer structure is formed and e... | 08/17/1999 |
| 5914530 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 06/22/1999 |
| 5904506 | Semiconductor device suitable for testing A semiconductor device includes a rigid member embedded in a resin package body for supporting thereon outer leads that extend from the resin package body and test pads provided on the outer leads for testing the semiconductor device.... | 05/18/1999 |
| 5905300 | Reinforced leadframe to substrate attachment A method and apparatus for a reinforced leadframe to substrate attachment in a semiconductor assembly. In one embodiment, a printed circuit board having a plurality of electrically coupled electrical contact regions and wire bond areas formed thereon has ... | 05/18/1999 |
| 5891377 | Dambarless leadframe for molded component encapsulation A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing... | 04/06/1999 |
