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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Number | Title | Issue Date |
| 7423336 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor devic... | 09/09/2008 |
| 7378721 | Chip on lead frame for small package speed sensor A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical compone... | 05/27/2008 |
| 7365414 | Component packaging apparatus, systems, and methods Dielectric materials comprising release agents are described. Also described are a process for improving the proccessability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved s... | 04/29/2008 |
| 7352061 | Flexible core for enhancement of package interconnect reliability An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In... | 04/01/2008 |
| 7335978 | Semiconductor component having stiffener, circuit decal and terminal contacts A semiconductor component includes a stiffener, a circuit decal attached to the stiffener, and a semiconductor die attached to the stiffener. The circuit decal includes conductors which function as an internal signal transmission system for the component, and a mask... | 02/26/2008 |
| 7291912 | Circuit board The present invention provides a circuit board which prevents an adverse effect to be caused on electronic components by flux or the like that is produced at the time of soldering. According to this invention, land patterns 6 and 7 for connecting a fla... | 11/06/2007 |
| 7253502 | Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer ove... | 08/07/2007 |
| 7242086 | Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at... | 07/10/2007 |
| 7230279 | Memory card A memory card is provided. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer c... | 06/12/2007 |
| 7224046 | Multilayer wiring board incorporating carbon fibers and glass fibers A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin compo... | 05/29/2007 |
| 7196426 | Multilayered substrate for semiconductor device A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connect... | 03/27/2007 |
| 7125809 | Method and material for removing etch residue from high aspect ratio contact surfaces Contact openings in semiconductor substrates are formed through insulative layers using an etchant material. The etchant typically leaves behind a layer of etch residue which interferes with the subsequent deposition of conductive material in the opening, as well as... | 10/24/2006 |
| 6660811 | Epoxy resin composition and curing product thereof An epoxy resin composition comprising: (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 150° C. and having two or more repeating units each comprising: a methylene bond substituted by at least an aromatic ring; and a benzene ring su... | 12/09/2003 |
| 6657295 | Multilayer interconnect board and multilayer semiconductor device A multilayer interconnect board comprised of a plurality of stacked cloth-reinforced resin layers with at least one layer of interconnect patterns formed at a stacking interface of the resin layers, wherein either an interconnect pattern is formed at a st... | 12/02/2003 |
| 6652805 | Highly filled composites of powdered fillers and polymer matrix Highly filled composite materials, e.g. comprising approximately 60 volume % or greater of finely powdered particles of filler in a polymer matrix, are made by dissolving polymer in a volatilisable solvent, adding filler and forming a homogeneous mixture ... | 11/25/2003 |
| 6646350 | Semiconductor device In order to realize a semiconductor device and a manufacturing method thereof which can keep with a high reliability an electric connection between each of bump pads formed on LSI chips and each of electrode pads formed on an interconnection substrate, wi... | 11/11/2003 |
| 6625037 | Printed circuit board and method manufacturing the same A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal... | 09/23/2003 |
| 6621011 | Electronic chip component An electronic chip component includes a package provided with external electrodes having excellent heat resistance and adhesion. In the electronic chip component, a package includes heat-resistant resin molding, and the external electrodes are provided on... | 09/16/2003 |
| 6566288 | Electrically insulating non-woven fabric, a prepreg and a laminate A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4'-diphenylether-terephthalamide fibers and (b) poly-p-phenylene... | 05/20/2003 |
| 6548152 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and bec... | 04/15/2003 |
| 6515047 | Composition of epoxy resin and triazine-formaldehyde-phenol resin An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1)... | 02/04/2003 |
| 6488198 | Wire bonding method and apparatus A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is sup... | 12/03/2002 |
| 6434017 | Semiconductor device and electronic apparatus A semiconductor device in a chip size package form having a high durability and reliability and realizing a small size with high density, and an electronic apparatus mounting the same, connected to a motherboard by soldering, comprising a semiconductor ch... | 08/13/2002 |
| 6432539 | Phosphorus-containing polymer having phenolic units and uses thereof A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohyd... | 08/13/2002 |
| 6426310 | Electrically insulating non-woven fabric, a prepreg and a laminate A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4'-diphenylether-terephthalamide fibers and (b) poly-p-phenylene... | 07/30/2002 |
| 6426371 | Sol materials The invention provides a fast-cured sol material, which is produced by hydrolysis and condensation of the following starting materials: 2-60 parts by weight of a silicon alkoxide; 20-98 parts by weight of an alcohol; 0.5-50 parts by weight of an aqueous m... | 07/30/2002 |
| 6395998 | Electronic package having an adhesive retaining cavity An electronic package and method of making the electronic package is provided. An opening in a thermally conductive member of the electronic package is formed to substantially prevent adhesive which can bleed from under a substrate mounted and secured on ... | 05/28/2002 |
| 6387205 | Dustfree prepreg and method for making an article based thereon A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/so... | 05/14/2002 |
| 6358351 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and bec... | 03/19/2002 |
| 6355131 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and bec... | 03/12/2002 |
| 6338767 | Circuit component built-in module and method for producing the same A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal... | 01/15/2002 |
| 6329474 | Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formald... | 12/11/2001 |
| 6326544 | Polymer based circuit A polymer based circuit production method provides a polymer based circuit by exposing a surface of a polymer substrate to ultraviolet radiation resulting in an adhesion promoted polymer substrate surface. A circuit is fabricated on the polymer substrate ... | 12/04/2001 |
| 6323436 | High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer Disclosed is a printed circuit board, and a method of preparing a printed circuit board, which possesses a coefficient of thermal expansion substantially similar to that of silicon for use in direct semiconductor chip attach structures and similar solder ... | 11/27/2001 |
| 6313411 | Wafer level contact sheet and method of assembly The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), an... | 11/06/2001 |
| 6265768 | Chip scale package A chip scale package mainly comprises a semiconductor chip disposed on an upper surface of a substrate and sealed by a package body. The package body comprises a resin base material divided into a first region and a second region. The resin base material ... | 07/24/2001 |
| 6259037 | Polytetrafluoroethylene thin film chip carrier The present invention provides an organic chip carrier particularly useful with flip chips. The chip carrier comprises an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed ove... | 07/10/2001 |
| 6248959 | Substrate with die area having same CTE as IC A package for mounting an integrated circuit chip includes a body having at least a first region, the size of the integrated circuit chip, and a second region. The first region has a first coefficient of thermal expansion (CTE), and the second region has ... | 06/19/2001 |
| 6228470 | Composite substrate for electronic components A substrate having enhanced mechanical rigidity and including high stiffness reinforcing layers, a conductive layer and non-cloth dielectric layers wherein the non-cloth dielectric layers have a modulus of elasticity which is less than the modulus of elas... | 05/08/2001 |
| 6214455 | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic... | 04/10/2001 |
