Class 257/E23.044 - For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E23.043. This
No. of patents: 314
Last issue date: 10/28/2008

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Number	Title	Issue Date
7443014	Electronic module and method of assembling the same An electronic module includes a semiconductor power switch and a semiconductor diode. The lower side of the semiconductor power switch includes an output contact mounted on a die pad of a leadframe, and the upper side of the semiconductor power switch includes a con...	10/28/2008
7400027	Nonvolatile memory device having two or more resistance elements and methods of forming and using the same A nonvolatile memory device having two or more resistors and methods of forming and using the same. A nonvolatile memory device having two resistance layers, and more particularly, to a nonvolatile memory device formed and operated using a resistance layer having me...	07/15/2008
7382000	Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6	06/03/2008
7372142	Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sid...	05/13/2008
7361937	White-light emitting device and the use thereof A white-light emitting device includes a first die and a second die. The first die has a first semiconductor light-emitting layer emitting a first primary color light. The second die has a second semiconductor light-emitting layer emitting a second primary color lig...	04/22/2008
7348664	Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress...	03/25/2008
7332806	Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ...	02/19/2008
7242085	Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A...	07/10/2007
7227198	Half-bridge package A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated di...	06/05/2007
7183625	Embedded MIM capacitor and zigzag inductor scheme A new method to form RF devices in the manufacture of an integrated circuit device is achieved. The method comprises providing a substrate. A top metal level is defined overlying the substrate. The top metal level comprises pads and portions of planned RF devices. A...	02/27/2007
7135754	Chip type solid electrolytic capacitor having a small size and a simple structure In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capa...	11/14/2006
7132737	Package for electronic component and method of manufacturing piezoelectric device Aspects of the invention provide a package for accommodating a piezoelectric resonator that can include more mounting electrodes than connecting electrodes of the piezoelectric resonator element. The mounting electrodes can be electrically connected with a wiring pa...	11/07/2006
7095098	Electrically isolated and thermally conductive double-sided pre-packaged component An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper mat...	08/22/2006
6812553	Electrically isolated and thermally conductive double-sided pre-packaged component An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable cooper mat...	11/02/2004
6703261	Semiconductor device and manufacturing the same A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink ...	03/09/2004
6703695	Semiconductor device and method for producing the same The semiconductor device is composed of a semiconductor die 1, and a lead frame 7 equipped with a die paddle 2 for mounting the semiconductor die and lead terminals 3, 4, 5, 6 for external connections, with the die paddle 2 and die paddle-side ends of the...	03/09/2004
6700793	Semiconductor device Disclosed is a technique capable of improving a power supply efficiency in a power supply circuit. A power MOSFET in a high side of a combined power MOSFET constituting a DC-DC converter is constituted of a horizontal MOSFET, and a power MOSFET in a low s...	03/02/2004
6700692	Electrochromic rearview mirror assembly incorporating a display/signal light According to one embodiment of the present invention, an electrochromic rearview mirror assembly for a vehicle includes an electrochromic mirror having a variable reflectivity, a glare sensor for sensing levels of light directed towards the front element ...	03/02/2004
6689642	Semiconductor device and manufacturing method thereof Recently, there have been increasing demands for the reduction in size and weight of mobile computing/communication terminals as well as the elongation of the use time of the internal batteries. This invention alters the assembling structure of power MOSF...	02/10/2004
6677666	Lead frame for fabricating surface mount type semiconductor devices with high reliability A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions for mounting semiconductor pellets thereon having first en...	01/13/2004
6670216	Method for manufacturing a power semiconductor device and direct bonded substrate thereof Embodiments of the present invention are directed to packaged power semiconductor devices and direct-bonded metal substrates thereof. In one embodiment, a method for manufacturing a power semiconductor device comprises inserting a substrate assembly into ...	12/30/2003
6670207	Radiation emitter device having an integral micro-groove lens The radiation emitter device of the present invention includes at least two radiation emitters emitting radiation of different wavelengths, first and second electrical leads electrically coupled to at least one of the radiation emitters, and an encapsulan...	12/30/2003
6667547	High current capacity semiconductor device package and lead frame with large area connection posts and modified outline A lead frame for a high power semiconductor device die has three external lead conductors, the outer two of which are reentrantly bent outwardly from the center of the lead frame. When the lead frame is overmolded, the outer conductors are spaced from a c...	12/23/2003
6650004	Semiconductor device A semiconductor device (S1) includes a semiconductor chip (5), a chip-mounting internal lead (1) mounting the semiconductor chip (5), chip-connecting leads (2, 3) electrically connected to an upper surface of the semiconductor chip (5), and a rectangular ...	11/18/2003
6646329	Power chip scale package A packaging arrangement for a semiconductor device including a leadframe and a die coupled thereto. The die is coupled to the leadframe such that its back surface (drain area) is coplanar with source leads and a gate lead extending from the leadframe. A s...	11/11/2003
6641861	Heatsink and fabrication method thereof A method of fabricating a heatsink including a substrate of a sintered compact containing Cu and W, and a thin diamond film layer formed on the surface of the substrate with good adherence, involves immersing the substrate in acid to reduce the Cu content...	11/04/2003
6633080	Semiconductor device A transistor (200) is provided with a semiconductor chip (1) inside a resin package (20). An outer lead (41, 42, 43, 44) is arranged on a first side surface (23) of the resin package (20) to serve as an external drain electrode. A lead frame (5) includes ...	10/14/2003
6630726	Power semiconductor package with strap A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multip...	10/07/2003
6627975	Minitab rectifying diode package with two different types of diodes for alternators A diode for use in an under-the-hood automotive application has a TO 220 outline and consists of a diode die on a two piece lead frame which has a thick section to which the bottom of the die is soldered, and a thinner section which extends through a plas...	09/30/2003
6613829	Conductive hardening resin for a semiconductor device and semiconductor device using the same Conductive hardening resin for a semiconductor device of the present invention contains metal powder for providing electric conduction between electrodes positioned on the front of a semiconductor chip and a wiring material including lead terminals via a ...	09/02/2003
6608373	Support structure for power element A support structure of a power element includes a conductive mounting platform, a lead frame and a conductive lead. The conductive mounting platform includes an envelope engaging member, an interior conductive surface and an exterior conductive surface. T...	08/19/2003
6593527	Integrated circuit assembly with bar bond attachment An integrated circuit assembly 10 is provided, including a substrate 14 having at least one substrate contact surface 18, an integrated circuit device 12 having at least one first contact surface 16, and a bar bond element 22. The bar bond element 22 prov...	07/15/2003
6593622	Power mosfet with integrated drivers in a common package A driver stage consisting of an N channel FET and a P channel FET are mounted in the same package as the main power FET. The power FET is mounted on a lead frame and the driver FETs are mounted variously on a separate pad of the lead frame or on the main ...	07/15/2003
6583505	Electrically isolated power device package A packaged power device includes a substrate including a first conductive layer, a second dielectric layer, and a third conductive layer. The first conductive layer is bonded to the second dielectric layer, and the second dielectric layer is bonded to the...	06/24/2003
6580126	Solid-state relay A solid state relay composed of a series connected pair of LDMOSFETs has a minimized output capacitance. Each LDMOSFET is configured to have a silicon layer of a first conductive type, a drain region of the first conductive type diffused in the top surfac...	06/17/2003
6580161	Semiconductor device and method of making the same A semiconductor device includes a plurality of conductors 2A each of which includes a first surface 20a, a second surface 20b opposite to the first surface, a thickness defined between these surfaces, and a thin-walled end portion 22a retreating from the ...	06/17/2003
6576985	Semiconductor device packaging assembly The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembl...	06/10/2003
6576986	Semiconductor device with resin package A semiconductor device is provided with a first one-piece lead, a semiconductor chip mounted on the first lead, a second one-piece lead connected to the chip, and a resin package for enclosing the semiconductor chip together with a part of each lead. The ...	06/10/2003
6573119	Semiconductor device and method of manufacture thereof A semiconductor device having high output and a method of manufacturing the same are disclosed in which external resistance is reduced and radiating performance is improved. A MOSFET (70) comprises a plurality of inner leads electrically connected to a su...	06/03/2003
6545364	Circuit device and method of manufacturing the same After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the...	04/08/2003

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Class 257/E23.044 - For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (EPO)