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| Number | Title | Issue Date |
| 7408244 | Semiconductor package and stack arrangement thereof A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor pac... | 08/05/2008 |
| 7230279 | Memory card A memory card is provided. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer c... | 06/12/2007 |
| 7091595 | Semiconductor device with semiconductor chip and rewiring layer and method for producing the same The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall t... | 08/15/2006 |
| 6670216 | Method for manufacturing a power semiconductor device and direct bonded substrate thereof Embodiments of the present invention are directed to packaged power semiconductor devices and direct-bonded metal substrates thereof. In one embodiment, a method for manufacturing a power semiconductor device comprises inserting a substrate assembly into ... | 12/30/2003 |
| 6661081 | Semiconductor device and its manufacturing method Attaining improvement of the reliability and standardization of the lead frame. A semiconductor device comprises a plurality of inner leads extending around a semiconductor chip, a tape substrate supporting the semiconductor chip and joined to respective ... | 12/09/2003 |
| 6630733 | Integrated circuit package electrical enhancement A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooli... | 10/07/2003 |
| 6518650 | Tape under frame for lead frame IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 02/11/2003 |
| 6498389 | Ultra-thin semiconductor package device using a support tape An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of... | 12/24/2002 |
| 6443298 | Surface package type semiconductor package and method of producing semiconductor memory In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture be... | 09/03/2002 |
| 6329710 | Integrated circuit package electrical enhancement A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooli... | 12/11/2001 |
| 6306687 | Tape under frame for conventional-type IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 10/23/2001 |
| 6223893 | Surface package type semiconductor package and method of producing semiconductor memory In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture be... | 05/01/2001 |
| 6215177 | Tape under frame for conventional-type IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 04/10/2001 |
| 6143589 | Tape under frame for conventional-type IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 11/07/2000 |
| 6091133 | Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 07/18/2000 |
| 6087720 | Integrated circuit package electrical enhancement A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooli... | 07/11/2000 |
| 6025651 | Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads A semiconductor package has a controlling IC attached to a die pad using an epoxy molding compound (EMC) pad. The EMC pad is formed so as to be slightly larger than the controlling IC. EMC pads are cut from an EMC pad pattern which is formed from a predet... | 02/15/2000 |
| 5915166 | Tape under frame for conventional-type IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 06/22/1999 |
| 5907184 | Integrated circuit package electrical enhancement A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooli... | 05/25/1999 |
| 5780772 | Solution to mold wire sweep in fine pitch devices A method of preventing non-uniform bonding wire sweep during an encapsulating process of an integrated circuit package includes the step of forming an encapsulating material flow restricting element between two widely spaced functional bonding wires. The ... | 07/14/1998 |
| 5729049 | Tape under frame for conventional-type IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 03/17/1998 |
| 5723903 | Thin type semiconductor device, module structure using the device and method of mounting the device on board Ends of inner leads are disposed in the vicinity of a peripheral end of a semiconductor chip and a portion of an insulating film tape is affixed to a main surface of the semiconductor chip by an adhesive while other portions of the insulating film tape ar... | 03/03/1998 |
| 5710457 | Semiconductor integrated circuit A semiconductor integrated circuit is characterized in that a semiconductor chip and the distal end portions of inner leads are adhered and fixed using a coupling support member consisting of an insulating film with an insulating adhesive layer so as to e... | 01/20/1998 |
| 5633528 | Lead frame structure for IC devices with strengthened encapsulation adhesion This invention relates to lead flames upon which chips (A or B) are mounted prior to encapsulation during IC device packaging. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) an... | 05/27/1997 |
| 5607059 | Surface package type semiconductor package and method of producing semiconductor memory In surface packaging of thin resin packages such as resin molded memory ICs cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve th... | 03/04/1997 |
| 5473192 | Unitary silicon die module A semiconductor chip module is formed by providing at least one semiconductor chip and a semiconductor substrate and bonding the semiconductor chip to the semiconductor substrate without the use of an epoxy or a metallic layer to create a bond between the... | 12/05/1995 |
| 5455454 | Semiconductor lead frame having a down set support member formed by inwardly extending leads within a central aperture A semiconductor lead frame is disclosed. An adhesive tape is attached on one end part of inner leads and a bus bar, and a semiconductor chip is mounted on the adhesive tape without using a conventional die pad, wherein the inner leads is formed with a gap... | 10/03/1995 |
| 5448105 | Semiconductor device having a leadframe and metal substrate A leadframe according to this invention is formed by bonding a single leadframe with a substrate using adhesive film or double-sided adhesive resin film, which is divided and attached to two or more predetermined points between them. This reduces the quan... | 09/05/1995 |
| 5446313 | Thin type semiconductor device and module structure using the device Ends of inner leads are disposed in the vicinity of a peripheral end of a semiconductor chip and a portion of an insulating film tape is affixed to a main surface of the semiconductor chip by an adhesive while other portions of the insulating film tape ar... | 08/29/1995 |
| 5429992 | Lead frame structure for IC devices with strengthened encapsulation adhesion This invention relates to lead frames upon which chips (A or B) are mounted prior to encapsulation during IC device packaging. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) an... | 07/04/1995 |
| 5403785 | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality of connector leads with inner and outer lead sites for el... | 04/04/1995 |
| 5379187 | Design for encapsulation of thermally enhanced integrated circuits An improved packaging technique for packaging a thermally-enhanced, molded-plastic quad flat package (TE-QFP). An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate having a stepped area formed into the outer ma... | 01/03/1995 |
| 5365409 | Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe A package design configuration for an integrated-circuit die includes a leadframe having its bonding fingers connected to the periphery of an electrically-insulated, heat-conductive substrate, formed, for example, of a ceramic material. A number of electr... | 11/15/1994 |
| 5357139 | Plastic encapsulated semiconductor device and lead frame In a package for DRAM, plastic is included between the common signal inner leads (bus bar inner leads) and insulating films arranged in the central part of a semiconductor chip. Thus, the deformation of plastic at the upper edge of the common signal inner... | 10/18/1994 |
| 5304842 | Dissimilar adhesive die attach for semiconductor devices A semiconductor assembly comprises a semiconductor die which is attached by a carrier material to a lead frame. The carrier material is coated on the die side with one type of adhesive and on the lead frame side with a different adhesive. The lead frame h... | 04/19/1994 |
| 5299097 | Electronic part mounting board and semiconductor device using the same An electronic part mounting board and a semiconductor device which may be easily fabricated and have high reliability by preventing deterioration due to heat at the time of fabrication and the occurrence of internal stress. In the electronic part mounting... | 03/29/1994 |
| 5295297 | Method of producing semiconductor memory In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging... | 03/22/1994 |
| 5274914 | Method of producing surface package type semiconductor package In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging... | 01/04/1994 |
| 5256903 | Plastic encapsulated semiconductor device A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side (edge) surfaces of the insulating films. As a result, therefore... | 10/26/1993 |
| 5252855 | Lead frame having an anodic oxide film coating Lead frames, in which at least one part of the surface of a metal member which is a part of the lead frame is provided with an anodic oxide film of copper or a copper alloy, and in which a member composed substantially of a resin film or a resin plate is ... | 10/12/1993 |
