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| Number | Title | Issue Date |
| 7439083 | Technique for compensating for substrate shrinkage during manufacture of an electronic assembly Substrate shrinkage that occurs during manufacture of an electronic assembly is compensated for by the incorporation of a horizontal line, having a plurality of vertical graduations, across a horizontal portion of a substrate and a vertical line, having a plurality ... | 10/21/2008 |
| 7427764 | Laser crystallization apparatus and laser crystallization method A laser crystallization apparatus which capable of correcting both shift in imaging position caused by thermal lens effect of the imaging optical system and shift due to flatness of the substrate comprises an crystallization optical system which irradiates laser lig... | 09/23/2008 |
| 7413914 | Method and apparatus for manufacturing semiconductor device, method and apparatus for controlling the same, and method and apparatus for simulating manufacturing process of semiconductor device A process of manufacturing a semiconductor device utilizing a thermo-chemical reaction is started based on preset initial settings, a state function of an atmosphere associated with the thermo-chemical reaction is measured, a state of the atmosphere and a change the... | 08/19/2008 |
| 7405089 | Method and apparatus for measuring a surface profile of a sample In order to measure a surface profile of a sample, an imprint of the surface profile to be examined is produced in a transfer material. The sample contains processed semiconductor material and is in particular a patterned semiconductor wafer or part of a patterned s... | 07/29/2008 |
| 7402444 | Method and apparatus for manufacturing a semiconductor device A method of manufacturing a semiconductor device using a wafer emissivity calculated from a wafer reflectivity to calculate a wafer temperature and to calculate target values for heat source optical intensities provided to a plurality of heat sources which heat the ... | 07/22/2008 |
| 7381576 | Method and apparatus for monitoring precision of water placement alignment A method for monitoring precision of placement of semiconductor wafers in a semiconductor processing apparatus includes measuring thickness of an insulating film on a surface of a semiconductor substrate before etching a portion of the insulating film from the surfa... | 06/03/2008 |
| 7368302 | Dynamic metal fill for correcting non-planar region Methods and a system are disclosed for correcting a non-planar region during fabrication of a semiconductor product on a wafer. The invention separates an exposure of at least a portion of a fill pattern on a resist from a product exposure so that the fill pattern c... | 05/06/2008 |
| 7364923 | Dressed qubits A quantum computing method comprising constructing a dressing transformation V between a physical Hamiltonian H and an ideal Hamiltonian HID. The physical Hamiltonian H describes a physical quantum computer that comprises a plurality of qubits, including ... | 04/29/2008 |
| 7355200 | Ion-sensitive field effect transistor and method for producing an ion-sensitive field effect transistor An ion-sensitive field effect transistor has a gate consisting of metal silicate. The gate of metal silicate provides high resistance to aggressive measured substances and further has a high long-term stability. The gate of the ion-sensitive field effect transistor ... | 04/08/2008 |
| 7345306 | Corona based charge voltage measurement A method of measuring electrical characteristics of a gate dielectric. The gate dielectric is local annealed by directing a highly localized energy source at the measurement area, such that the measurement area is brought to an annealing temperature while surroundin... | 03/18/2008 |
| 7335518 | Method for manufacturing semiconductor device In a manufacturing method for a semiconductor device, a main body wafer is formed, and a monitor wafer on which a monitor element is formed is provided. Characteristics of the main body wafer are copied onto the monitor element by simultaneously processing the main ... | 02/26/2008 |
| 7335969 | Method of monitoring introduction of interfacial species A method for monitoring a nitridation process, including: (a) providing a semiconductor substrate; (b) forming a first dielectric layer on a top surface of the substrate; (c) introducing a quantity of interfacial species into the substrate; (d) removing the first di... | 02/26/2008 |
| 7329549 | Monitoring method of processing state and processing unit The present invention is a monitoring method of monitoring a change of a processing state of an object to be processed when a predetermined process is conducted to the object to be processed by using a processing unit. The method includes: a step of respectively set... | 02/12/2008 |
| 7320895 | Thyristor-based device having dual control ports Switching operations, such as those used in memory devices, are enhanced using a thyristor-based semiconductor device adapted to switch between a blocking state and a conducting state. According to an example embodiment of the present invention, a thyristor-based se... | 01/22/2008 |
| 7294590 | System and method for removing charges with enhanced efficiency Method and apparatus for removing and neutralizing charges. The method includes loading a structure into a chamber. The structure includes a first surface and a plurality of charges away from the first surface. Additionally, the method includes supplying a first ion... | 11/13/2007 |
| 7273761 | Box-in-box field-to-field alignment structure A lithographic pattern includes a first scribe along an edge of a die region, and a second scribe along an opposing edge of the die region. The first scribe includes at least a first translucent box and a second translucent box. The second scribe includes at least a... | 09/25/2007 |
| 7265382 | Method and apparatus employing integrated metrology for improved dielectric etch efficiency A method and apparatus for processing a semiconductor wafer is provided for reducing dimensional variation by feeding forward information relating to photoresist mask CD and profile and underlying layer thickness measured at several points on the wafer to adjust the... | 09/04/2007 |
| 7250312 | Doping method and method for fabricating thin film transistor It is an object of the present invention to provide a doping apparatus, a doping method, and a method for fabricating a thin film transistor that can carry out doping to the carrier concentration which is optimum for obtaining the desired electric characteristic non... | 07/31/2007 |
| 7241633 | Heat treatment apparatus and heat treatment method A reference value, which defines electric power to be supplied to a heating element, is generated. Deviation ΔT of temperature T1 measured by a radiation thermometer from target temperature T0 defined by a target temperature rising curve is determined... | 07/10/2007 |
| 7208328 | Method and system for analyzing defects of an integrated circuit wafer Method and apparatus for efficiently analyzing visual defects of an integrated circuit wafer in the manufacturing process thereof by utilizing an asymmetric visual defect review methodology that can effectively extract high yield-killing defects out of numerous repo... | 04/24/2007 |
| 7141442 | Method for manufacturing a light emitting device A method for manufacturing an LED device includes the steps of mounting an LED on a substrate, sealing the LED with a transparent resin including phosphor particles to form an LED device before being dyed, measuring chromaticity of light from the LED device before b... | 11/28/2006 |
| 7101725 | Solution to thermal budget A method of fabricating on optical detector, the method including providing a substrate that includes an optical waveguide formed therein and having a surface for fabricating microelectronic circuitry thereon; fabricating microelectronic circuitry on the substrate, ... | 09/05/2006 |
| 7094615 | Method of controlling probe tip sanding in semiconductor device testing equipment In a method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment, resistance values of pads of a probed chip are measured and stored. If a maximum resistance value among the stored resistance values is greater than a contact r... | 08/22/2006 |
| 6303396 | Substrate removal as a function of resistance at the back side of a semiconductor device A resistance monitoring approach is used for removing substrate from a back side of a semiconductor device. According to an example embodiment of the present invention, substrate is removed from a semiconductor device having a circuit side opposite the ba... | 10/16/2001 |
| 5698989 | Film sheet resistance measurement Apparatus and methods for measuring the sheet resistance of an electrically conductive film on a semiconductor substrate while maintaining the substrate within the vacuum environment of the semiconductor process apparatus. In one aspect of the invention, ... | 12/16/1997 |
