Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 7443039 | System for different bond pads in an integrated circuit package An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A prot... | 10/28/2008 |
| 7432536 | LED with self aligned bond pad A method is disclosed for attaching a bonding pad to the ohmic contact of a diode while reducing the complexity of the photolithography steps. The method includes the steps of forming a blanket passivation layer over the epitaxial layers and ohmic contacts of a diod... | 10/07/2008 |
| 7429797 | Electronic device and carrier substrate Consistent with an example embodiment, an electronic device comprises a semiconductor device, particularly an integrated circuit, and a carrier substrate with conductive layers on the first side and the second side, and voltage supply and ground connections mutually... | 09/30/2008 |
| 7425767 | Chip structure with redistribution traces A semiconductor chip or wafer comprises a passivation layer and a circuit line. The passivation layer comprises an inorganic layer. The circuit line is over and in touch with the inorganic layer of the passivation layer, wherein the circuit line comprises a first co... | 09/16/2008 |
| 7420283 | Integration type semiconductor device and method for manufacturing the same A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact hole; a plurality of collecting electrodes connecting in parallel with... | 09/02/2008 |
| 7417324 | Semiconductor device and method for manufacturing the same A semiconductor device is composed of a semiconductor chip, aluminum pads formed on the semiconductor chip, alloy ball bumps, which are formed on the aluminum pads, containing gold and Pd, and gold wires, which are connected to the alloy ball bumps, having a surface... | 08/26/2008 |
| 7417326 | Semiconductor device and manufacturing method of the same A semiconductor device includes a plurality of electrode layers provided at designated positions of a semiconductor substrate, an organic insulation film formed on the semiconductor substrate by selectively exposing designated areas of the electrode layers, and proj... | 08/26/2008 |
| 7414317 | BGA package with concave shaped bonding pads In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a per... | 08/19/2008 |
| 7397125 | Semiconductor device with bonding pad support structure A semiconductor device having bonding pads on a semiconductor substrate includes: an upper copper layer that is formed on the lower surface of the bonding pads with a barrier metal interposed and that has a copper area ratio that is greater than layers in which circ... | 07/08/2008 |
| 7397134 | Semiconductor device mounted on and electrically connected to circuit board The invention provides a package type semiconductor device and a manufacturing method thereof where reliability is improved without increasing a manufacturing cost. A resin layer and a supporting member are formed on a top surface of a semiconductor substrate formed... | 07/08/2008 |
| 7397127 | Bonding and probing pad structures A pad structure includes a first metal-containing layer formed over a substrate. A first passivation layer is formed over the first metal-containing layer. The first passivation layer has a first opening partially exposing the first metal-containing layer. A pad lay... | 07/08/2008 |
| 7394159 | Delamination reduction between vias and conductive pads Vias and conductive pads configured and coupled in a manner to reduce delamination are described herein. The via and the conductive pads may be located in a substrate such as a carrier substrate, a die, or a printed circuit board. ... | 07/01/2008 |
| 7394164 | Semiconductor device having bumps in a same row for staggered probing A semiconductor device has a plurality of bumps in a same row for staggered probing. The bumps in a same row are disposed on a chip and include a plurality of regular bumps and a plurality of irregular bumps. The regular bumps and the irregular bumps are intersperse... | 07/01/2008 |
| 7391100 | Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die... | 06/24/2008 |
| 7391120 | Increasing the adhesion of an adhesive connection in housings A housing having a non-detachable bond to a micromechanical component using a flexible bonding material in particular. The combination including the housing and the micromechanical component as well as the manufacturing method of this combination. At least part of t... | 06/24/2008 |
| 7382059 | Semiconductor package structure and method of manufacture In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating ma... | 06/03/2008 |
| 7371687 | Electronic circuit device An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a... | 05/13/2008 |
| 7372153 | Integrated circuit package bond pad having plurality of conductive members An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external circuitry and a second surface opposite the first surface. A plurality of co... | 05/13/2008 |
| 7368825 | Power semiconductor device The present invention is directed to a power semiconductor device in which a control circuit controls a power switching element, comprising: a semiconductor substrate having a front surface and a back surface; a capacitor disposed on the front surface side of the se... | 05/06/2008 |
| 7361993 | Terminal pad structures and methods of fabricating same Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The method... | 04/22/2008 |
| 7358602 | Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor substrate and has a projection which projects from the second surface;... | 04/15/2008 |
| 7358618 | Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s... | 04/15/2008 |
| 7348680 | Electronic device and use thereof The electronic device (100) comprises a semiconductor element (1) (e.g. a transistor), an encapsulation (5) and an electrically conductive layer (3) with a first and a second contact pad (11,12), used as signal pads, and a third co... | 03/25/2008 |
| 7345366 | Apparatus and method for testing component built in circuit board A multi-layered circuit board a built-in component including multiple terminals, at least one signal pad formed on a top surface of the multi-layered circuit board for signal transmission, each of the at least one signal pad corresponding to one of the multiple term... | 03/18/2008 |
| 7342302 | Semiconductor device and a method of manufacturing the same A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respecti... | 03/11/2008 |
| 7339282 | Topographically indexed support substrates The present invention provides an indexed support substrate. The support substrate comprises at least one set of indexing features that are distinguishable from one another and from the surrounding substrate. The support substrate also comprises a set of useful doma... | 03/04/2008 |
| 7327030 | Apparatus and method incorporating discrete passive components in an electronic package An apparatus and method for incorporating discrete passive components into an integrated circuit package. A metal layer is formed over a surface of a substrate. A layer of photosensitive material is then formed over the metal layer. Using standard photolithographic ... | 02/05/2008 |
| 7327031 | Semiconductor device and method of manufacturing the same There is provided a solution to the problem of the poor adhesion in the pad portion while inhibiting the dishing in the pad portion. An SiON film, which covers insulating areas and has an opening above Cu pad areas, is formed, and a barrier metal film is formed in t... | 02/05/2008 |
| 7326640 | Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads Disclosed is a method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surfaces of semiconductor chips with copper pads, where a thin film that provides the effect of self-passivation to prevent oxidization of th... | 02/05/2008 |
| 7323771 | Electronic circuit device An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a... | 01/29/2008 |
| 7323765 | Die attach paddle for mounting integrated circuit die An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surf... | 01/29/2008 |
| 7321172 | Selective plating of package terminals In one embodiment, a method including providing a semiconductor pad package having a first pad and a second pad is disclosed. A first layer comprising a first metal is deposited on the first pad using a first process. A second metal is then deposited on the first pa... | 01/22/2008 |
| 7319277 | Chip structure with redistribution traces A semiconductor chip or wafer comprises a passivation layer and a circuit line. The passivation layer comprises an inorganic layer. The circuit line is over and in touch with the inorganic layer of the passivation layer, wherein the circuit line comprises a first co... | 01/15/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7315072 | Semiconductor device capable of suppressing current concentration in pad and its manufacture method An interlayer insulating film is formed on a semiconductor substrate. An intra-layer insulating film is formed on the interlayer film. A recess is formed through the intra-layer film. The recess has a pad-part and a wiring-part continuous with the pad-part. The pad-... | 01/01/2008 |
| 7315085 | Ball grid array package and method thereof A ball grid array package includes a substrate, a chip, a plurality of pads, a solder mask, a plurality of partitioning walls, and a plurality of solder balls. The substrate has an upper surface and a lower surface opposite to the upper surface. The chip is disposed... | 01/01/2008 |
| 7312533 | Electronic component with flexible contacting pads and method for producing the electronic component An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-ela... | 12/25/2007 |
| 7307354 | Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer An integrated circuit (IC) carrier assembly includes a printed circuit board (PCB). A carrier is soldered to the PCB. The carrier includes a grid of electrical contact islands surrounding a receiving zone for receiving an IC. Pairs of adjacent islands are interconne... | 12/11/2007 |
| 7307337 | Resin-molded semiconductor device having posts with bumps and method for fabricating the same A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductiv... | 12/11/2007 |
| 7294923 | Metallization scheme including a low modulus structure The present invention provides a metallization scheme, a method for manufacturing the metallization scheme, and an integrated circuit including the metallization scheme. In one aspect, the metallization scheme (300) includes a protective layer (320) lo... | 11/13/2007 |
