Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7372153 | Integrated circuit package bond pad having plurality of conductive members An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external circuitry and a second surface opposite the first surface. A plurality of co... | 05/13/2008 |
| 7314826 | Semiconductor device and method of fabricating the same A method of fabricating a semiconductor device includes forming a gate insulating film on an upper surface of a silicon substrate, forming a polycrystalline silicon film on the gate insulating film, and etching the polycrystalline silicon film, the gate insulating f... | 01/01/2008 |
| 7285862 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an element formation surface in the first resin film uncured in a state where... | 10/23/2007 |
| 7268423 | Flexible rewiring plate for semiconductor components, and process for producing it The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 μm, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connectio... | 09/11/2007 |
| 6981090 | Multiple use of microcontroller pad A circuit arrangement permits a microcontroller wirebond pad to be configured to be an analog or digital input or output. The circuit arrangement uses any of a plurality of switching configurations to selectively determine the use of the wirebond pad under control o... | 12/27/2005 |
| 5786633 | Semiconductor module having high insulating power and high thermal conductivity A semiconductor module having a high dissipated power has an electrically insulating and thermally conducting layer of crystalline carbon provided between a semiconductor chip and a heat elimination element, whereby the semiconductor chip, the insulating ... | 07/28/1998 |
| 5675122 | Sealable electronics packages Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between element... | 10/07/1997 |
| 5506452 | Power semiconductor component with pressure contact A power semiconductor component includes a semiconductor body having anode and cathode sides and a given thermal coefficient of expansion. Contact electrodes are each disposed on a respective one of the anode and cathode sides and are made of a metal havi... | 04/09/1996 |
| 5433260 | Sealable electronics packages and methods of producing and sealing such packages Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed bet... | 07/18/1995 |
| 4500904 | Semiconductor device A solder joint between a semiconductor substrate and an electrode is disclosed in which that principal surface of the semiconductor substrate where an n-type semiconductor layer is exposed is bonded to the electrode with brazing solder, and the brazing so... | 02/19/1985 |
| 4470063 | Copper matrix electrode having carbon fibers therein A semiconductor device includes a semiconductor substrate having electrodes brazed thereto. The electrode is made of a Cu-C composite material in which carbon fibers are embedded in copper matrix. The carbon fibers are so disposed as to be in a ring-like ... | 09/04/1984 |
| 4403242 | Semiconductor device having a metal-fiber composite material electrode A semiconductor device using a metal-fiber composite material as an electrode is disclosed. A semiconductor substrate may be a thyristor substrate of a center gate structure and a cathode electrode comprises a lower piece made of copper matrix-carbon fibe... | 09/06/1983 |
| 4254548 | Method of fabricating electrode plate for supporting semiconductor device A bundle of carbon fibers each coated with copper or copper alloy is uniformly wound around a core rod under tension, and subjected to a hot press treatment in a non-oxidizing atmosphere. The core rod is then cut off along the surface of a plate formed by... | 03/10/1981 |
| 4226917 | Composite joint system including composite structure of carbon fibers embedded in copper matrix A composite joint system is disclosed in which a composite structure containing carbon fibers embedded in a copper matrix in any configuration, e.g. in one direction, in random directions, in mesh form, spirally or radially is joined to another structure ... | 10/07/1980 |
| 4213801 | Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers Thin layers of polycrystalline n-type GaAs have been deposited on a conducting substrate such as graphite. These contacted GaAs layers exhibit desirable properties for device applications, i.e., adequate cohesion between the GaAs and the substrate, good e... | 07/22/1980 |
| 4196442 | Semiconductor device A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an e... | 04/01/1980 |
