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| Number | Title | Issue Date |
| 7372133 | Microelectronic package having a stiffening element and method of making same A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact l... | 05/13/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7348664 | Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress... | 03/25/2008 |
| 7339261 | Semiconductor device A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper sur... | 03/04/2008 |
| 7338841 | Leadframe with encapsulant guide and method for the fabrication thereof A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant guides are formed angled on a plurality of the leads to push the leads... | 03/04/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7332803 | Circuit device A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to the first semiconductor element or the second semiconductor element vi... | 02/19/2008 |
| 7304385 | Semiconductor chip capable of implementing wire bonding over active circuits A reinforced bonding pad structure includes a bondable metal layer defined on a stress-buffering dielectric layer, and an intermediate metal layer damascened in a first inter-metal dielectric (IMD) layer disposed under the stress-buffering dielectric layer. The inte... | 12/04/2007 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7202113 | Wafer level bumpless method of making a flip chip mounted semiconductor device package A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside, processing the solder mask coating to reveal a plurality of gate contact a... | 04/10/2007 |
| 7138707 | Semiconductor package including leads and conductive posts for providing increased functionality A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the semiconductor die, the semiconductor package includes at least one l... | 11/21/2006 |
| 7102216 | Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making A leadframe, a semiconductor package, and methods of making the same are disclosed. A leadframe includes leads having an inner end segment. A first subset of the leads include a recess in a first surface of the inner end segment. A second subset of the leads include... | 09/05/2006 |
| 6984877 | Bumped chip carrier package using lead frame and method for manufacturing the same A semiconductor package such as a bumped chip carrier (BCC) package has projections extending from a lower surface of a resin encapsulant. Each projection has a concave depression formed thereon. By reflowing a solder layer, external terminals are formed to cover th... | 01/10/2006 |
| 6703694 | Frame for semiconductor package including plural lead frames having thin parts or hollows adjacent the terminal roots A frame for semiconductor packages has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are mounted on the respective die-pads. These semiconductor devices are collectively molded with molding compound, and then th... | 03/09/2004 |
| 6703260 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes A leadframe including offsets extending from a major plane thereof. The offsets extend from the major plane at a non-perpendicular angle thereto. Preferably, the angle of extension, relative to the major plane, is about 45 degrees or less. The offsets may... | 03/09/2004 |
| 6700189 | Resin sealed semiconductor device A semiconductor device in which a lead frame having inner connecting portions and outer connecting portions, a semiconductor chip having electrodes on the surface thereof, and metal wires for electrically connecting electrodes on the semiconductor chip an... | 03/02/2004 |
| 6700186 | Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semic... | 03/02/2004 |
| 6700188 | Low-pin-count chip package having concave die pad and/or connections pads A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip wherein the die pad and the connection pads have a concave profile. A package body is for... | 03/02/2004 |
| 6696749 | Package structure having tapering support bars and leads A package structure having tapering support bars and leads. The package structure has at least a lead frame, a die, a plurality of conductive wires and an encapsulating plastic body. The lead frame has a first surface and has at least a package unit. The ... | 02/24/2004 |
| 6696747 | Semiconductor package having reduced thickness A semiconductor package is disclosed that comprises a chip paddle and a semiconductor chip that has a plurality of bond pads. The semiconductor chip is located on an upper surface of the chip paddle. Leads are formed at intervals along the perimeter of th... | 02/24/2004 |
| 6692990 | Method for manufacturing a semiconductor device In a semiconductor device, each of the leads is provided with guided-surfaces that are inclined surfaces and each of the bumps is provided with a recess that has guide-surfaces formed by inclined surfaces. The leads are smoothly guided toward the centers ... | 02/17/2004 |
| 6692991 | Resin-encapsulated semiconductor device and method for manufacturing the same The resin-encapsulated semiconductor device of the present invention includes: a die pad provided by thinning a lower portion of a lead frame; a semiconductor chip mounted on the die pad; a plurality of leads provided by thinning an upper portion of the l... | 02/17/2004 |
| 6691406 | Methods of die attachment for BOC and F/C surface mount Methods for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The protrusions are configured to form barriers to hold an ad... | 02/17/2004 |
| 6684496 | Method of making an integrated circuit package A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to ... | 02/03/2004 |
| 6674156 | Multiple row fine pitch leadless leadframe package with use of half-etch process A leadless leadframe panel comprising a partially etched top surface of a substrate panel that forms recessed regions that define a portion of a first and a second set of tie bars and a portion of a first and second set of contact pads. A bottom surface o... | 01/06/2004 |
| 6674154 | Lead frame with multiple rows of external terminals A lead frame includes a die pad, a suspension lead and a plurality of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon produc... | 01/06/2004 |
| 6674165 | Mold for a semiconductor chip A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a mold... | 01/06/2004 |
| 6670222 | Texturing of a die pad surface for enhancing bonding strength in the surface attachment Laser beam or pulsed output is provided for enhancing the bonding strength between surfaces that are secured together, such as by lamination process or an adhesive, by texturing with a plurality of indentations formed in at least one of the surfaces to be... | 12/30/2003 |
| 6658734 | Method of manufacturing a circuit member for a resin-sealed semiconductor device There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for int... | 12/09/2003 |
| 6661083 | Plastic semiconductor package A lead frame for a surface mount semiconductor chip package includes a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a peripheral margin of the paddle, and having a central die ... | 12/09/2003 |
| 6657298 | Integrated circuit chip package having an internal lead A package for an integrated circuit chip is disclosed, along with structures and methods for making and mounting the package. An exemplary embodiment of the package includes a molded body having leads embedded therein with an aperture adjacent each of the... | 12/02/2003 |
| 6650020 | Resin-sealed semiconductor device The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their respective tips facing the die pad portion, thin metal wires f... | 11/18/2003 |
| 6650012 | Semiconductor device A semiconductor device using a lead frame as a wiring base member, in which lead electrodes connected to a semiconductor chip through a connecting lead are arranged radially around the semiconductor chip having an upper surface and an under surface. The s... | 11/18/2003 |
| 6646339 | Thin and heat radiant semiconductor package and method for manufacturing A semiconductor package which is improved in thinness and heat radiation and a method for making the same. The package includes a semiconductor chip electrically connected to leads of a leadframe via input and output bond pads. The leadframe may have a gr... | 11/11/2003 |
| 6642082 | Method for manufacturing a resin-sealed semiconductor device A heat plate includes projections for supporting half-etched portions of first signal connection leads, respectively. A lead frame having a resin film mounted thereon is mounted on the heat plate, and thin metal wires are respectively connected to the hal... | 11/04/2003 |
| 6635407 | Two pass process for producing a fine pitch lead frame by etching A method of fabricating a lead frame. The method includes providing an electrically conductive layer having a pair of opposing major surfaces. A pattern is etched in the layer extending partially through the layer to form cavities with sidewalls in the la... | 10/21/2003 |
| 6635957 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array A leadless plastic chip carrier has a plurality of die attach pads on which a singulated semi-conductor die is mounted. At least one row of contact pads circumscribes the plurality of die attach pads and a power/ground ring is intermediate the contact pad... | 10/21/2003 |
| 6630728 | Plastic integrated circuit package and leadframe for making the package Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower sur... | 10/07/2003 |
| 6630729 | Low-profile semiconductor package with strengthening structure A semiconductor package and a fabricating method thereof are proposed. The semiconductor package includes a semiconductor chip; a plurality of leads surrounding the chip and formed with a plurality of connecting mechanisms and strengthening structures; an... | 10/07/2003 |
| 6627976 | Leadframe for semiconductor package and mold for molding the same The invention relates to a leadframe for semiconductor packages and a mold for molding the semiconductor package. The leadframe of the invention reduces occurrences of chip-out and floating of a chip paddle upon singulation after encapsulation. The leadfr... | 09/30/2003 |
