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| Number | Title | Issue Date |
| 7443041 | Packaging of a microchip device A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are... | 10/28/2008 |
| 7432585 | Semiconductor device electronic component, circuit board, and electronic device A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a co... | 10/07/2008 |
| 7432129 | Bonding apparatus and method of bonding for a semiconductor chip A method of bonding and a bonding apparatus for a semiconductor chip that apply ultrasonic vibration to the semiconductor chip to bond the semiconductor chip to a substrate carry out leveling effectively at low cost and in a short time and can improve the bonding be... | 10/07/2008 |
| 7423336 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor devic... | 09/09/2008 |
| 7417324 | Semiconductor device and method for manufacturing the same A semiconductor device is composed of a semiconductor chip, aluminum pads formed on the semiconductor chip, alloy ball bumps, which are formed on the aluminum pads, containing gold and Pd, and gold wires, which are connected to the alloy ball bumps, having a surface... | 08/26/2008 |
| 7411296 | Method, system, and apparatus for gravity assisted chip attachment A method, system, and apparatus, the apparatus including a metal layer on silicon, photo-resist material disposed on the metal layer, a bump pad reservoir adjacent to the metal layer, a quantity of interconnect metal disposed in the bump pad reservoir, and a resist ... | 08/12/2008 |
| 7407877 | Self-coplanarity bumping shape for flip-chip A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the... | 08/05/2008 |
| 7407878 | Method of providing solder bumps on a substrate using localized heating A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate. The method includes: providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern; providing solder portions onto respective o... | 08/05/2008 |
| 7400041 | Compliant multi-composition interconnects A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein. ... | 07/15/2008 |
| 7399694 | Semiconductor device and a manufacturing method of the same By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing meth... | 07/15/2008 |
| 7397117 | Chip package with die and substrate A thin film semiconductor die circuit package is provided utilizing low dielectric constant (k) polymer material for the insulating layers of the metal interconnect structure. Five embodiments include utilizing glass, glass-metal composite, and glass/glass sandwiche... | 07/08/2008 |
| 7397121 | Semiconductor chip with post-passivation scheme formed over passivation layer The invention provides a semiconductor chip comprising an interconnecting structure over said passivation layer. The interconnecting structure comprises a first contact pad connected to a second contact pad exposed by an opening in a passivation layer. A metal bump ... | 07/08/2008 |
| 7393719 | Increased stand-off height integrated circuit assemblies, systems, and methods Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by aligning a die with a substrate and interposing solder between corres... | 07/01/2008 |
| 7390732 | Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and a method of fabrication thereof, characterized in that pyramidal bump... | 06/24/2008 |
| 7391110 | Apparatus for providing capacitive decoupling between on-die power and ground conductors One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the semiconductor die is attached. In this embodiment, a surface of a sem... | 06/24/2008 |
| 7391112 | Capping copper bumps A structure including a substrate, a copper bump formed over the substrate, and a barrier layer comprising an alloy of at least one of iron and nickel, formed over the copper bump, and methods to make such a structure. ... | 06/24/2008 |
| 7391106 | Stack type package A stack type semiconductor package uses rigid, C-shaped guide substrates that hold semiconductor packages stacked in place and which also provide signal pathways between the stacked semiconductors and contact surfaces of the package. The C-shaped guide eliminate sho... | 06/24/2008 |
| 7387910 | Method of bonding solder pads of flip-chip package Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation is executed between a chip and a PCB, between chips, or between PCBs.... | 06/17/2008 |
| 7385288 | Electronic packaging using conductive interproser connector Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together... | 06/10/2008 |
| 7382049 | Chip package and bump connecting structure thereof A chip package includes a chip, a carrier, and at least a bump connecting structure for connecting the chip to the carrier. The bump connecting structure includes a first metal bump disposed on a chip pad of the chip and has a first height relative to a passivation ... | 06/03/2008 |
| 7378734 | Stacked contact bump A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights... | 05/27/2008 |
| 7375428 | Flip-chip bonding structure using multi chip module-deposited substrate Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined position of the silicon substrate, wherein a material of the Si-bump is t... | 05/20/2008 |
| 7375431 | Solder bump formation in electronics packaging A polymer stencil is applied to the active surface of a wafer. The stencil has openings that at least partially overlay associated metallization pads on the wafer and divider strips positioned between adjacent openings. The divider strips are arranged to overlay por... | 05/20/2008 |
| 7375429 | Integrated circuit component and mounting method thereof Disclosed are an integrated circuit component capable of simply mounting at low cost a chip part which adjusts impedance of wiring patterns as well as capable of effectively reducing switching noise from an integrated circuit, and a method for mounting the chip part... | 05/20/2008 |
| 7375433 | Semiconductor device packaging substrate and semiconductor device packaging structure A packaging substrate for a semiconductor device includes: a solder resist on a surface of the packaging substrate, the solder resist having a first opening portion for mounting the semiconductor device; and a speed adjusting opening portion for adjusting a flow spe... | 05/20/2008 |
| 7375434 | Semiconductor chip with flexible contacts at a face The present invention relates to a semiconductor chip comprising a semiconductor element, at least a conducting line and a contact area being arranged on the semiconductor element, the conducting line being connected with the contact area, the contact area being dis... | 05/20/2008 |
| 7368817 | Bump-on-lead flip chip interconnection A flip chip interconnect is made by mating the interconnect bump directly onto a lead, rather than onto a capture pad. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having electricall... | 05/06/2008 |
| 7368374 | Super high density module with integrated wafer level packages A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packa... | 05/06/2008 |
| 7368821 | BGA semiconductor chip package and mounting structure thereof In example embodiments of the present invention, a structure of a BGA semiconductor chip package includes a substrate having first and second surfaces, a semiconductor chip having a plurality of bonding pads, and mounted on the first surface of the substrate, and pl... | 05/06/2008 |
| 7364943 | Method of bonding a microelectronic die to a substrate and arrangement to carry out method A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a die, a substrate, pre-connection bumps and an underfill material, the... | 04/29/2008 |
| 7364998 | Method for forming high reliability bump structure Methods for forming a bump on a semiconductor substrate, the substrate having a contact pad thereon, is provided. In one embodiment, the method comprises depositing a passivation layer over the substrate and the contact pad. The passivation layer is patterned and et... | 04/29/2008 |
| 7361993 | Terminal pad structures and methods of fabricating same Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The method... | 04/22/2008 |
| 7361996 | Semiconductor device having tin-based solder layer and method for manufacturing the same A semiconductor device includes: a semiconductor substrate; a base member; a tin-based solder layer; a first metal layer; and a first alloy layer. The semiconductor substrate is bonded to the base member through the first metal layer, the first alloy layer and the t... | 04/22/2008 |
| 7358618 | Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s... | 04/15/2008 |
| 7358608 | Semiconductor device having chip size package with improved strength The present invention provides a semiconductor device wherein a passivation film, an insulating film and an encapsulating layer are formed, in this order, on the surface of a semiconductor substrate, which is provided with a electrode pad thereon, and a leading end ... | 04/15/2008 |
| 7355280 | Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is form... | 04/08/2008 |
| 7355285 | Structure of mounting electronic component The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic ... | 04/08/2008 |
| 7351649 | Recording head unit and method of producing the same A method of producing a recording head unit including: (A) a recording head including: a plurality of recording elements; and an actuator unit including a plurality of individual electrodes which respectively correspond to the recording elements; and (B) a printed w... | 04/01/2008 |
| 7352054 | Semiconductor device having conducting portion of upper and lower conductive layers A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a semiconductor substrate and a plurality of external connecting electrod... | 04/01/2008 |
| 7348664 | Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress... | 03/25/2008 |
