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| Number | Title | Issue Date |
| 7436053 | Optical device and method for fabricating the same An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an in... | 10/14/2008 |
| 7332803 | Circuit device A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to the first semiconductor element or the second semiconductor element vi... | 02/19/2008 |
| 6555897 | Assembly for attaching die to leads A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the ... | 04/29/2003 |
| 6472725 | Technique for attaching die to leads A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the ... | 10/29/2002 |
| 6310389 | Semiconductor package A method of manufacturing a semiconductor package including the steps of adhering inner leads to a semiconductor chip surface via an insulating adhesive, forming an insulating layer on the semiconductor chip and upper surfaces of the inner leads such that... | 10/30/2001 |
| 6307254 | Technique for attaching die to leads A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the ... | 10/23/2001 |
| 6232213 | Method of making a semiconductor chip package A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsul... | 05/15/2001 |
| 6111308 | Ground plane for plastic encapsulated integrated circuit die packages A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed ... | 08/29/2000 |
| 6008541 | Packaged integrated circuit device Disclosed herein is a packaged integrated circuit device having symmetrical structure to minimize package warpage and to prevent the formation of voids. The packaged integrated circuit device includes an integrated circuit chip having pads in the form of ... | 12/28/1999 |
| 5982026 | Inexpensive resin molded semiconductor device In a resin molded semiconductor device, a metal lead frame includes an island and leads, and the leads have bulged terminal portions. Also, a semiconductor chip is mounted on the island, and external terminals are adhered to the bulged terminal portions o... | 11/09/1999 |
| 5945729 | Technique for attaching die to leads A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the ... | 08/31/1999 |
| 5844315 | Low-profile microelectronic package A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding suppo... | 12/01/1998 |
| 5807767 | Technique for attaching die to leads A semiconductor assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semi... | 09/15/1998 |
| 5804871 | Lead on chip semiconductor device having bus bars and crossing leads Along the column of bonding pad (1), bidding terminal portions (2c), (3c), (4a), (5a) of bus bars (2), (3), and signal lines (4), (5) are arranged; principal wiring portions (2a), (3a) are made to extend in a 3-dimensional crossing configuration with resp... | 09/08/1998 |
| 5773322 | Molded encapsulated electronic component A molded encapsulated electronic component containing a silicon device, chip, or integrated circuit characterized by ease of fabrication and minimum possibility of breakage or dislocation, included a lead frame bearing a compressed, thin elastomeric, anis... | 06/30/1998 |
| 5760464 | Semiconductor device A semiconductor device has a semiconductor chip with a plurality of pads, an inner lead which is connected to a plurality of pads by a plurality of bonding wires and which has a broken part portion, and a bonding wire which electrically connects broken en... | 06/02/1998 |
| 5750421 | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semico... | 05/12/1998 |
| 5736428 | Process for manufacturing a semiconductor device having a stepped encapsulated package A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads o... | 04/07/1998 |
| 5677566 | Semiconductor chip package A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsul... | 10/14/1997 |
| 5594626 | Partially-molded, PCB chip carrier package for certain non-square die shapes A dambar-less leadframe is sandwiched between two printed circuit boards (PCBs). The PCBs form a major portion of the package body, and isolate the leadframe leads from plastic molding compound. In one embodiment, an upper PCB (substrate) is formed as a r... | 01/14/1997 |
| 5569955 | High density integrated circuit assembly combining leadframe leads with conductive traces An integrated circuit assembly is disclosed herein. The assembly includes a dielectric substrate defining a predetermined array of electrically conductive traces and an array of solder balls electrically connected to the traces. An integrated circuit chip... | 10/29/1996 |
| 5559369 | Ground plane for plastic encapsulated integrated circuit die packages A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed ... | 09/24/1996 |
| 5557150 | Overmolded semiconductor package A technique for providing partially and fully overmolded semiconductor packages is described which prevents delamination (detachment) of the molding compound from the substrate by allowing the molding compound to flow through holes in the substrate and fo... | 09/17/1996 |
| 5550401 | Lead on chip semiconductor device having bus bars and crossing leads Along the column of bonding pad (1), bonding terminal portions (2c), (3c), (4a), (5a) of bus bars (2), (3), and signal lines (4), (5) are arranged; principal wiring portions (2a), (3a) are made to extend in a 3-dimensional crossing configuration with resp... | 08/27/1996 |
| 5508556 | Leaded semiconductor device having accessible power supply pad terminals A semiconductor die (14) is mounted over a power supply surface (24, 52, 62). Signal bonding pads (18) on the die are wire bonded to corresponding leads (38) of a leadframe. Power supply bonding pads (20, 21) on the die are wire bonded to the power supply... | 04/16/1996 |
| 5475259 | Semiconductor device and carrier for carrying semiconductor device A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads a... | 12/12/1995 |
| 5451812 | Leadframe for semiconductor devices A leadframe for semiconductor devices is disclosed. The leadframe includes a die pad supported on the leadframe. A semiconductor chip is mounted on the die pad. The chip has a plurality of pads including at least one group of designated pads for communica... | 09/19/1995 |
| 5434750 | Partially-molded, PCB chip carrier package for certain non-square die shapes A dambar-less leadframe is sandwiched between two printed circuit boards (PCBs). The PCBs form a major portion of the package body, and isolate the leadframe leads from plastic molding compound. In one embodiment, an upper PCB (substrate) is formed as a r... | 07/18/1995 |
| 5430250 | Wire support and guide Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for rece... | 07/04/1995 |
| 5403776 | Process of using a jig to align and mount terminal conductors to a semiconductor plastic package A process of manufacturing semiconductor device accommodated in a package including a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to... | 04/04/1995 |
| 5376756 | Wire support and guide Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for rece... | 12/27/1994 |
| 5369220 | Wiring board having laminated wiring patterns A wiring board has a wiring circuit which is reliable and which can be easily miniaturized, and used for the production of a highly integrated, lighter, thinner, shorter, smaller and low-cost semiconductor device. This wiring board can be sealed in a plas... | 11/29/1994 |
| 5360992 | Two piece assembly for the selection of pinouts and bond options on a semiconductor device The invention comprises a semiconductor package which allows pinouts and bond options to be customized after the encasement of a die in plastic, ceramic, or other suitable materials. A first embodiment of the invention has a first assembly comprising an e... | 11/01/1994 |
| 5343074 | Semiconductor device having voltage distribution ring(s) and method for making the same A semiconductor device (10) includes a voltage distribution ring (20) attached to a plurality of leads (16). The ring is made up of an insulating layer (24), preferably polyimide, and a metal layer (22), preferably gold-plated copper foil. The ring may al... | 08/30/1994 |
| 5309021 | Semiconductor device having particular power distribution interconnection arrangement A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a pow... | 05/03/1994 |
| 5300459 | Method for reducing thermal stress in an encapsulated integrated circuit package A method wherein a circuit substrate device is provided having a semiconductor element and a circuit substrate between which a protective resin is placed. The protective resin has a smaller coefficient of linear expansion than that of the circuit substrat... | 04/05/1994 |
| 5293072 | Semiconductor device having spherical terminals attached to the lead frame embedded within the package body A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip an... | 03/08/1994 |
| 5281759 | Semiconductor package A semi-conductor package having an insulator formed by a supporting portion, a mounting portion and connecting members, and a layer of electrically conductive material on the insulator in a pattern forming a pad and inner leads connected to the pad by sup... | 01/25/1994 |
| 5262927 | Partially-molded, PCB chip carrier package A dambar-less leadframe is sandwiched between two printed circuit boards (PCBs). The PCBs form a major portion of the package body, and isolate the leadframe leads from plastic molding compound. In one embodiment, an upper PCB (substrate) is formed as a s... | 11/16/1993 |
| 5196725 | High pin count and multi-layer wiring lead frame A high pin count and multi-layer lead frame according to the present invention which has a short pitch, high density lead pattern and at the same time, enhanced transmission characteristics for high-frequency signals includes at least one pair of conducti... | 03/23/1993 |
