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| Number | Title | Issue Date |
| 7436049 | Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package A semiconductor chip package with a lead frame having a plurality of leads formed along four sides of the lead frame and tie bars extending from an edge of each of the four sides, wherein bottom surfaces of the tie bars are recessed, a semiconductor chip which is ad... | 10/14/2008 |
| 7432588 | Semiconductor device and method of fabricating the same A semiconductor device 100 comprises a leadframe 104 having an island portion 102; two chips of a first semiconductor chip 110 and a second semiconductor chip 120, respectively having top surfaces having, in the peripheral areas th... | 10/07/2008 |
| 7420265 | Integrated circuit package system with integrated circuit support An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.... | 09/02/2008 |
| 7414302 | Flashless lead frame with horizontal singulation A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segm... | 08/19/2008 |
| 7408241 | Semiconductor device with a recessed bond pad A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact connection surfaces on the underside of the semiconductor device. In their ... | 08/05/2008 |
| 7391120 | Increasing the adhesion of an adhesive connection in housings A housing having a non-detachable bond to a micromechanical component using a flexible bonding material in particular. The combination including the housing and the micromechanical component as well as the manufacturing method of this combination. At least part of t... | 06/24/2008 |
| 7345357 | High density chip scale leadframe package and method of manufacturing the package An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of inner leads is disposed substantially co-planer with and substantial... | 03/18/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7323765 | Die attach paddle for mounting integrated circuit die An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surf... | 01/29/2008 |
| 7298026 | Large die package and method for the fabrication thereof A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a portion of the paddle and at least a portion of the leads of the lead-fram... | 11/20/2007 |
| 7282786 | Semiconductor package and process for making the same A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip... | 10/16/2007 |
| 7274091 | Semiconductor device and method of manufacturing a semiconductor device There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a se... | 09/25/2007 |
| 7274089 | Integrated circuit package system with adhesive restraint An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad. ... | 09/25/2007 |
| 7274092 | Semiconductor component and method of assembling the same A semiconductor component includes at least one semiconductor power switch, wherein a gate electrode and at least two source regions are disposed on the upper side of the semiconductor power switch. The component further includes a leadframe including a die pad and ... | 09/25/2007 |
| 7262491 | Die pad for semiconductor packages and methods of making and using same A semiconductor device package comprising a semiconductor device and an electrically conductive lead frame at least partially covered by a molding compound. The electrically conductive lead frame includes a plurality of leads disposed proximate a perimeter of the pa... | 08/28/2007 |
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package Aspects of the invention recite wire bonding on thinned portions of a lead-frame that is configured for use in an IC package. A harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself, in various combinations or s... | 08/21/2007 |
| 7253506 | Micro lead frame package The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of electrically conductive material, such as copper, and may be mounted wit... | 08/07/2007 |
| 7253503 | Integrated circuit device packages and substrates for making the packages Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite second surface, and apertures between the first and second surfaces. A pla... | 08/07/2007 |
| 7242077 | Leadframe with die pad A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the side... | 07/10/2007 |
| 7232755 | Process for fabricating pad frame and integrated circuit package A process for fabricating a pad frame for an integrated circuit package includes building up metal on selective portions of a first side of a substrate to define a plurality of contact pads disposed in a first layer of dielectric material, depositing a metal seed la... | 06/19/2007 |
| 7227198 | Half-bridge package A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated di... | 06/05/2007 |
| 7215010 | Device for packing electronic components using injection molding technology A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3... | 05/08/2007 |
| 7215012 | Space-efficient package for laterally conducting device Efficient utilization of space in a laterally-conducting semiconductor device package is enhanced by creating at least one supplemental downbond pad portion of the diepad for receiving the downbond wire from the ground contact of the device. The supplemental diepad ... | 05/08/2007 |
| 7208818 | Power semiconductor package A semiconductor package including a relatively thick lead frame having a plurality of leads and a first lead frame pad, the first lead frame pad including a die coupled thereto, bonding wires connecting the die to the plurality of leads, the bonding wires being alum... | 04/24/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7190055 | Lead frame and semiconductor device A lead frame is provided. Although there is a die pad (2) located to deviate from a main plane center line of a resin molding area (10), a die pad connecting portion (6) is located to deviate from the main plane center line of the resin molding ... | 03/13/2007 |
| 7183632 | Surface-mountable light-emitting diode structural element A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electri... | 02/27/2007 |
| 7170168 | Flip-chip semiconductor package with lead frame and method for fabricating the same A flip-chip semiconductor package with a lead frame and a method for fabricating the same are provided. The lead frame has a plurality of leads, each lead having an upper surface, a lower surface, and an inner end directed toward the center of the lead frame. A rece... | 01/30/2007 |
| 7164192 | Semiconductor die package with reduced inductance and reduced die attach flow out In one exemplary embodiment, a structure comprises a substrate having a top surface, and a die attach pad situated on the top surface of the substrate. The die attach pad includes a die attach region and at least one substrate ground pad region electrically connecte... | 01/16/2007 |
| 7115978 | Package Structure A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead fra... | 10/03/2006 |
| 7087986 | Solder pad configuration for use in a micro-array integrated circuit package A solder pad configuration for use in an IC package is described. Various embodiments of the invention describe IC packages, lead-frames, or substrate panels configured with generally noncircular solder pads at their bottom surfaces. The noncircular shapes allow for... | 08/08/2006 |
| 6703696 | Semiconductor package A semiconductor package is comprised of a semiconductor device 4 mounted on a die-pad 3, a wire 6 for electrically connecting some electrodes of the semiconductor device 4 and terminals 5 of lead frame, wires 8 for bonding the other electrodes of semicond... | 03/09/2004 |
| 6692989 | Plastic molded type semiconductor device and fabrication process thereof A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pa... | 02/17/2004 |
| 6674154 | Lead frame with multiple rows of external terminals A lead frame includes a die pad, a suspension lead and a plurality of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon produc... | 01/06/2004 |
| 6670222 | Texturing of a die pad surface for enhancing bonding strength in the surface attachment Laser beam or pulsed output is provided for enhancing the bonding strength between surfaces that are secured together, such as by lamination process or an adhesive, by texturing with a plurality of indentations formed in at least one of the surfaces to be... | 12/30/2003 |
| 6661083 | Plastic semiconductor package A lead frame for a surface mount semiconductor chip package includes a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a peripheral margin of the paddle, and having a central die ... | 12/09/2003 |
| 6650020 | Resin-sealed semiconductor device The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their respective tips facing the die pad portion, thin metal wires f... | 11/18/2003 |
| 6642609 | Leadframe for a semiconductor device having leads with land electrodes In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land p... | 11/04/2003 |
| 6639306 | Semiconductor package having a die pad with downward-extended tabs A semiconductor package having a lead frame formed with a die pad and a plurality of conductive leads, wherein the die pad is formed with a plurality of tabs to impede the resin flow below the die pad such that a downward pressure is produced because the ... | 10/28/2003 |
| 6638790 | Leadframe and method for manufacturing resin-molded semiconductor device In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land p... | 10/28/2003 |
