Quotables
"Flight by machines heavier than air is unpractical and insignificant, if not utterly impossible."
Simon Newcomb, astronomer ; Said in 1902, less than two years before the first flight at Kitty Hawk
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7420265 | Integrated circuit package system with integrated circuit support An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.... | 09/02/2008 |
| 7405485 | Semiconductor device A semiconductor device provided with a first semiconductor chip having a first functional surface formed with a first functional element and a first rear surface, a second semiconductor chip having a second functional surface which is formed with a second functional... | 07/29/2008 |
| 7391120 | Increasing the adhesion of an adhesive connection in housings A housing having a non-detachable bond to a micromechanical component using a flexible bonding material in particular. The combination including the housing and the micromechanical component as well as the manufacturing method of this combination. At least part of t... | 06/24/2008 |
| 7388280 | Package stacking lead frame system The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a first die on the die attach pad, wherein the first die is connected t... | 06/17/2008 |
| 7372129 | Two die semiconductor assembly and system including same A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the die paddle, a second semiconductor die secured by a backside thereof... | 05/13/2008 |
| 7345356 | Optical package with double formed leadframe Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing a... | 03/18/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7327039 | Nanoparticle filled underfill The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting r... | 02/05/2008 |
| 7285851 | Liquid immersion cooled multichip module In one embodiment, a liquid immersion cooled multichip module is provided which includes a substrate having chips mounted thereon and which is adapted to mount with a printed circuit board. A lid is adapted to secure to the printed circuit board so as to mount with ... | 10/23/2007 |
| 7274092 | Semiconductor component and method of assembling the same A semiconductor component includes at least one semiconductor power switch, wherein a gate electrode and at least two source regions are disposed on the upper side of the semiconductor power switch. The component further includes a leadframe including a die pad and ... | 09/25/2007 |
| 7256504 | Circuit support for a semiconductor chip and component A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral ... | 08/14/2007 |
| 7239026 | Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip A semiconductor device comprises a substrate, a ferroelectric capacitor which includes a ferroelectric film on the substrate, and a stress application layer which applies tensile or compressive stress to the ferroelectric film of the ferroelectric capacitor by apply... | 07/03/2007 |
| 7214582 | Semiconductor substrate and semiconductor circuit formed therein and fabrication methods A semiconductor substrate and a semiconductor circuit formed therein and associated fabrication methods are provided. A multiplicity of depressions with a respective dielectric layer and a capacitor electrode are formed for realizing buried capacitors in a carrier s... | 05/08/2007 |
| 7205625 | Junction substrate and method of bonding substrates together A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of t... | 04/17/2007 |
| 7202113 | Wafer level bumpless method of making a flip chip mounted semiconductor device package A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside, processing the solder mask coating to reveal a plurality of gate contact a... | 04/10/2007 |
| 7187083 | Thermal interface material and solder preforms A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface l... | 03/06/2007 |
| 7183657 | Semiconductor device having resin anti-bleed feature A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the s... | 02/27/2007 |
| 7170186 | Laminated radiation member, power semiconductor apparatus, and method for producing the same A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method includi... | 01/30/2007 |
| 7115990 | Bumped die and wire bonded board-on-chip package An apparatus for making a semiconductor assembly and, specifically, interconnecting a semiconductor die to a carrier substrate. The carrier substrate includes a first surface and a second surface with at least one opening therethrough. The die includes an active sur... | 10/03/2006 |
| 7109588 | Method and apparatus for attaching microelectronic substrates and support members A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surf... | 09/19/2006 |
| 6703075 | Wafer treating method for making adhesive dies A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage pro... | 03/09/2004 |
| 6700178 | Package of a chip with beveled edges A chip with beveled edges suitable for adhering onto a surface of a die pad by an adhesive material. The chip has an active surface and a corresponding back surface, wherein the active surface has beveled edges. The back surface of the chip is adhered ont... | 03/02/2004 |
| 6689638 | Substrate-on-chip packaging process A SOC (Substrate-On-Chip) packaging process is disclosed. A layer of two-stage thermosetting mixture with solvent is coating on an upside of a substrate. Thereafter, the substrate is heated for removing solvent so that the two-stage thermosetting mixture ... | 02/10/2004 |
| 6685777 | Paste applicator and paste application method for die bonding A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A di... | 02/03/2004 |
| 6661102 | Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress A semiconductor packaging apparatus for preventing cracking and delamination in a packaged semiconductor chip by controlling the die attach fillet height. Specifically, the present invention controls the die attach material height, thereby controlling the... | 12/09/2003 |
| 6645632 | Film-type adhesive for electronic components, and electronic components bonded therewith A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecu... | 11/11/2003 |
| 6596564 | Semiconductor device and method of manufacturing the same AS conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in rad... | 07/22/2003 |
| 6590279 | Dual-chip integrated circuit package and method of manufacturing the same A dual-chip integrated circuit package and a method for manufacturing such a dual-chip integrated circuit package are proposed, which can help prevent the occurrence of cracking and delamination in the chips and the occurrence of voids in the encapsulant ... | 07/08/2003 |
| 6576057 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe are disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass... | 06/10/2003 |
| 6558791 | Heat-resistant adhesive sheet A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part betwe... | 05/06/2003 |
| 6559526 | Multiple-step inner lead of leadframe A structure of a stacked-type multi-chip stack package of the leadframe, the shape of the stair-like inner leads can be regulated for the high and the amount of stacked chips and to match different bonding technology. The process for forming the present s... | 05/06/2003 |
| 6544864 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to... | 04/08/2003 |
| 6537051 | Encapsulation mold with a castellated inner surface A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminat... | 03/25/2003 |
| 6512286 | Semiconductor package with no void in encapsulant and method for fabricating the same A semiconductor package and a method for fabricating the same are proposed, in which a chip is attached to a die pad formed with an opening in a manner that the chip covers the opening and a surface of the chip is partially exposed to the opening. A cover... | 01/28/2003 |
| 6486004 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device ... | 11/26/2002 |
| 6476471 | Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areas Microelectronic-device assemblies and methods are provided that enhance operation of microelectronic devices because they exclude extraneous elements from sensitive device areas. They are especially suited for devices that carry a plurality of bonding pad... | 11/05/2002 |
| 6469086 | Plastic molding compound, composite body, and filler for a plastic molding compound An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by... | 10/22/2002 |
| 6462418 | Semiconductor device having improved heat radiation As conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in rad... | 10/08/2002 |
| 6452282 | Insulating adhesive tape for a semiconductor chip package having a copper lead frame An insulating tape for use in LOC (lead-on-chip) type semiconductor chip packages. With a tripartite structure in which two adhesive layers are provided to both surfaces of a base film, the insulating tape ranges, in coefficient of thermal expansion, from... | 09/17/2002 |
| 6426552 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to... | 07/30/2002 |
