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Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 7329944 | Leadframe for semiconductor device A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to... | 02/12/2008 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7256481 | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (302) and a plurality of lead segments (303). Covering the base metal are, consecutively, a continuous nickel ... | 08/14/2007 |
| 7247947 | Semiconductor device comprising a plurality of semiconductor constructs A semiconductor device includes a first semiconductor construct provided on a base plate and having a semiconductor substrate and external connection electrodes. An insulating layer is provided on the base plate around the first semiconductor construct. An upper lay... | 07/24/2007 |
| 7239019 | Selectively converted inter-layer dielectric An inter-layer dielectric structure and method of making such structure are disclosed. A composite dielectric layer, initially comprising a porous matrix and a porogen, is formed. Subsequent to other processing treatments, the porogen is decomposed and removed from ... | 07/03/2007 |
| 7187083 | Thermal interface material and solder preforms A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface l... | 03/06/2007 |
| 6403402 | Semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 06/11/2002 |
| 6369441 | Method of producing a semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 04/09/2002 |
| 6351025 | Semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 02/26/2002 |
| 6139977 | Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers ar... | 10/31/2000 |
| 6140153 | Lead frame, the manufacturing method, semiconductor device and the manufacturing method To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 10/31/2000 |
| 6087204 | Method of making a multi-layer lead frame A multi-layer lead frame for use in a semiconductor package is described. The described lead frame is particularly well suited for application where fine pitch leads and/or lead multi-routing capability is required. In one embodiment, the multi-layered le... | 07/11/2000 |
| 6080264 | Combination of semiconductor interconnect An apparatus and method for increasing integrated circuit density comprising utilizing chips with both direct (flip chip type) chip to conductors connection technology and wire bonds and/or TAB. An aspect of the present invention comprises at least one se... | 06/27/2000 |
| 5994768 | Multi-layer lead frame A multi-layer lead frame for use in a semiconductor package is described. The described lead frame is particularly well suited for application where fine pitch leads and/or lead multi-routing capability is required. In one embodiment, the multi-layered le... | 11/30/1999 |
| 5976915 | Low mutual inductance lead frame device A packaged semiconductor device, such as a lead frame device, includes a circuit supported within an enclosure. The circuit is coupled to a plurality of conductive leads within the enclosure. The leads extend from the enclosure for electrically coupling t... | 11/02/1999 |
| 5917242 | Combination of semiconductor interconnect An apparatus and method for increasing integrated circuit density comprising utilizing chips with both direct (flip chip type) chip to conductors connection technology and wire bonds and/or TAB. An aspect of the present invention comprises at least one se... | 06/29/1999 |
| 5909053 | Lead frame and method for manufacturing same In a method for manufacturing a lead frame, a predetermined pattern is formed on a matrix 10 by a resist, an electro-deposition portion is provided in a cavity formed in the resist patterns 12, and the electrodeposition pattern 13 is separated from the ma... | 06/01/1999 |
| 5880520 | Low mutual inductance lead frame device A packaged semiconductor device, such as a lead frame device, includes a circuit supported within an enclosure. The circuit is coupled to a plurality of conductive leads within the enclosure. The leads extend from the enclosure for electrically coupling t... | 03/09/1999 |
| 5864173 | Multi-layer lead frame A multi-layer lead frame for use in a semiconductor package is described. The described lead frame is particularly well suited for application where fine pitch leads and/or lead multi-routing capability is required. In one embodiment, the multi-layered le... | 01/26/1999 |
| 5672908 | Thin semiconductor integrated circuit device assembly A plurality of electrodes are formed on one surface of a semiconductor integrated circuit chip. A plurality of leads are arranged around the chip. Each of the electrodes and one end of each of the leads are connected. The electrodes and the chip are sandw... | 09/30/1997 |
| 5656855 | Lead frame and method for manufacturing same In a method for manufacturing a lead frame, a predetermined pattern is formed on a matrix 10 by a resist, an electro-deposition portion is provided in a cavity formed in the resist patterns 12, and the electro-deposition pattern 13 is separated from the m... | 08/12/1997 |
| 5643433 | Lead frame and method for manufacturing same A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that... | 07/01/1997 |
| 5556807 | Advance multilayer molded plastic package using mesic technology A method and resulting structure for constructing an IC package utilizing thin film technology. The package has a bottom conductive plate that has a layer of ceramic vapor deposited onto the plate in a predetermined pattern. Adjacent to the insulative lay... | 09/17/1996 |
| 5554886 | Lead frame and semiconductor package with such lead frame A lead frame and a semiconductor package produced using the lead frame are disclosed. The lead frame has a plurality of multi-layered inner leads, each of the multi-layered inner leads having at least two different metal layers joined to each other. An ou... | 09/10/1996 |
| 5525836 | Multilayer metal leadframe A leadframe for use in mounting and interconnecting an integrated circuit. A first or base metal layer of the leadframe comprises at least one of brass or other copper alloy. A second, conducting layer atop the base layer comprises at least one of aluminu... | 06/11/1996 |
| 5488257 | Multilayer molded plastic package using mesic technology A method and resulting structure for constructing an IC package utilizing thin film technology. The package has a bottom conductive plate that has a layer of ceramic vapor deposited onto the plate in a predetermined pattern. Adjacent to the insulative lay... | 01/30/1996 |
| 5480841 | Process of multilayer conductor chip packaging A process of providing an external wiring and connecting package for a semiconductor chip wherein the chip is a major contributor to the strength of the package. External contacts and wiring are provided by a multilayer wiring member that may include a me... | 01/02/1996 |
| 5461255 | Multi-layered lead frame assembly for integrated circuits There is provided a packaged semiconductor device having a multi-layered lead frame assembly (38). An integrated circuit chip (12) has an active face (16) with a plurality of bond pads (18) disposed along its center line (14). A first pair of insulating a... | 10/24/1995 |
| 5455387 | Semiconductor package with chip redistribution interposer An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have sec... | 10/03/1995 |
| 5448106 | Thin semiconductor integrated circuit device assembly A plurality of electrodes are formed on one surface of a semiconductor integrated circuit chip. A plurality of leads are arranged around the chip. Each of the electrodes and one end of each of the leads are connected. The electrodes and the chip are sandw... | 09/05/1995 |
| 5437096 | Method for making a multilayer metal leadframe A fabrication method and leadframe construction in which the leadframe is formed by selectively removing portions of a multilayer clad strip to expose a selected pattern of a conductive metal to conform to the desired application of the leadframe. The cla... | 08/01/1995 |
| 5410180 | Metal plane support for multi-layer lead frames and a process for manufacturing such frames A metal plane support structure of a semiconductor device multi-layer lead frame having one or more metal planes, of different types, arranged in stacked and aligned relationship with and adhered to a corresponding lead frame. Metal planes of a common typ... | 04/25/1995 |
| 5399902 | Semiconductor chip packaging structure including a ground plane A semiconductor chip package wherein the chip is a major contributor to the strength of the package. External contacts and wiring are provided by a multilayer wiring member that has a mesh ground plane with embedded power bus layer over a conductor layer ... | 03/21/1995 |
| 5389816 | Multi-layer lead frame using a metal-core substrate A metal-core-type multi-layer lead frame adapted to be used for a semiconductor device includes a metal core plate on which a semiconductor chip is to be mounted. A plurality of signal lines are formed on the metal core plate. A metal plane, such as a pow... | 02/14/1995 |
| 5378657 | Method for making an aluminum clad leadframe and a semiconductor device employing the same A quad leadframe (22') for a CERQUAD is manufactured using conventional cladding and stamping technologies. A first metal layer (12) is provided with multiple cavities (14). A second metal layer (14) is clad to the first metal layer. A leadframe strip (22... | 01/03/1995 |
| 5375041 | Ra-tab array bump tab tape based I.C. package An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plur... | 12/20/1994 |
| 5362656 | Method of making an electronic assembly having a flexible circuit wrapped around a substrate An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plur... | 11/08/1994 |
| 5357674 | Method of manufacturing a printed circuit board A method of manufacturing a printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices are mounted on the top of the upper substrate and on the ... | 10/25/1994 |
| 5331200 | Lead-on-chip inner lead bonding lead frame method and apparatus A multi-level lead frame configuration (114) for an integrated circuit chip (116) comprises a main lead frame (115) having a plurality of lead frame bond fingers (122 and 124) that directly connect to a plurality of bond pads (126) on the integrated circu... | 07/19/1994 |
| 5329159 | Semiconductor device employing an aluminum clad leadframe A quad leadframe (22') for a CERQUAD is manufactured using conventional cladding and stamping technologies. A first metal layer (12) is provided with multiple cavities (14). A second metal layer (14) is clad to the first metal layer. A leadframe strip (22... | 07/12/1994 |
