Class 257/E23.027 - Having heterogeneous or anisotropic structure (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E26.026. This subclass
No. of patents: 33
Last issue date: 09/04/2007

Number	Title	Issue Date
7265449	Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package A liquid crystal display device includes a liquid crystal panel including a pad electrode, a tape circuit substrate and an anisotropic conductive film. The pad electrode receives one of a driving signal and a power supply voltage signal. The tape circuit substrate i...	09/04/2007
7245015	Display apparatus In a display apparatus, a display panel receives a driving signal from a driving chip through a pad and displays an image in response to the driving signal. The driving chip includes a terminal outputting the driving signal. The driving chip is mounted on the displa...	07/17/2007
7183191	Method for fabricating a chip scale package using wafer level processing Channels are formed that pass through an active surface of a semiconductor substrate to provide isolation between adjacent active surface regions defining individual die locations. Bond pads on the substrate are bumped with intermediate conductive elements, after wh...	02/27/2007
6653725	Chip package and method of manufacturing the same A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first substrate arranged on the first surface o...	11/25/2003
5990548	Plate type member for semiconductor device package and package A plate type member of a Cu--W and/or Mo alloy can be bonded to a ceramic member or the like to form a semiconductor device package without problems, because the degree of warping of the plate type member during a heating step in its fabrication is suppre...	11/23/1999
5975922	Device containing directionally conductive composite medium A device having a composite interconnection medium that reduces or avoids long-term reliability problems exhibited by current media, containing a first component and a second component, e.g., circuit boards, and an intermediate area between the first comp...	11/02/1999
5932339	Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particles The present invention relates to an anisotropically electricity-conductive film obtainable by dispersing in an adhesive agent electrically conductive particles, the adhesive agent being a curable adhesive agent comprising as a major component at least one...	08/03/1999
5914156	Method for coating a carbonaceous material with a molybdenum carbide coating A carbonaceous material coated with a molybdenum carbide coating, the molybdenum carbide coating protecting the carbonaceous material against attack by molten metal while simultaneously providing a wetting action for the molten metal to infiltrate the car...	06/22/1999
5905938	Method of manufacturing a semiconductor substrate material A material for a semiconductor substrate is composed substantially of tungsten and/or molybdenum mixed with 5-30 wt. % copper, 0.002-0.07 wt. % phosphorus, and 0.1-0.5 wt. % one or two materials selected from among cobalt, nickel, and iron. The material i...	05/18/1999
5879530	Anisotropic conductive film for microconnections This self-supported, anisotropic conductive film has a partly annealed polymer layer (46) containing through holes, nail-shaped conductive elements (51) filling the through holes, having a central portion and ends, and the central portion of the nails is ...	03/09/1999
5854093	Direct attachment of silicon chip to circuit carrier The present invention features a method and an article of manufacture for directly attaching silicon chips to circuit carriers. Both the method and the article of manufacture feature a dissolvable, thin wafer that is soldered first to the chip and then to...	12/29/1998
5834115	Metal and carbonaceous materials composites A composite of a metal infiltrated into a carbonaceous material. The carbonaceous material is coated with a molybdenum carbide coating, the molybdenum carbide coating protecting the carbonaceous material against attack by molten metal while simultaneously...	11/10/1998
5807766	Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process The present invention features a method and an article of manufacture for directly attaching silicon chips to circuit carriers. Both the method and the article of manufacture feature a dissolvable, thin wafer that is soldered first to the chip and then to...	09/15/1998
5681647	Anisotropic conductive film for microconnections This self-supported, anisotropic conductive film has a partly annealed polymer layer (46) containing through holes, nail-shaped conductive elements (51) filling said through holes, having a central portion and ends, and the central portion of the nails is...	10/28/1997
5675122	Sealable electronics packages Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between element...	10/07/1997
5506452	Power semiconductor component with pressure contact A power semiconductor component includes a semiconductor body having anode and cathode sides and a given thermal coefficient of expansion. Contact electrodes are each disposed on a respective one of the anode and cathode sides and are made of a metal havi...	04/09/1996
5437921	Electronic components mounting base material A base material for mounting electronic components is provided which has a low density and a coefficient of thermal expansion close to that of aluminum and can be processed with ease. The base material essentially consists of aluminum or an aluminum alloy...	08/01/1995
5433260	Sealable electronics packages and methods of producing and sealing such packages Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed bet...	07/18/1995
5376825	Integrated circuit package for flexible computer system alternative architectures A single-packaged central processing unit (CPU) is formed on a substrate for a particular application in a variable word length computer system that includes a program memory. A first semiconductor chip in the CPU is of a general purpose type and includes...	12/27/1994
5155302	Electronic device interconnection techniques External connections are made in an electronic device (11) having on an upper surface an array of contact pads (12) by providing successively over the electronic device a first anisotropic member (13), a first flat insulator member (14) having on an upper...	10/13/1992
5100740	Direct bonded symmetric-metallic-laminate/substrate structures A composite structure comprising a symmetric bimetallic laminate bonded to a separate substrate is provided by eutectic bonding the bimetallic laminate to the substrate. A variety of beneficial structures can be provided....	03/31/1992
5089439	Process for attaching large area silicon-backed chips to gold-coated surfaces A method for eutectically attaching a silicon chip to a gold-coated substrate. Prior to heating and scrubbing of the silicon chip against the gold surface, a gold lattice structure is placed between the silicon chip bottom surface and the gold surface. Th...	02/18/1992
5033970	Self-mounted chip carrier A self-mounted chip carrier having a surface which contains the integrated circuit. This surface has a contact pad metallized area for contacting the integrated circuit. The self-mounted chip carrier is secured to a mating surface and aligned so that the ...	07/23/1991
4820376	Fabrication of CPI layers Disclosed is a method of fabricating conductive polymer interconnect (CPI) material which employs chains of electrically conductive particles within an elastomeric matrix. Contact resistance is improved by removing a thin layer is elastomeric material whi...	04/11/1989
4650107	Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate A large-area semiconductor component (1) is joined without bubbles by means of soldering to a substrate (2) by placing a perforated metallic intermediate layer (5) between the solder (3) before the soldering and the substrate (2) and the assembly is broug...	03/17/1987
4574299	Thyristor packaging system A thyristor packaging system utilizes structured metal, strain buffers to provide paths of high electrical and thermal conductivity from the anode and cathode of a thyristor to power conductors connected to the anode and the cathode, such strain buffers e...	03/04/1986
4482912	Stacked structure having matrix-fibered composite layers and a metal layer Herein disclosed is a stacked or laminated structure which is rigidly integrated by sandwiching a metal layer between a first matrix-fiber composite layer prepared to have as a whole a thermal expansion coefficient and a second matrix-fiber layer prepared...	11/13/1984
4427993	Thermal stress relieving bimetallic plate A thermal matching element which exhibits high electrical conductivity and high thermal conductivity is used to join a heat generating semiconductor device with a heat transmissive electrically conductive members. The thermal matching element is independe...	01/24/1984
4401728	Composite material Composite material comprising a matrix of an alloy of about 64 percent by weight iron and about 36 percent by weight nickel or of a different alloy containing iron and nickel having a coefficient of thermal expansion of at the most 3.10-6 K	08/30/1983
4385310	Structured copper strain buffer A structured copper strain buffer, which is thermally and electrically conductive is provided for use with semiconductor electronic devices. A thermo-compression diffusion bond is used to attach a metallic foil to a structured copper disk to form the stra...	05/24/1983
4315591	Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer A method is provided for thermo-compression diffusion bonding respective structured copper strain buffers directly to each of the two major opposed surfaces of a substrateless semiconductor device wafer having a beveled outer edge surface. A selected port...	02/16/1982
4290080	Method of making a strain buffer for a semiconductor device A thermally and electrically conductive strain buffer for a semiconductor device is made by a method that comprises the steps of (a) providing a plurality of straight, equal-length strands of copper, with the strands aligned such that their lengths are su...	09/15/1981
3969754	Semiconductor device having supporting electrode composite structure of metal containing fibers A semiconductor device comprising a semiconductor substrate and a supporting electrode disposed at least on one surface of the semiconductor substrate, in which the supporting electrode has such a composite structure that fibers having a coefficient of th...	07/13/1976

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Class 257/E23.027 - Having heterogeneous or anisotropic structure (EPO)