Class 257/E23.024 - Wire-like arrangements or pins or rods (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E23.023. This subclass
No. of patents: 127
Last issue date: 10/14/2008

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Number	Title	Issue Date
7436074	Chip package without core and stacked chip package structure thereof A chip package without a core, including a patterned circuit layer, a chip, a solder mask, a molding compound and multiple outer terminals, is provided. The patterned circuit layer has a first surface and a second surface opposite to each other. The chip disposed on...	10/14/2008
7420286	Reduced inductance in ball grid array packages Techniques are described for reducing inductance in ball grid array (BGA) packages for integrated circuits (ICs). The BGA package comprises a set of contacts disposed near an outer edge of the BGA package that receives signal lines and isolated power and ground line...	09/02/2008
7335977	Semiconductor chip mounting arrangement Disclosed is a device which comprises a substrate, a plurality of signal output terminal electrodes provided on the substrate, a plurality of signal input terminal electrodes provided on the substrate, and a display driver IC having input terminals thereof connected...	02/26/2008
7326594	Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw...	02/05/2008
7309916	Semiconductor package and method for its manufacture A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one or more decoupling capacitors. The semiconductor chip is in direct c...	12/18/2007
7309648	Low profile, chip-scale package and method of fabrication Disclosed is a semiconductor device that includes an electrically insulating, sheet-like substrate with first and second surfaces, at least one opening, and a certain thickness. On the first surface are a plurality of electrically conductive routing strips and a plu...	12/18/2007
7268438	Semiconductor element including a wet prevention film A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc...	09/11/2007
7262124	Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wir...	08/28/2007
7253505	IC substrate with over voltage protection function The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is ...	08/07/2007
7250686	Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded A semiconductor device of the present invention comprises a first semiconductor chip that includes a first internal circuit and at least one first conductive pad which is provided on its upper surface and is not connected to the first internal circuit, a second semi...	07/31/2007
7239024	Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d...	07/03/2007
7227240	Semiconductor device with wire bond inductor and method A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L...	06/05/2007
7217995	Apparatus for stacking electrical components using insulated and interconnecting via An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections be...	05/15/2007
7211888	Encapsulation of pin solder for maintaining accuracy in pin position Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. ...	05/01/2007
7205673	Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing A bond pad structure which includes an aluminum bond pad which include one or more dopants that effectively control the growth of IMC to a nominal level in spite of high tensile stresses in the wafer. For example, aluminum can be doped with 1–2 atomic % of Mg. Alt...	04/17/2007
7199477	Multi-tiered lead package for an integrated circuit A package for a semiconductor die comprises a semiconductor die with a bond pad. The package further includes a package lead and a bond wire with a first end portion coupled to the package lead, a second end portion coupled to the bond pad, and an intermediate porti...	04/03/2007
7157790	Single die stitch bonding An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least ...	01/02/2007
7109586	System for reducing or eliminating semiconductor device wire sweep Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across on...	09/19/2006
7071090	Semiconductor element having protruded bump electrodes A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ba...	07/04/2006
6685817	Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ...	02/03/2004
6674177	Apparatus for implementing selected functionality on an integrated circuit device A semiconductor device in a computer system is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon at least some of which are connected to the integrated circuitry and hav...	01/06/2004
6669489	Interposer, socket and assembly for socketing an electronic component and method of making and using same Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, an...	12/30/2003
6655023	Method and apparatus for burning-in semiconductor devices in wafer form Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connect...	12/02/2003
6649441	Method for fabricating a microcontact spring on a substrate The invention relates to a method for fabricating a microcontact spring on a substrate (1) with at least one contact pad (2) and a first insulator layer (13) with a window above the contact pad (2). In order to enable the cost-effective contact-connection or w...	11/18/2003
6635560	Method for implementing selected functionality on an integrated circuit device A semiconductor device in a computer system is described that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon at least some of which are connected to the integrated circuitry and hav...	10/21/2003
6627822	Electronic assembly with separate power and signal connections A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate and the second substrate and a multiplicity of signal conne...	09/30/2003
6624648	Probe card assembly A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of t...	09/23/2003
6617692	Apparatus for implementing selected functionality on an integrated circuit device A semiconductor device in a computer system is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon connected to the integrated circuitry. At least one electrically conduct...	09/09/2003
6615485	Probe card assembly and kit, and methods of making same A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereo...	09/09/2003
6569758	Sub-milliohm on-chip interconnection A method to form a very low resistivity interconnection in the manufacture of an integrated circuit device is achieved. A bottom conductive layer is formed overlying a substrate. The bottom conductive layer creates a first electrical coupling of a first l...	05/27/2003
6528769	Connection of a junction to an electrical conductor track on a plate A connection of an electrical terminal 13 to a conductor track 5 applied to a glass or glass ceramic plate 1 is to be resistant to temperature change and traction and conductive. For this purpose an electrically conductive connecting element 11 is ultraso...	03/04/2003
6483328	Probe card for probing wafers with raised contact elements A probe card is provided for contacting an electric componet with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to ha...	11/19/2002
6476503	Semiconductor device having columnar electrode and method of manufacturing same A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bond...	11/05/2002
6476333	Raised contact structures (solder columns) An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate membe...	11/05/2002
6474532	Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The...	11/05/2002
6472764	Method and apparatus for implementing selected functionality on an integrated circuit device A semiconductor device is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon at least some of which are connected to the integrated circuitry and having at least one elec...	10/29/2002
6454153	Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The...	09/24/2002
6351040	Method and apparatus for implementing selected functionality on an integrated circuit device A semiconductor device is disclosed that includes a die having an active surface bearing integrated circuitry, the die includes a plurality of bond pads thereon connected to the integrated circuitry. At least one electrically conductive wire bond is made ...	02/26/2002
6348400	Method and apparatus for implementing selected functionality on an integrated circuit device A semiconductor device is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon connected to the integrated circuitry. At least one electrically conductive wire bond is made...	02/19/2002
6336269	Method of fabricating an interconnection element Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred conta...	01/08/2002

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Class 257/E23.024 - Wire-like arrangements or pins or rods (EPO)