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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 7425755 | Semiconductor package, method for manufacturing the same and lead frame for use in the same A semiconductor package mainly includes a semiconductor chip and a plurality of leads at the periphery of the semiconductor chip. Each of the leads has a first portion, a second portion and opposing upper and lower surfaces, wherein the second portion of the leads a... | 09/16/2008 |
| 7285850 | Support elements for semiconductor devices with peripherally located bond pads A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector o... | 10/23/2007 |
| 7279784 | Semiconductor package A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead portion exposed out of the lower surface of the semiconductor package and... | 10/09/2007 |
| 7271036 | Leadframe alteration to direct compound flow into package A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at... | 09/18/2007 |
| 7256489 | Semiconductor apparatus In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On th... | 08/14/2007 |
| 7247927 | Leadframe alteration to direct compound flow into package A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at... | 07/24/2007 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7232699 | Method of making a high precision microelectromechanical capacitor with programmable voltage source A Method of Making a High Precision Microelectromechanical Capacitor with Programmable Voltage Source includes steps for forming a monolithic MEMS device having a capacitance actuator, a trim capacitor, and a high precision, programmable voltage source. The trim cap... | 06/19/2007 |
| 7211886 | Three-dimensional multichip stack electronic package structure The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an ... | 05/01/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7187065 | Semiconductor device and semiconductor device unit A semiconductor device comprises a semiconductor chip which is mounted on a stage. A plurality of leads are electrically connected with the semiconductor chip. A package encloses the semiconductor chip and a part of the plurality of leads. A first corner lead is pro... | 03/06/2007 |
| 6664614 | Lead frame and bottom lead semiconductor package using the lead frame A lead frame includes a pair of guide rails separated at a predetermined space; at least one dam bar for connecting the pair of guide rails; a die paddle for mounting a semiconductor chip between the dam bar; a tie bar for supporting the die paddle; a plu... | 12/16/2003 |
| 6583401 | Optoelectronic component with a conductor strip element A further miniaturization of known optoelectronic components with internal screening is not possible. In addition, inhomogeneities occur in the embedding material. Separate screening plates cause additional costs to arise during component assembly. The ta... | 06/24/2003 |
| 6537051 | Encapsulation mold with a castellated inner surface A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminat... | 03/25/2003 |
| 6531769 | SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, SEMICONDUCTOR APPARATUS PROVIDED WITH A PLURALITY OF SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGES, METHOD OF INSPECTING SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT The present invention provides a resin-sealed semiconductor IC package of a large integration size having a size substantially equal to that of its component semiconductor IC chip. The resin-sealed semiconductor IC package comprises a semiconductor IC chi... | 03/11/2003 |
| 6531760 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/11/2003 |
| 6525405 | Leadless semiconductor product packaging apparatus having a window lid and method for packaging A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechan... | 02/25/2003 |
| 6521987 | Plastic integrated circuit device package and method for making the package A package for an integrated circuit device, having a die, a die pad, leads, bond wire, and an encapsulant. The lower surfaces of the die pad and the leads are provided with stepped profiles. Structures extending from lateral sides of the leads are formed ... | 02/18/2003 |
| 6516516 | Semiconductor chip package having clip-type outlead and fabrication method of same A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a recess, a plurality of inner leads each connected electric... | 02/11/2003 |
| 6501160 | Semiconductor device and a method of manufacturing the same and a mount structure The present invention provides a technique capable of improving a mounting failure in a resin encapsulated semiconductor device and repairability thereof. The present semiconductor device includes a resin encapsulater, a semiconductor chip located within ... | 12/31/2002 |
| 6489173 | Method for determining lead span and planarity of semiconductor devices A method for detecting and screening integrated circuit devices having all leads in a row out of planarity specification wherein the leads are deformed at the same angle is described. The method enables existing top-view visual inspection systems to accur... | 12/03/2002 |
| 6462424 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads ... | 10/08/2002 |
| 6455356 | Methods for moding a leadframe in plastic integrated circuit devices Methods for making packages and leadframes are enclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially... | 09/24/2002 |
| 6441477 | Substrate mounting an integrated circuit package with a deformed lead In an integrated circuit package, a deformed IC lead is reliably connected with a land for mounting. Such reliable connection between the deformed IC lead and a land is realized by a method for mounting an integrated circuit package wherein a non deformed... | 08/27/2002 |
| 6433418 | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconduct... | 08/13/2002 |
| 6433417 | Electronic component having improved soldering performance and adhesion properties of the lead wires Electrodes of the electronic component chip is electrically connected with the end parts of the leads and the electronic component chip and the end parts of the leads are covered by the package with the leads which are extended out from the package are be... | 08/13/2002 |
| 6395982 | Leaded semiconductor device package for use in nonsoldering assembling A leaded semiconductor device package for nonsoldering assembling is disclosed. In the package of the invention, both leads of a semiconductor device package are flattened, cut and bent by automatic machines on the bais of conventional packaging process. ... | 05/28/2002 |
| 6320251 | Stackable package for an integrated circuit Package embodiments for integrated circuits or other electronic devices are disclosed, along with methods of making and interconnecting the packages. The packages include a package body formed of molded encapsulant. Leads extend from a first end that is e... | 11/20/2001 |
| 6316727 | Multi-chip semiconductor package A multi-chip semiconductor package is described. By changing the design for a lead frame, two or more chips are packaged together. A die pad whose surface area is smaller than that of a chip is used so that bonding pads can be exposed and chips can mounte... | 11/13/2001 |
| 6281568 | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad Packages for an integrated circuit device and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a step... | 08/28/2001 |
| 6265660 | Package stack via bottom leaded plastic (BLP) packaging A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminat... | 07/24/2001 |
| 6249041 | IC chip package with directly connected leads An improved semiconductor device is disclosed. In one embodiment, the semiconductor device includes a semiconductor chip with contact areas on the top or bottom surface. A first lead assembly, formed from a semi-rigid sheet of conductive material, has a l... | 06/19/2001 |
| 6213747 | Package stack via bottom leaded plastic (BLP) packaging A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminat... | 04/10/2001 |
| 6204552 | Semiconductor device As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-... | 03/20/2001 |
| 6201297 | Semiconductor device A thin and highly reliable surface-mount-type package is provided for a semiconductor device. Concretely, the semiconductor device comprises a square semiconductor chip having a plurality of bonding pads formed on the peripheral region on the main surface... | 03/13/2001 |
| 6188021 | Package stack via bottom leaded plastic (BLP) packaging A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminat... | 02/13/2001 |
| 6166328 | Package stack via bottom leaded plastic (BLP) packaging A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminat... | 12/26/2000 |
| 6165819 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads ... | 12/26/2000 |
| 6146919 | Package stack via bottom leaded plastic (BLP) packaging A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminat... | 11/14/2000 |
| 6114759 | Semiconductor package A semiconductor package which can prevent peeling of outer leads from solder caused by thermal expansion and contraction, after the semiconductor package is mounted on a printed wiring board, is disclosed. The semiconductor package according to this inven... | 09/05/2000 |
