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| Number | Title | Issue Date |
| 7436061 | Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to ex... | 10/14/2008 |
| 7345356 | Optical package with double formed leadframe Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing a... | 03/18/2008 |
| 7321160 | Multi-part lead frame A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame ... | 01/22/2008 |
| 7291924 | Flip chip stacked package A flip chip stacked package mainly comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires and a supporter. The supporter is attached to the lower surface of the carrier via an adhesive and covers the opening of the carri... | 11/06/2007 |
| 7250672 | Dual semiconductor die package with reverse lead form A semiconductor package that includes two semiconductor die each disposed on a respective die pad and a large tracking distance interposed between at least two leads of the package for better creepage characteristics. ... | 07/31/2007 |
| 7238549 | Surface-mounting semiconductor device and method of making the same A semiconductor device X1 comprises: a first conductor 110 including a first terminal surface 113a; a second conductor 120 placed by the first conductor 110 and including a second terminal surface 123a facing a... | 07/03/2007 |
| 7227251 | Semiconductor device and a memory system including a plurality of IC chips in a common package A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individua... | 06/05/2007 |
| 7227252 | Semiconductor component having stacked, encapsulated dice and method of fabrication A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The ... | 06/05/2007 |
| 7202105 | Multi-chip semiconductor connector assembly method In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die. ... | 04/10/2007 |
| 7138707 | Semiconductor package including leads and conductive posts for providing increased functionality A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the semiconductor die, the semiconductor package includes at least one l... | 11/21/2006 |
| 7119423 | Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument A semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. The first group of leads extends in a direction away from the second group of el... | 10/10/2006 |
| 7109576 | Semiconductor component having encapsulated die stack A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The ... | 09/19/2006 |
| 7109063 | Semiconductor substrate for build-up packages The present invention provides techniques to fabricate build-up single or multichip modules. In one embodiment, this is accomplished by dispensing die-attach material in one or more pre-etched cavities on a substrate. A semiconductor die is then placed over each pre... | 09/19/2006 |
| 6693304 | Laminated lead frame, and optical communication module and method of manufacturing the same The optical communication module comprises a laminated lead frame composed of a plurality of lead frames that are laminated and held by a tie bar made of an insulating material, and an optical communication functional unit that is disposed on at least one... | 02/17/2004 |
| 6677181 | Method for fabricating stacked chip package device The stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding-pad-disp... | 01/13/2004 |
| 6603197 | Semiconductor unit A semiconductor power module that can be downsized and is a malfunction-resistant is provided. In a semiconductor unit, a first circuit with a first semiconductor chip mounted on a first lead frame and a second circuit with a second semiconductor chip mou... | 08/05/2003 |
| 6572387 | Flexible circuit connector for stacked chip module The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend... | 06/03/2003 |
| 6574107 | Stacked intelligent power module package A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently s... | 06/03/2003 |
| 6570244 | Multi-part lead frame with dissimilar materials A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assemb... | 05/27/2003 |
| 6566760 | Semiconductor storage device having memory chips in a stacked structure Two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units. A memory module is so constructed that a plural... | 05/20/2003 |
| 6551858 | Method of producing a semiconductor device having two semiconductor chips sealed by a resin A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the wid... | 04/22/2003 |
| 6506625 | Semiconductor package having stacked dice and leadframes and method of fabrication A semiconductor package, and a method for fabricating the package are provided. The package includes a plastic body, and a pair of stacked semiconductor dice encapsulated in the plastic body, and wire bonded to separate leadframe segments. A first leadfra... | 01/14/2003 |
| 6479322 | Semiconductor device with two stacked chips in one resin body and method of producing A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the wid... | 11/12/2002 |
| 6462424 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads ... | 10/08/2002 |
| 6458617 | Multi-chip semiconductor package structure A multi-chip semiconductor package structure. The structure includes two chips and two lead frames. The leads on one of the lead frames have inner leads at one end and joint sections at the other end. The joint sections are connected with another lead fra... | 10/01/2002 |
| 6426560 | Semiconductor device and memory module Two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units. A memory module is so constructed that a plural... | 07/30/2002 |
| 6376905 | Semiconductor package A resin encapsulated semiconductor package, which uses leads (lead frame), and enhances heat conducting properties and prevents breaking of lengths of bonding wire, reduction in service life of solder joints and crack of a resin while ensuring reliability... | 04/23/2002 |
| 6376903 | Semiconductor chip package with multilevel leads A semiconductor chip package includes a semiconductor chip having a plurality of contact pads, a plurality of first leads, a plurality of second leads and a housing. Each of the first leads includes an inner lead portion which is electrically coupled to a... | 04/23/2002 |
| 6362022 | Multi-part lead frame with dissimilar materials and method of manufacturing A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assemb... | 03/26/2002 |
| 6358774 | Method of manufacturing a semiconductor device In the known method, a semiconductor element (1) is provided with two connecting conductors (2, 3) by arranging, preferably a large number of elements (1) between first and a second conductive plate (5, 6), the two connecting conductors (2, 3) secured at ... | 03/19/2002 |
| 6317327 | Diode cooling arrangement A diode cooling arrangement includes a crystal having two end faces and two metal radiating fins respectively soldered to the end faces of the crystal, one radiating fin having two upright flanges at two opposite lateral sides adapted to hold the crystal ... | 11/13/2001 |
| 6316825 | Chip stack package utilizing a connecting hole to improve electrical connection between leadframes The present invention relates to a stack package, as well as a method for fabricating the same, the stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center ... | 11/13/2001 |
| 6303981 | Semiconductor package having stacked dice and leadframes and method of fabrication A semiconductor package, and a method for fabricating the package are provided. The package includes a plastic body, and a pair of stacked semiconductor dice encapsulated in the plastic body, and wire bonded to separate leadframe segments. A first leadfra... | 10/16/2001 |
| 6281043 | Fabrication of hybrid semiconductor devices Two phase bridge rectifier, plastic encapsulated devices having four external terminal leads are batch fabricated using a workpiece of three stacked together lead frames wherein, at each of a plurality of device sites on the workpiece, two, two-chip stack... | 08/28/2001 |
| 6211564 | Integrated circuit package having stepped terminals An integrated circuit package is configured to host an electric circuit chip therein and have connected thereto a set of external terminals that provide electrical connections between the electric circuit chip and components that are external to the integ... | 04/03/2001 |
| 6201294 | Ball grid array semiconductor package comprised of two lead frames A ball grid array (BGA) semiconductor package includes a paddle, a semiconductor chip on the paddle, a plurality of first leads around a periphery of the paddle, a plurality of second leads attached to a lower surface of each of the first leads, a plurali... | 03/13/2001 |
| 6165819 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads ... | 12/26/2000 |
| 6140154 | Multi-part lead frame with dissimilar materials and method of manufacturing A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assemb... | 10/31/2000 |
| 6087204 | Method of making a multi-layer lead frame A multi-layer lead frame for use in a semiconductor package is described. The described lead frame is particularly well suited for application where fine pitch leads and/or lead multi-routing capability is required. In one embodiment, the multi-layered le... | 07/11/2000 |
| 6084309 | Semiconductor device and semiconductor device mounting structure A semiconductor device includes a semiconductor chip, a package encapsulating the semiconductor chip, a plurality of leads each having one end electrically connected to the semiconductor chip and another end exposed at a wall surface of the package to for... | 07/04/2000 |
