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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 7408246 | Controlling warping in integrated circuit devices Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to com... | 08/05/2008 |
| 7307351 | Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconduc... | 12/11/2007 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7235881 | Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconduc... | 06/26/2007 |
| 7193299 | Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element,... | 03/20/2007 |
| 7157312 | Surface mount package and method for forming multi-chip microsensor device A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and readouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured... | 01/02/2007 |
| 6633077 | Semiconductor device and method for manufacturing the same On a surface of a pair of support leads formed in one piece with a die pad on which a semiconductor chip is mounted, a protrusion is formed on the side that the semiconductor chip is mounted. During a resin-sealing, a lower surface of the die pad is broug... | 10/14/2003 |
| 6555899 | Semiconductor package leadframe assembly and method of manufacture A semiconductor package and the leadframe therefor having a reverse-down set part formed in the tie bar supporting the chip paddle. The reverse-down set part of the tie bar may be formed by a mechanical stamping process in such a way that it is present wi... | 04/29/2003 |
| 6518650 | Tape under frame for lead frame IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 02/11/2003 |
| 6455348 | Lead frame, resin-molded semiconductor device, and method for manufacturing the same A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and the signal-connecting leads are electrically connected to e... | 09/24/2002 |
| 6455922 | Deformation-absorbing leadframe for semiconductor devices A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to... | 09/24/2002 |
| 6306684 | Stress reducing lead-frame for plastic encapsulation A method for attaching an integrated circuit die to a mounting structure, the method having the steps of: forming a mounting structure having a die pad and at least one spreader; applying an adhesive to the die pad and the at least one spreader of the mou... | 10/23/2001 |
| 6303984 | Lead frame including angle iron tie bar A lead frame and method of making the same are provided. The lead frame includes a die mounting portion, first and second pairs of tie bars, and first and second tie bar bridges extending between respective second extension portions of each tie bar pair. ... | 10/16/2001 |
| 6215177 | Tape under frame for conventional-type IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 04/10/2001 |
| 6169322 | Die attach pad adapted to reduce delamination stress and method of using same The invention enables a die to be attached to a die attach pad so as to reduce delamination stress that can arise when the die and die attach pad are heated, and so as to provide support for the die at locations where bond pads are formed so that the die ... | 01/02/2001 |
| 6111307 | Method of making lead frame including angle iron tie bar A lead frame and method of making the same are provided. The lead frame includes a die mounting portion, first and second pairs of tie bars, and first and second tie bar bridges extending between respective second extension portions of each tie bar pair. ... | 08/29/2000 |
| 6091133 | Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 07/18/2000 |
| 6081029 | Resin encapsulated semiconductor device having a reduced thickness and improved reliability A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and the signal-connecting leads are electrically connected to e... | 06/27/2000 |
| 6072230 | Exposed leadframe for semiconductor packages and bend forming method of fabrication The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segm... | 06/06/2000 |
| 6008528 | Semiconductor lead frame with channel beam tie bar The invention is a lead frame (30) with tie bars (32-35) having reenforcing channels (44, 53, 64) extending at least a portion of the length of the tie bar. The lead frame (30) and channels (44, 53, 64) in the tie bars (32-35) may be formed either by stam... | 12/28/1999 |
| 5889318 | Lead frame including angle iron tie bar and method of making the same A lead frame and method of making the same are provided. The lead frame includes a die mounting portion, first and second pairs of tie bars, and first and second tie bar bridges extending between respective second extension portions of each tie bar pair. ... | 03/30/1999 |
| 5637915 | Semiconductor device affixed to an upper and a lower leadframe A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads... | 06/10/1997 |
| 5409866 | Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe A process for manufacturing semiconductor device including a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semi... | 04/25/1995 |
| 5304818 | Lead frame A lead frame, used for constructing a multi-core optical module or the like, includes a frame portion, a plurality of substrate portions on which electronic circuit elements are to be mounted, and a support portion for securing the plurality of substrate ... | 04/19/1994 |
| 5250839 | Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates A multi-layer leadframe according to this invention is formed by laminating on a leadframe body an insulating layer and an electrically conductive layer in this order. The electrically conductive plate includes a planar portion and a given number of termi... | 10/05/1993 |
| 5126820 | Thermal expansion compensated metal lead frame for integrated circuit package A metal lead frame for an integrated circuit package is disclosed having stress relieving means formed therein to inhibit breakage of a thermally mismatched silicon die subsequently attached thereto and then heated during normal operation of the device. T... | 06/30/1992 |
| 5121300 | Lead frame and electronic device employing the same A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip s... | 06/09/1992 |
| 5043791 | Electrical device having improved lead frame and thermally stable connection arrangement and method An electrical component/housing has a main body with a geometric central point and a lead frame having a plurality of leads formed of flat sheet stock. An intermediate flexible planar portion of each lead extends between emerging and end portions of each ... | 08/27/1991 |
| 4918511 | Thermal expansion compensated metal lead frame for integrated circuit package A metal lead frame for an integrated circuit package is disclosed having stress relieving means formed therein to inhibit breakage of a thermally mismatched silicon die subsequently attached thereto and then heated during normal operation of the device. T... | 04/17/1990 |
| 4907129 | Lead frame and electronic divice A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip s... | 03/06/1990 |
| 4870474 | Lead frame A lead frame composed of an outer frame and inner lead frame portions formed as an integral frame wherein each lead frame portion directly joins the outer frame at some of the four corners of the lead frame portion with circuitous bridges interposed for f... | 09/26/1989 |
| 4803540 | Semiconductor integrated circuit packages A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered af... | 02/07/1989 |
| 4797726 | Lead frame including deformable plates A lead frame for a semiconductor chip has a plurality of supporting plates connecting to each other by a plurality of readily deformable plates so that a predetermined gap exists between adjacent supporting plates. When the semiconductor chip and the supp... | 01/10/1989 |
| 4797787 | Lead frame and electronic device A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip s... | 01/10/1989 |
| 4791472 | Lead frame and semiconductor device using the same A resin encapsulated type semiconductor device is manufactured by using a lead frame in which a stress relaxation portion is formed near the connection portion between the tab suspending the lead and the tab according to this invention, whereby stress con... | 12/13/1988 |
| 4743956 | Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging A method of forming leadframes for use in manufacturing semiconductor chips starts with fabricating a plurality of leadframes by metal stamping or etching leadframe patterns into a flat ribbon of conductive material. The leadframe patterns include a plura... | 05/10/1988 |
| 4400714 | Lead frame for semiconductor chip A lead frame is provided which allows for the lengthening of leads caused by the bonding of the lead tips to a ceramic substrate, without causing the lead frame to deform in a vertical direction. The lead frame comprises a generally flat but relatively ri... | 08/23/1983 |
| 4326215 | Encapsulated semiconductor device with a metallic base plate A semiconductor device comprising a metallic base plate whose side surfaces are formed with cut-away portions having circular arc-shaped parts, a semiconductor element which is connected to the surface of the metallic base plate, and a resin which lies in... | 04/20/1982 |
