Bizarre Patents
A helium-filled sun shade for protecting individuals engaged in outdoor activities.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7439611 | Circuit board with auxiliary wiring configuration to suppress breakage during bonding process A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconduc... | 10/21/2008 |
| 7436049 | Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package A semiconductor chip package with a lead frame having a plurality of leads formed along four sides of the lead frame and tie bars extending from an edge of each of the four sides, wherein bottom surfaces of the tie bars are recessed, a semiconductor chip which is ad... | 10/14/2008 |
| 7413933 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor A semiconductor including a leadframe having a die attach paddle and a number of leads is provided. The die attach paddle has a recess to provide a number of mold dams around the periphery of the die attach paddle. An integrated circuit is positioned in the recess. ... | 08/19/2008 |
| 7414303 | Lead on chip semiconductor package The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in th... | 08/19/2008 |
| 7414319 | Semiconductor chip assembly with metal containment wall and solder terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pa... | 08/19/2008 |
| 7408244 | Semiconductor package and stack arrangement thereof A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor pac... | 08/05/2008 |
| 7408243 | High temperature package flip-chip bonding to ceramic A sensor package apparatus and method are disclosed in which a sensor die is provided and based on a substrate. An integrated circuit is generally associated with the sensor die. A leadframe is also provided, which is connected by at least one weld to the integrated... | 08/05/2008 |
| 7405104 | Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between th... | 07/29/2008 |
| 7400002 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/15/2008 |
| 7391102 | Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces Disclosed is a semiconductor apparatus including: a first molded resin portion; a plate-shaped lead frame closely attached to the first molded resin portion; a second molded resin portion attached facing the first molded resin portion and the lead frame; and one or ... | 06/24/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7368806 | Flip chip package with anti-floating structure A flip chip package with an anti-floating structure includes a leadframe, a flip chip, and a plurality of solders. The leadframe includes a plurality of leads and a fastening part. At least one locking hole is formed on an upper surface of the fastening part. The fl... | 05/06/2008 |
| 7339257 | Semiconductor device in which semiconductor chip is mounted on lead frame A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, an... | 03/04/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7323361 | Packaging system for semiconductor devices A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that has pre-formed gull-wing leads only on the source/gate side of the chi... | 01/29/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7315086 | Chip-on-board package having flip chip assembly structure and manufacturing method thereof A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the fil... | 01/01/2008 |
| 7282786 | Semiconductor package and process for making the same A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip... | 10/16/2007 |
| 7274089 | Integrated circuit package system with adhesive restraint An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad. ... | 09/25/2007 |
| 7259451 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 08/21/2007 |
| 7247944 | Connector assembly An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die through a plurality of conductive traces. A plurality of leads extends from... | 07/24/2007 |
| 7247937 | Mounting pad structure for wire-bonding type lead frame packages A chip package having a lead frame, a chip, a plurality of bonding wires, and an insulation material is provided. The lead frame comprises a die pad, a plurality of leads, a plurality of signal pads and a plurality of non-signal pads. The signal pads and non-signal ... | 07/24/2007 |
| 7247520 | Microelectronic component assemblies and microelectronic component lead frame structures The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads... | 07/24/2007 |
| 7227251 | Semiconductor device and a memory system including a plurality of IC chips in a common package A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individua... | 06/05/2007 |
| 7227249 | Three-dimensional stacked semiconductor package with chips on opposite sides of lead A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on opposite sides of the lead, and the wire bonds contact the same side of t... | 06/05/2007 |
| 7227198 | Half-bridge package A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated di... | 06/05/2007 |
| 7217599 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor A semiconductor including a leadframe having a die attach paddle and a number of leads is provided. The die attach paddle has a recess to provide a number of mold dams around the periphery of the die attach paddle. An integrated circuit is positioned in the recess. ... | 05/15/2007 |
| 7199407 | Semiconductor device An island-shaped floating conducting region is provided in a region of the substrate between the adjacent wires on the nitride film, between the adjacent wire on the nitride film and conducting region (the operating region, resistor, or peripheral impurity region), ... | 04/03/2007 |
| 7196404 | Motion detector and method of producing the same A method of producing an electronic device electrically and mechanically couples an integrated circuit to a leadframe to produce an intermediate assembly. At least a portion of the intermediate assembly then is encapsulated with a molten encapsulating material. Afte... | 03/27/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7190060 | Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first semiconductor chip and a first lead that is bent outside the first i... | 03/13/2007 |
| 7183632 | Surface-mountable light-emitting diode structural element A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electri... | 02/27/2007 |
| 7180161 | Lead frame for improving molding reliability and semiconductor package with the lead frame A lead frame for improving molding reliability and a semiconductor package with the lead frame are proposed. At least one embossed structure, such as a metal bump or recessed portion, is formed on a bonding layer of a wire-bonding area of the lead frame. At least on... | 02/20/2007 |
| 7176568 | Semiconductor device and its manufacturing method, electronic module, and electronic unit A semiconductor device is provided having: a board; a metallization pattern formed on the first face of the board; a first layer formed so as to not cover the first portion of the metallization pattern but to cover the second portion; and a semiconductor chip mounte... | 02/13/2007 |
| 7170161 | In-process semiconductor packages with leadframe grid arrays Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or form... | 01/30/2007 |
| 7161232 | Apparatus and method for miniature semiconductor packages A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent th... | 01/09/2007 |
| 7148578 | Semiconductor multi-chip package A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is ele... | 12/12/2006 |
| 7138707 | Semiconductor package including leads and conductive posts for providing increased functionality A semiconductor package comprising a semiconductor die which has opposed first and second surfaces and at least first and second bond pads disposed on the second surface thereof. In addition to the semiconductor die, the semiconductor package includes at least one l... | 11/21/2006 |
| 7115978 | Package Structure A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead fra... | 10/03/2006 |
| 7091588 | Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while... | 08/15/2006 |
