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| Number | Title | Issue Date |
| 7443013 | Flexible substrate for package of die The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active surface. The flexible substrate includes a flexible insulating film and a p... | 10/28/2008 |
| 7427532 | Method of manufacturing a device having a contacting structure According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component. ... | 09/23/2008 |
| 7411295 | Circuit board, device mounting structure, device mounting method, and electronic apparatus A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is elec... | 08/12/2008 |
| 7400032 | Module assembly for stacked BGA packages Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrange... | 07/15/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
| 7391122 | Techniques for flip chip package migration Techniques for integrated circuit packaging in a flip chip configuration that ensures a migration path between related integrated circuits and utilizes core I/O (or area I/O) are provided. An integrated circuit, having a superset of functional circuit elements as co... | 06/24/2008 |
| 7391104 | Non-stick detection method and mechanism for array molded laminate packages An integrated circuit packaging device includes a laminate substrate. A first surface of the substrate can be mounted on an integrated circuit and the second surface can be mounted on a surface of a printed circuit board. The device can also include an array of lead... | 06/24/2008 |
| 7375422 | Stacked-type semiconductor package Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tap... | 05/20/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7339259 | Semiconductor device A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and ... | 03/04/2008 |
| 7327032 | Semiconductor package accomplishing fan-out structure through wire bonding Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can ... | 02/05/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 12/11/2007 |
| 7279779 | Substrate assembly for stressed systems A substrate-assembly having a mechanical stress absorption system. The assembly includes two substrates, one of which has a mechanical stress absorbing system, such as a plurality of motifs that absorb thermoelastic stresses, to prevent cracking or destruction of th... | 10/09/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7253504 | Integrated circuit package and method An integrated circuit package includes a substrate having a central axis dividing the substrate into an upper half and a lower half and an integrated circuit coupled to the substrate. A layer is provided within the substrate in the lower half thereof that is configu... | 08/07/2007 |
| 7253514 | Self-supporting connecting element for a semiconductor chip A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for c... | 08/07/2007 |
| 7247932 | Chip package with capacitor A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window ... | 07/24/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7235871 | Stacked microelectronic dies An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device adjacent to a support member having support member circuitry, with the fi... | 06/26/2007 |
| 7230328 | Semiconductor package and laminated semiconductor package A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by t... | 06/12/2007 |
| 7224062 | Chip package with embedded panel-shaped component A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip i... | 05/29/2007 |
| 7218001 | Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one particular example, a microelectronic component package includes a substrat... | 05/15/2007 |
| 7217991 | Fan-in leadframe semiconductor package A semiconductor package comprising a plurality of elongate leads which each have opposed inner and outer ends, opposed first and second surfaces, and a third surface which is disposed in opposed relation to the first surface and recessed relative to the second surfa... | 05/15/2007 |
| 7205658 | Singulation method used in leadless packaging process A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of t... | 04/17/2007 |
| 7180170 | Lead-free integrated circuit package structure An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive mate... | 02/20/2007 |
| 7157794 | Semiconductor device that suppresses variations in high frequency characteristics of circuit elements A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first area formed with a high-frequency circuit element and a second area located around the first area and formed with a low-frequency circuit element. The... | 01/02/2007 |
| 7138708 | Electronic system for fixing power and signal semiconductor chips An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes. ... | 11/21/2006 |
| 7132315 | Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as ... | 11/07/2006 |
| 7098528 | Embedded redistribution interposer for footprint compatible chip package conversion An embedded redistribution interposer is disclosed for providing footprint compatible chip package migration in which a die designed to be mounted into chip package is originally implemented using a first type of silicon platform and is subsequently redesigned for a... | 08/29/2006 |
| 6704609 | Multi-chip semiconductor module and manufacturing process thereof A multi-chip semiconductor module includes first and second substrates. The first substrate has opposite first and second surfaces, a plurality of first conductive vias that extend through the first and second surfaces, and a first circuit layout patterne... | 03/09/2004 |
| 6697261 | Multileveled printed circuit board unit including substrate interposed between stacked bumps Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bum... | 02/24/2004 |
| 6696753 | Enhancement of wire bondability in semiconductor device package A semiconductor device package includes a semiconductor device, a resin casing, a plurality of leads, and a plurality of bonding wires. The semiconductor device includes a plurality of bonding pads. The resin casing has a device-mounting surface. The devi... | 02/24/2004 |
| 6693029 | Method of forming an insulative substrate having conductive filled vias A method for manufacturing a substrate, including adhering an adhesive layer to an organic insulation substrate to form a first part; forming a via hole in the first part such that the via hole penetrates the first part; forming a conductive metal film so... | 02/17/2004 |
| 6691406 | Methods of die attachment for BOC and F/C surface mount Methods for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The protrusions are configured to form barriers to hold an ad... | 02/17/2004 |
| 6687985 | Method of Manufacturing a multi-layer circuit board A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having ... | 02/10/2004 |
| 6690086 | Apparatus and method for reducing interposer compression during molding process A method for inhibiting damage caused to semiconductor die packages during a molding process, and the semiconductor die packages formed therefrom, is described. One or more openings are provided in a die carrier which are filled with a material which is m... | 02/10/2004 |
| 6682957 | Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof A land grid array (LGA) type semiconductor chip package includes an insulation body having a plurality of first conductive interconnections embedded therein. A cavity is formed in an upper portion of the insulation body. A plurality of first conductive in... | 01/27/2004 |
| 6683663 | Web fabrication of devices Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate.... | 01/27/2004 |
| 6683795 | Shield cap and semiconductor package including shield cap A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semicond... | 01/27/2004 |
