Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7425755 | Semiconductor package, method for manufacturing the same and lead frame for use in the same A semiconductor package mainly includes a semiconductor chip and a plurality of leads at the periphery of the semiconductor chip. Each of the leads has a first portion, a second portion and opposing upper and lower surfaces, wherein the second portion of the leads a... | 09/16/2008 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabri... | 04/22/2008 |
| 7345356 | Optical package with double formed leadframe Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing a... | 03/18/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7307351 | Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconduc... | 12/11/2007 |
| 7298025 | Microelectronic component assemblies and microelectronic component lead frame structures The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads... | 11/20/2007 |
| 7279784 | Semiconductor package A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead portion exposed out of the lower surface of the semiconductor package and... | 10/09/2007 |
| 7256482 | Integrated circuit chip packaging assembly An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side ... | 08/14/2007 |
| 7242077 | Leadframe with die pad A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the side... | 07/10/2007 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7235881 | Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconduc... | 06/26/2007 |
| 7138707 | Semiconductor package including leads and conductive posts for providing increased functionality A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the semiconductor die, the semiconductor package includes at least one l... | 11/21/2006 |
| 6703692 | Leadframe with support members A leadframe is disclosed. The leadframe comprises a frame characterized by a substantially rectangular outline, a die paddle with a receiving surface, and a plurality of support members that connect the frame to the die paddle. The leadframe further compr... | 03/09/2004 |
| 6633077 | Semiconductor device and method for manufacturing the same On a surface of a pair of support leads formed in one piece with a die pad on which a semiconductor chip is mounted, a protrusion is formed on the side that the semiconductor chip is mounted. During a resin-sealing, a lower surface of the die pad is broug... | 10/14/2003 |
| 6621152 | Thin, small-sized power semiconductor package A power semiconductor package is provided. The power semiconductor package includes a chip, leads, conductive media, and a molding material. The leads have a groove in the shape of a hemisphere or a down-set. The package further includes an adhesive. The ... | 09/16/2003 |
| 6617200 | System and method for fabricating a semiconductor device The present invention provides a semiconductor device that makes it possible to expose the back side of a die pad as well as a method for fabricating the same. The semiconductor device can include a lead frame that has portions to be sandwiched by first a... | 09/09/2003 |
| 6614101 | Lead frame with raised leads and plastic packaged semiconductor device using the same A plastic packaged semiconductor device is constructed by sealing, with a sealing plastic, a semiconductor chip which has an electrode pad arranged in a central portion of an upper surface, a die pad to which the semiconductor chip is die-bonded, bonding ... | 09/02/2003 |
| 6610561 | Method of fabricating a semiconductor device The present invention provides a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the busbar lead is depressed toward a major surface of a semicondu... | 08/26/2003 |
| 6611048 | Exposed paddle leadframe for semiconductor die packaging According to one embodiment, a leadframe having at least one tab is placed inside a mold cavity. During the molding process, the ceiling of the mold cavity is pressed against the at least one tab, which in turn causes a bottom surface of the leadframe to ... | 08/26/2003 |
| 6603196 | Leadframe-based semiconductor package for multi-media card A leadframe-based semiconductor package is proposed for the packaging of a semiconductor device, such as a multi-media card (MMC) chipset. The proposed semiconductor package is characterized by the use of a leadframe, rather than BT substrate or film, as ... | 08/05/2003 |
| 6586821 | Lead-frame forming for improved thermal performance A lead frame of a plastic integrated circuit package is fabricated in two steps. First, from a rectangular sheet of metal, lead fingers of the lead frame are formed. Second, the die pad of the lead frame is clamped and is simultaneously separated and down... | 07/01/2003 |
| 6576994 | Semiconductor device A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part a... | 06/10/2003 |
| 6559526 | Multiple-step inner lead of leadframe A structure of a stacked-type multi-chip stack package of the leadframe, the shape of the stair-like inner leads can be regulated for the high and the amount of stacked chips and to match different bonding technology. The process for forming the present s... | 05/06/2003 |
| 6545349 | Semiconductor device A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part a... | 04/08/2003 |
| 6518657 | Semiconductor device and lead frame assembly/lead frame for making a semiconductor device A semiconductor device having oppositely facing first and second sides. The semiconductor device has a support exposed at the first side of the semiconductor device, a semiconductor device mounted on the support, and a plurality of leads connected to the ... | 02/11/2003 |
| 6479893 | Ball-less clip bonding A semiconductor component includes a semiconductor chip (120, 1120), an electrically conductive adhesive located over the semiconductor chip, and a clip bond (231, 232, 1231, 1232) located over the electrically conductive adhesive. The clip bond has at le... | 11/12/2002 |
| 6476478 | Cavity semiconductor package with exposed leads and die pad A semiconductor chip package and a method of making the package are disclosed. The method includes forming a lead frame having a die pad and leads. At least one of the leads has a tab projecting upward and laterally from a body of the lead. In one embodim... | 11/05/2002 |
| 6462424 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads ... | 10/08/2002 |
| 6459148 | QFN semiconductor package A QFN semiconductor package comprises a semiconductor die, a lead frame, bonding wires and a molding compound. The die has an upward topside with a plurality of bonding pads. The lead frame consists of a plurality of inner leads, wherein each inner lead i... | 10/01/2002 |
| 6455348 | Lead frame, resin-molded semiconductor device, and method for manufacturing the same A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and the signal-connecting leads are electrically connected to e... | 09/24/2002 |
| 6451629 | Leadframe alteration to direct compound flow into package A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of t... | 09/17/2002 |
| 6448633 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively pre... | 09/10/2002 |
| 6427976 | Lead-frame-based chip-scale package and method of manufacturing the same A lead-frame-based chip-scale package (CSP) structure and a method of manufacturing the same are proposed. The proposed CSP structure is characterized in the use of a specially-designed lead frame having an inner-lead part and an outer-lead part, which ea... | 08/06/2002 |
| 6414379 | Structure of disturbing plate having down set A disturbing plate structure having at least one down set, applicable in a lead frame-type package in a semiconductor. The disturbing plate has at least a lead frame, a die, a glue layer, a plurality of disturbing plates, a top mold compound, and a bottom... | 07/02/2002 |
| 6392295 | Semiconductor device A LOC type semiconductor device comprises a semiconductor chip having a main surface in which semiconductor elements and a plurality of bonding pads are formed, and a back surface opposite the main surface; a plurality of leads each having an inner part a... | 05/21/2002 |
| 6337510 | Stackable QFN semiconductor package A stackable QFN semiconductor package comprises a die, a lead frame, an electrical connection device, and a molding compound. The die has a plurality of bonding pads on its topside. The lead frame consists of a plurality of inner leads around edge of the ... | 01/08/2002 |
| 6335227 | Method of fabricating a lead-on-chip (LOC) semiconductor device A method is provided for forming a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the busbar lead is depressed toward a major surface of a semicon... | 01/01/2002 |
| 6323545 | Semiconductor device A semiconductor element has electrodes on its periphery, leads for making external connections respectively in correspondence with the electrodes and connected to the electrodes through wires, and a package body in which a semiconductor element and leads ... | 11/27/2001 |
| 6316727 | Multi-chip semiconductor package A multi-chip semiconductor package is described. By changing the design for a lead frame, two or more chips are packaged together. A die pad whose surface area is smaller than that of a chip is used so that bonding pads can be exposed and chips can mounte... | 11/13/2001 |
| 6303984 | Lead frame including angle iron tie bar A lead frame and method of making the same are provided. The lead frame includes a die mounting portion, first and second pairs of tie bars, and first and second tie bar bridges extending between respective second extension portions of each tie bar pair. ... | 10/16/2001 |
