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| Number | Title | Issue Date |
| 7345357 | High density chip scale leadframe package and method of manufacturing the package An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of inner leads is disposed substantially co-planer with and substantial... | 03/18/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7230320 | Electronic circuit device with reduced breaking and cracking In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal membe... | 06/12/2007 |
| 7217998 | Semiconductor device having a heat-dissipation member A semiconductor device is disclosed that includes a semiconductor element, a circuit board electrically connected to the semiconductor element, a heat dissipation member fixed to the first surface of the circuit board and thermally coupled to the semiconductor eleme... | 05/15/2007 |
| 7199458 | Stacked offset semiconductor package and method for fabricating In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first conductor electrically connects the exposed portion of the first sem... | 04/03/2007 |
| 7132752 | Semiconductor chip and semiconductor device including lamination of semiconductor chips To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side composing the main surface; a second side opposed to the first side; a mai... | 11/07/2006 |
| 7132753 | Stacked die assembly having semiconductor die overhanging support A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a second semiconductor die and at least one second support that are at... | 11/07/2006 |
| 6690089 | Semiconductor device having multi-chip package A semiconductor device includes a first semiconductor element provided with bonding electrodes at a predetermined pitch and lead frames provided on the first semiconductor element which work as electrical inputs/outputs. The semiconductor device further i... | 02/10/2004 |
| 6686651 | Multi-layer leadframe structure A leadframe and a package including the leadframe are disclosed. At least one lead includes a nonconductive layer on the inner end segment of the lead set back from its inner end. An electrically conductive layer is on a surface of the nonconductive layer... | 02/03/2004 |
| 6670707 | Integrated circuit chip An integrated circuit chip including a circuit board unit and a plurality of contact pads on a top surface of the unit. A die having a plurality of solder pads is positioned adjacent the circuit board unit with the solder pads wire-bonded to the contact p... | 12/30/2003 |
| 6559536 | Semiconductor device having a heat spreading plate A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a fi... | 05/06/2003 |
| 6534344 | Integrated circuit chip and method for fabricating the same In a method of fabricating an integrated circuit chip, a circuit board unit is formed with a bore, a plurality of contact pads, and a plurality of positioning notches that correspond to the contact pads. A die is attached to a bottom surface of the circui... | 03/18/2003 |
| 6482674 | Semiconductor package having metal foil die mounting plate A semiconductor package, and a method for fabricating the package are provided. The package includes a semiconductor die, a lead frame, and a metal foil die mounting plate adapted to mount the die to the lead frame. In addition, the die mounting plate pro... | 11/19/2002 |
| 6455778 | Micro-flex technology in semiconductor packages Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire ... | 09/24/2002 |
| 6453547 | Coupling spaced bond pads to a contact Two dice may be provided within a single package so that one pin and associated leadfinger may be coupled to bond pads on different dice. This may mean that two different bond pads on different dice are coupled, for example by wirebonding, to the same lea... | 09/24/2002 |
| 6444490 | Micro-flex technology in semiconductor packages Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire ... | 09/03/2002 |
| 6429514 | Integrated circuit chip and method for fabricating the same A method for fabricating an integrated circuit chip includes the steps of: (a) forming a circuit board unit with a die-receiving cavity, and a plurality of contact pads on a top surface of the circuit board unit; (b) forming a die having an upper surface provided w... | 08/06/2002 |
| 6429535 | Integrated circuit chip and method for fabricating the same A method for fabricating an integrated circuit chip includes the steps of: (a) forming a circuit board unit with a die-receiving cavity, and a plurality of contact pads on a top surface of the circuit board unit; (b) forming a die having an upper surface provided w... | 08/06/2002 |
| 6403402 | Semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 06/11/2002 |
| 6396132 | Semiconductor device with improved interconnections between the chip and the terminals, and process for its manufacture A chip of semiconductor material is fixed to a supporting area of a film of insulating material. Electrical interconnecting elements join metallized areas of the chip to the ends of metal strips which form the terminals of the device. To obtain devices wi... | 05/28/2002 |
| 6369441 | Method of producing a semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 04/09/2002 |
| 6351025 | Semiconductor chip having an underplate metal layer To enable readily forming the etching stop layer of a lead frame with multilayer structure by plating without using a large-scale device, enhance adhesive strength between the etching stop layer and an adjacent metal layer and prevent peeling caused by de... | 02/26/2002 |
| 6340839 | Hybrid integrated circuit A hybrid integrated circuit includes a metal lead frame, a wiring structure, an integrated circuit chip, and a lead. The wiring structure is comprised of a wiring layer formed on the upper surface of the lead frame through an insulating layer. The integra... | 01/22/2002 |
| 6333212 | Semiconductor device and manufacturing method thereof A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a t... | 12/25/2001 |
| 6313521 | Semiconductor device and method of manufacturing the same A semiconductor device having one or more semiconductor chips and chip components and a manufacturing method. In the semiconductor device, electrical short of the chip components and the like can be effectively avoided, and break away of the chip componen... | 11/06/2001 |
| 6313519 | Support for semiconductor bond wires A support structure is provided between, preferably approximately midway between, a semiconductor die and the inner ends of the lead fingers of a lead frame. Intermediate portions of bond wires connecting the die to the lead fingers are bonded, or tacked,... | 11/06/2001 |
| 6307256 | Semiconductor package with a stacked chip on a leadframe The present invention provides a leadframe package formed by flip chip on leadframe technique. The chips are face to face attached on both sides of the leadframe surface. Another embodiment according to the present invention is that the chips are back to ... | 10/23/2001 |
| 6300673 | Edge connectable metal package There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected t... | 10/09/2001 |
| 6300687 | Micro-flex technology in semiconductor packages Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire ... | 10/09/2001 |
| 6285075 | Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly An integrated circuit package includes a ceramic ring having an inside cavity for accommodating a semiconductor die. Conductive traces are provided on the ceramic ring so as to serve as power and ground signal busses. Power and ground connection pads on t... | 09/04/2001 |
| 6281578 | Multi-chip module package structure A multi-chip module (MCM) integrated circuit package structure is proposed, which can be used to pack a plurality of semiconductor chips of different functions while nonetheless allowing the overall package size to be as small as some existing types of in... | 08/28/2001 |
| 6271586 | Integrated circuit chip and method for fabricating the same A method for fabricating an integrated circuit chip includes the steps of: (a) forming a circuit board unit with a die-receiving cavity, and a plurality of contact pads on a top surface of the circuit board unit; (b) forming a die having an upper surface provided w... | 08/07/2001 |
| 6265760 | Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same In a semiconductor device, semiconductor chips are mounted on two surfaces of a die pad. A lower one of the semiconductor chips has a portion projecting outward from an upper one of the semiconductor chips. The semiconductor chips are connected to integra... | 07/24/2001 |
| 6255729 | Multi chip package (MCP) applicable to failure analysis mode An MCP has an MCP substrate, first and second semiconductor chips mounted on the MCP substrate, MCP leads connected to perimeter of the MCP substrate. MCP terminal wires disposed on the MCP substrate connect the MCP leads to the first semiconductor chip. ... | 07/03/2001 |
| 6215175 | Semiconductor package having metal foil die mounting plate A semiconductor package, and a method for fabricating the package are provided. The package includes a semiconductor die, a lead frame, and a metal foil die mounting plate adapted to mount the die to the lead frame. In addition, the die mounting plate pro... | 04/10/2001 |
| 6181005 | Semiconductor device wiring structure The semiconductor device has a plurality of bonding pads arranged along opposing longitudinal sides of a semiconductor integrated circuit, and the bonding pads are connected to a power supply interconnection layer and a ground interconnection layer which ... | 01/30/2001 |
| 6166443 | Semiconductor device with reduced thickness Internal electrodes and external lead wiring lines are formed on the front surface of a substrate of a semiconductor device, and solder bumps electrically connected to the external lead wiring lines via through holes are provided on the rear surface of th... | 12/26/2000 |
| 6166431 | Semiconductor device with a thickness of 1 MM or less A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a t... | 12/26/2000 |
| 6163076 | Stacked structure of semiconductor package A stacked structure of a semiconductor package mainly comprises a first chip, a second chip, a substrate and a lead frame. The first chip and the second chip are attached on the surface of the substrate by a plurality of solder bumps by means of flipchip ... | 12/19/2000 |
| 6153924 | Multilayered lead frame for semiconductor package A multi layered semiconductor lead frame, and a semiconductor package fabricated using the lead frame are provided. The lead frame includes a lead plate having multiple die mounting sites configured for molding multiple semiconductor packages. The lead pl... | 11/28/2000 |
