Bizarre Patents
A helium-filled sun shade for protecting individuals engaged in outdoor activities.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7414319 | Semiconductor chip assembly with metal containment wall and solder terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pa... | 08/19/2008 |
| 7411297 | Microfeature devices and methods for manufacturing microfeature devices Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated circuit, a surface, and a plurality of interconnect elements projecting... | 08/12/2008 |
| 7388293 | Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided around the foregoing interposer portion integrally therewith. On bot... | 06/17/2008 |
| 7298039 | Electronic circuit device In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a modu... | 11/20/2007 |
| 7298049 | Submount for mounting semiconductor device A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submount 3 comprises (a) a substrate 4; and (b) a solder layer 8 formed on the top surface 4 | 11/20/2007 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7170183 | Wafer level stacked package Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically con... | 01/30/2007 |
| 6696321 | High performance multi-chip flip chip package A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of multiple dies is facilitated by providing electrically isolat... | 02/24/2004 |
| 6627991 | High performance multi-chip flip package A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of multiple dies is facilitated by providing electrically isolat... | 09/30/2003 |
| 6593527 | Integrated circuit assembly with bar bond attachment An integrated circuit assembly 10 is provided, including a substrate 14 having at least one substrate contact surface 18, an integrated circuit device 12 having at least one first contact surface 16, and a bar bond element 22. The bar bond element 22 prov... | 07/15/2003 |
| 6489678 | High performance multi-chip flip chip package A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of multiple dies is facilitated by providing electrically isolat... | 12/03/2002 |
| 6462413 | LDMOS transistor heatsink package assembly and manufacturing method A heatsink assembly and method of fabrication and use for high power RF LDMOS transistors such as those used in mobile telephone basestation pre-antenna amplifiers wherein die attachment to the heatsink flange occurs prior to leadframe/spacer-to-flange bo... | 10/08/2002 |
| 6294403 | High performance flip chip package An improved semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. A silicon die is attached to a carrier (or substrate) that has a cavity substantially surrounding the die. Direct connection ... | 09/25/2001 |
| 6254423 | Power diode terminal holder mounting arrangement A power diode terminal holder mounting arrangement includes a copper plate connected between two chips on a heat sink above a ceramic plate, and a terminal holder soldered to the copper plate, the copper plate having a circular hole through a flat base th... | 07/03/2001 |
| 6133634 | High performance flip chip package An improved semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. A silicon die is attached to a carrier (or substrate) that has a cavity substantially surrounding the die. Direct connection ... | 10/17/2000 |
| 5736786 | Power module with silicon dice oriented for improved reliability A power module has a metallic base plate layer and a substrate layer that has a first metallic layer, a dielectric layer, and a second metallic layer. A solder layer thermally and electrically connects the second metallic layer to the base plate. A plural... | 04/07/1998 |
| 5639990 | Solid printed substrate and electronic circuit package using the same The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic... | 06/17/1997 |
| 5424579 | Semiconductor device having low floating inductance A first composite substrate including an insulating substrate, a copper pattern, and a copper layer on opposite surfaces is mounted on a metal base plate. A second composite substrate and semiconductor chips are mounted on the first composite substrate an... | 06/13/1995 |
| 5153449 | Heatsink bus for electronic switch An electronic circuit device includes a metallic member composed of a thermally and electrically conductive material and comprising a unitary mass defining a heatsink and being free of mechanical or electrical transition joints. Electronic switching devic... | 10/06/1992 |
| 5150197 | Die attach structure and method Die attach structure and method in which the joint between a die and a substrate is formed in a manner which provides a uniform temperature distribution in the die and reduces stress in the joint near the edge of the die. In some embodiments, the substrat... | 09/22/1992 |
| 5138428 | Connection of a semiconductor component to a metal carrier A reliable connection of a semiconductor component to a metal carrier is provided which avoids damage during bonding. A buffer material is applied between the semiconductor component and the metal carrier. Means are provided for fixing the buffer material... | 08/11/1992 |
| 5100809 | Method of manufacturing semiconductor device A silicon substrate (20) having a pnpn structure is soldered to a metal plate (10). A silicon oxide film (16) is naturally formed on the side surface of the silicon substrate during a process of removing defective part of the side surface, and a metal com... | 03/31/1992 |
| 5089876 | Semiconductor IC device containing a conductive plate A semiconductor IC device includes a semiconductor pellet, an insulating film, a conductive plate, and a lead frame. A plurality of electrodes and a plurality of active elements are formed on the semiconductor pellet. The insulating film is bonded to a su... | 02/18/1992 |
| 5016083 | Submount for semiconductor laser device A semiconductor laser device submount disposed between a semiconductor laser chip and a metal block for securing them together includes a metallization structure on each of two opposing surfaces of an Sb-doped submount body. The metallization includes a f... | 05/14/1991 |
| 4987476 | Brazed glass pre-passivated chip rectifier A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high te... | 01/22/1991 |
| 4950843 | Mounting structure for semiconductor device A mounting structure for a semiconductor device which is mounted onto a metallic wiring layer formed on a surface portion of a metal printed circuit board, in which bonding portions defined by substantially square etched holes are formed in a portion of t... | 08/21/1990 |
| 4942139 | Method of fabricating a brazed glass pre-passivated chip rectifier A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high te... | 07/17/1990 |
| 4881118 | Semiconductor device One surface of a cathode sliding compensator is finished as an irregular surface while another surface thereof is finished as a sliding surface. The irregular surface is arranged to contact with a cathode electrode layer of a semiconductor element while t... | 11/14/1989 |
| 4748483 | Mechanical pressure Schottky contact array A Scottky diode arrangement comprises a metallically conducting plate and a semiconductive plate, one or both of which are provided with at least three raised portions which form electrically parallel Schottky contacts between the plates.... | 05/31/1988 |
| 4700879 | Method for manufacturing semiconductor power modules with an insulated contruction A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a f... | 10/20/1987 |
| 4500907 | Pressure-applied type semiconductor device A pressure-applied type semiconductor device, in which a metal stamp for urging a semiconductor body is formed with a peripheral annular groove. When pressure is applied, the groove is elastically deformed. Thus, stress concentration in the semiconductor ... | 02/19/1985 |
| 4493143 | Method for making a semiconductor device by using capillary action to transport solder between different layers to be soldered A semiconductor member is attached to a base by placing a wafer of solder material on the base, placing a carrier member having a through capillary hole on the solder wafer, placing the semiconductor member on the carrier member and heating the arrangemen... | 01/15/1985 |
| 4477826 | Arrangement for aligning and attaching a shim to a semiconductor element A contact shim for insertion between an electrode internal contact member and a contact surface of a semiconductor element in a semiconductor device assembly. The shim has a generally continuous body (2) provided with a number of apertures (4, 5, 6, 7) ha... | 10/16/1984 |
| 4358785 | Compression type semiconductor device A compression type semiconductor device includes a semiconductor element; at least one metal plate having substantially upright edge surfaces, a planar contacting surface engaging a first surface of the semiconductor element and a continuous curved surfac... | 11/09/1982 |
| 4326215 | Encapsulated semiconductor device with a metallic base plate A semiconductor device comprising a metallic base plate whose side surfaces are formed with cut-away portions having circular arc-shaped parts, a semiconductor element which is connected to the surface of the metallic base plate, and a resin which lies in... | 04/20/1982 |
| 4303935 | Semiconductor apparatus with electrically insulated heat sink A semiconductor element, either a diode or a controlled rectifier, is electrically insulated relative to the heat sink on which it is mounted by either an insulating layer or an insulating diode of high thermal conductivity. A single unit including the he... | 12/01/1981 |
| 4285003 | Lower cost semiconductor package with good thermal properties An improved mounting base is disclosed in which a semiconductor die is mounted on a thin pedestal within a large counter bore in the mounting base or header of the transistor package.... | 08/18/1981 |
| 4282555 | Overvoltage protection means for protecting low power semiconductor components An overvoltage protection device is employed to protect the low power semiconductor components of a circuit against overvoltages applied at the connection leads of the circuit. The device has at least two branches that are each connected between a common ... | 08/04/1981 |
| 4224734 | Low electrical and thermal impedance semiconductor component and method of manufacture A semiconductor component and a method for manufacturing the semiconductor component with low electrical and thermal impedances is provided. The semiconductor component includes a thin semiconductor device with a plurality of layers of various conductivit... | 09/30/1980 |
| 4209799 | Semiconductor mounting producing efficient heat dissipation In order to efficiently dissipate heat from both sides of a semiconductor vice to an associated cooling element, the device is contacted at its two load current conducting sides by conductive contacting elements and the contacting elements are both firmly... | 06/24/1980 |
