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| Number | Title | Issue Date |
| 7443019 | Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads... | 10/28/2008 |
| 7385282 | Stacked-type chip package structure A stacked-type chip package structure including a substrate, a first chip, bonding wires, a second chip and B-stage conductive bumps is provided. The first chip is disposed on the substrate, and it has first bonding pads disposed on an active surface thereof. Beside... | 06/10/2008 |
| 7358616 | Semiconductor stacked die/wafer configuration and packaging and method thereof A reciprocal design symmetry allows stacked wafers or die on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die or wafer allows the stacked die to have a reciprocal orientation with... | 04/15/2008 |
| 7335985 | Method and system for electrically coupling a chip to chip package A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter ... | 02/26/2008 |
| 7335988 | Use of palladium in IC manufacturing with conductive polymer bump An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point, are provided. The pr... | 02/26/2008 |
| 7321133 | Heteroatomic regioregular poly(3-substitutedthiophenes) as thin film conductors in diodes which are not light emitting or photovoltaic Regio-regular polythiophenes used in diodes which are not light emitting or photovoltaic. High quality, processable thin film polymer films can be made. The thin film can have a thickness of about 50 nm to about one micron, and the conductive thin film can be applie... | 01/22/2008 |
| 7126228 | Apparatus for processing semiconductor devices in a singulated form Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are tem... | 10/24/2006 |
| 7078823 | Semiconductor die configured for use with interposer substrates having reinforced interconnect slots A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical attachment, as by wire bonding, to conductive traces on the opposite side of ... | 07/18/2006 |
| 6617697 | Assembly with connecting structure The invention describes an assembly provided with a component and a substrate (7). The component and the substrate (7) are electrically interconnected by means of connecting structures (6, 8). The first connecting structure (6) of the component comprises ... | 09/09/2003 |
| 6429382 | Electrical mounting structure having an elution preventive film For the reliability in insulation and against sulfurization, the mounting structure of the invention includes an electric structure, and an electrically conductive adhesive layer including an electrically conductive filler disposed on the electric structu... | 08/06/2002 |
| 6406746 | Microcapsulating conductive metal particles with polymerized monomers A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A dire... | 06/18/2002 |
| 6138348 | Method of forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 10/31/2000 |
| 6113728 | Process for connecting circuits and adhesive film used therefor An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards un... | 09/05/2000 |
| 5918364 | Method of forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 07/06/1999 |
| 5879761 | Method for forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 03/09/1999 |
| 5843251 | Process for connecting circuits and adhesive film used therefor An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards un... | 12/01/1998 |
| 5814180 | Low temperature method for mounting electrical components A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are def... | 09/29/1998 |
| 5714238 | Conductive adhesive and circuit using the same There is disclosed a conductive adhesive comprising (A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compo... | 02/03/1998 |
| 5611140 | Method of forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 03/18/1997 |
| 5612403 | Low temperature flexible die attach adhesive and articles using same Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.... | 03/18/1997 |
| 5604026 | Electrically conductive adhesives An electrically conductive adhesive is described that is made of a porous substrate having numerous passages extending through it. The walls of the substrate defining the passages are plated with a conductive metal. This provides a continuous plating from... | 02/18/1997 |
| 5600183 | Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate An integrated circuit chip bonding system comprising a multi-layer film adhesive for mounting an integrated circuit chip to a printed circuit substrate having a metallized grounding pad disposed thereon that is connected to a circuit ground of the integra... | 02/04/1997 |
| 5510649 | Ceramic semiconductor package having varying conductive bonds A semiconductor chip package is manufactured comprising a heatsink bonded to an aluminum nitride insulative layer by a thermally conductive and electrically nonconductive epoxy. The aluminum nitride insulative layer is bonded to several portions of a lead... | 04/23/1996 |
| 5475048 | Conductor-filled thermosetting resin Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach ... | 12/12/1995 |
| 5457149 | Reworkable adhesive for electronic applications Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.... | 10/10/1995 |
| 5403389 | Resinless pseudoplastic bonding compositions An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.... | 04/04/1995 |
| 5386000 | Low temperature flexible die attach adhesive and articles using same Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.... | 01/31/1995 |
| 5371178 | Rapidly curing adhesive and method Described is a rapidly curing adhesive formulation and a method of reducing the curing time of an adhesive formulation containing cyanate ester.... | 12/06/1994 |
| 5306333 | Resinless pseudoplastic bonding compositions An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.... | 04/26/1994 |
| 5261156 | Method of electrically connecting an integrated circuit to an electric device An integrated circuit is mounted on and electrically connected to an electric device with an adhesive therebetween. The adhesive comprises a photo-curable resin and a heat-curable resin. After mounted on the electric device, the integrated circuit is temp... | 11/16/1993 |
| 5258577 | Die mounting with uniaxial conductive adhesive An electronic device is made by a method of connecting a circuit member to a substrate. The circuit member is of the type having a discontinuous passivating layer thereon with recesses therein establishing electrical contacts. The circuit member is connec... | 11/02/1993 |
| 5237130 | Flip chip technology using electrically conductive polymers and dielectrics A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on t... | 08/17/1993 |
| 5204399 | Thermoplastic film die attach adhesives This is a thermally conductive adhesive having excellent die shear strength, in film form, and having a weight average molecular weight of about 100,000 to 150,000, prepared from a mixture of a dietherdianhydride, a meta-substituted benzenediamine, a poly... | 04/20/1993 |
| 5196371 | Flip chip bonding method using electrically conductive polymer bumps A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. A first organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads... | 03/23/1993 |
| 5170930 | Liquid metal paste for thermal and electrical connections A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the t... | 12/15/1992 |
| 5164119 | Silver-glass pastes An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the sil... | 11/17/1992 |
| 5158818 | Conductive die attach tape A conductive die attach tape is described which allows for mounting of diced semiconductor chips thereon, followed by removal of the chip with an adherent conductive adhesive, and the mounting of the chip/adhesive combination in a chip carrier preparatory... | 10/27/1992 |
| 5155066 | Rapid-curing adhesive formulation for semiconductor devices A rapid curing adhesive formulation that contains 10-40 wt. % of a cyanate ester vehicle having a cyanate ester, alkylphenol and a metal curing catalyst and 60-90 wt. % of thermally and/or electrically conductive filler. The adhesive formulation has a max... | 10/13/1992 |
| 5150195 | Rapid-curing adhesive formulation for semiconductor devices A rapid curing adhesive formulation that contains 10-40 wt. % of a cyanate ester vehicle having a cyanate ester, alkylphenol and a metal curing catalyst and 60-90 wt. % of thermally and/or electrically conductive filler. The adhesive formulation has a max... | 09/22/1992 |
| 5136365 | Anisotropic conductive adhesive and encapsulant material An adhesive material 220 including a fluxing agent and metal particles 240 is applied to either a substrate 200 having a metallization pattern 210 or an electrical component 230. The component 230 is positioned on the substrate 210 and heated. During the ... | 08/04/1992 |
